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[Official] Delidded Club / Guide - Page 1533

post #15321 of 33788
Quote:
Originally Posted by Qlix View Post



This is my first delid. Pentium 4 lga775. Pretty sure it was soldered on. This was ridiculously easier than I thought... Minus the solder part. It took quite a lot of pressure to get the ihs off. I assume an ivy would be infinitely easier once cut through the silicone

Yes after you cut through the silicone it just pops off. Good job! You should have no problem delidding your 3770k
post #15322 of 33788
So i finally did mine. I used the Vice + Hammer Method.
I am using NT-H1 in the Die right now and getting ~ 15C drop.
I used to get upwards 93C+ and now i am getting 80C in the hottest core.
I have already ordered CLP and it comming and dont know what to expect.
What are the cons for using it? Also should ~ how much more will the temps drop?

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Ishimura
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post #15323 of 33788
Quote:
Originally Posted by ZealotKi11er View Post

So i finally did mine. I used the Vice + Hammer Method.
I am using NT-H1 in the Die right now and getting ~ 15C drop.
I used to get upwards 93C+ and now i am getting 80C in the hottest core.
I have already ordered CLP and it comming and dont know what to expect.
What are the cons for using it? Also should ~ how much more will the temps drop?


CLP can be a lot harder to spread and get off than CLU. Can I ask why you chose it over CLU? Anyway you would be able to switch before they ship it? Also, if you are using either on a copper heatsink, over time it will bond and almost create a weld between the top of the IHS and the heatsink. That is why I only use it on the die, but some people like that "weld" effect because that is what they want in a liquid metal. Also you should expect about an extra 10c-15c drop if applied correctly.

EDIT: BTW I forgot to say good job thumb.gifbiggrin.gif
Edited by RavageTheEarth - 3/30/13 at 9:22pm
post #15324 of 33788
I have a 775 board to test this p4 in. Do I have to figure out how to get the solder off or can I just throw it in and power it up real quick?
post #15325 of 33788
Quote:
Originally Posted by Qlix View Post

I have a 775 board to test this p4 in. Do I have to figure out how to get the solder off or can I just throw it in and power it up real quick?

I *think* that you can just pop it in because the solder will still transfer heat (not as good as before) because it will be touching.
post #15326 of 33788
I just scraped off as much as I could with my fingernail. It's pretty damn smooth. Ill try it out here in a bit with some AS Ceramique (only thing I have -.-)
post #15327 of 33788
Quote:
Originally Posted by Qlix View Post

I just scraped off as much as I could with my fingernail. It's pretty damn smooth. Ill try it out here in a bit with some AS Ceramique (only thing I have -.-)

Yea you will be fine man. Just put a small drop of the TIM on it. Less is always better.
post #15328 of 33788
Quote:
Originally Posted by RavageTheEarth View Post

CLP can be a lot harder to spread and get off than CLU. Can I ask why you chose it over CLU? Anyway you would be able to switch before they ship it? Also, if you are using either on a copper heatsink, over time it will bond and almost create a weld between the top of the IHS and the heatsink. That is why I only use it on the die, but some people like that "weld" effect because that is what they want in a liquid metal. Also you should expect about an extra 10c-15c drop if applied correctly.

EDIT: BTW I forgot to say good job thumb.gifbiggrin.gif
I dont know where i read but some where saying Pro was better for die. Also will still use normal past on the CPU top.
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Ishimura
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post #15329 of 33788
Quote:
Originally Posted by RavageTheEarth View Post

CLP can be a lot harder to spread and get off than CLU. Can I ask why you chose it over CLU? Anyway you would be able to switch before they ship it? Also, if you are using either on a copper heatsink, over time it will bond and almost create a weld between the top of the IHS and the heatsink. That is why I only use it on the die, but some people like that "weld" effect because that is what they want in a liquid metal. Also you should expect about an extra 10c-15c drop if applied correctly.

EDIT: BTW I forgot to say good job thumb.gifbiggrin.gif

if you ever switch out cpus, do you need to redo the CLU paste on the die?

does it form a "poor mans" adhesive?
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Silent But Deadly
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post #15330 of 33788
Quote:
Originally Posted by ZealotKi11er View Post

I dont know where i read but some where saying Pro was better for die. Also will still use normal past on the CPU top.

Yea then you should be fine. Temps are the same between CLU and CLP. You will just have a tougher time getting the CLP to spread, but it eventually will and you will be very happy thumb.gif
Edited by RavageTheEarth - 3/30/13 at 9:52pm
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