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[Official] Delidded Club / Guide - Page 1596

post #15951 of 33688
Quote:
Originally Posted by Hokies83 View Post

Not made for that.

It is made to compete with the MVF ..

Which not only does it beat the MVF on price it beats it on features and has a PLX chip which Asus cheaped out on and did not even put it on there " Gamer Board "

A gamer is not worried about Hwbot i am a gamer... I do not bench i do not care about it..
The G1 has features like shutting down all your connections and focuses all your bandwidth to the game your playing..
Has features to hear " foot steps" while gaming etc.

But will also push a 3770k 5ghz + and run sli / xfire at x8x16x8 or x8x8x8x8 or 16x16..
Only the MVE will do that.. but it lacts the gaming features wink.gif nasty Realtek Audio *Puke*


LoL But at the end of the day this fact still remains...

Gigabyte is the number 1 selling mother board company in the world Asus is number 2 tongue.gif

I know, gigabyte was my fav. boards for x58 for sure, & I still get a gigabyte board for every socket (no x79 GB though).
I do prefer Asus for memory overclocking.

I like MSI boards too, after using the z77 ud3h for a while I would take the mpower over it any day.
    
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post #15952 of 33688
Quote:
Originally Posted by shamanik1320 View Post

Yeah, you're probably right, have you tried applying it to a lapped surface though? That was tough. I probably should've used a q-tip for the dye. I'm gonna let it go though for awhile and someday I'll crack it open again and see how it looks. I'm just too afraid to take it apart that it's all together lol. When I was switching my 3770 to the 3770k I accidently bent some cpu pins on my Asus Sabertooth Z77 due to my old Cooler Master 212 EVO +'s bracket system, thus having to buy a second $230 motherboard. So I am not going to feel like opening it again for some time. ^^

But I was wondering, does the consistency change at all after being used for a long period of time?

I too used way too much CLU (only mine was CLP) my first time around. And after two months, mine was still just as wet looking as the first day I put it on.

Here's how we've come to think about it. Consider about how much CLU you would think is needed to cover the die, use about 1/4 of that amount, and you have the right amount of TIM.
post #15953 of 33688
Quote:
Originally Posted by FtW 420 View Post

I know, gigabyte was my fav. boards for x58 for sure, & I still get a gigabyte board for every socket (no x79 GB though).
I do prefer Asus for memory overclocking.

I like MSI boards too, after using the z77 ud3h for a while I would take the mpower over it any day.

LoL well the UD3h is quite a ways down the pecking order now

1 Up7

2 G1 sniper 3 / UP5

3 Up4

4 UP3

5 UD5H

6 UD3H
    
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post #15954 of 33688
Before delidding I was running 4.8@1.336 hitting 78-97-96-80 in IBT 10 pass using a custom loop, I wasn't too amused with the temperatures especially with my setup but after testing and remounting numerous times checking the imprint on ihs and cpu block, good consistent cover every time and the same consistency applied the temperatures in each test. Not being happy and knowing the IB run hot I at least thought my loop should have been doing a better job so I dismantled the loop and inspecting the cpu block for blockages. My main focus was this block because the gpu temps were fine and there was no air trapped in the loop, anyway nothing wrong with block.

Loop reassembled, trapped air removed and all temperatures were once again the same as previous so I decided to delid using mx4 on both die and ihs which gave temperatures of 72-90-90-75. Not impressed with the drops thinking something is a miss here, time to reapply paste again which gave pretty much the same results so I lapped the ihs and using a micrometer to measure the change in thickness once the surface became flat and concave center was no more. The before thickness was 2.42mm, after was 2.16mm which is a large difference in my opinion which surprised me. Thermal compound reapplied and not expecting miracles since seeing others who have lapped results but it was worth a shot I began testing, results were 72-87-87-73.

After these not so impressive results I managed to get hold of some Gelid extreme, so I applied it to both die and ihs. Again not expecting much since I have used mx4 and gc extreme before finding the performance the same, however the results shocked me, 62-71-70-61. Not only did the difference between the lowest and highest core decrease to a more anticipated value of 10 instead of 19 before delid and 15 after delid and lapping, the temperatures across all cores dropped further more.

To summarise delid findings,

before 78-97-96-80, temp difference 19deg, avg 87.75deg *mx4 ihs
after 72-90-90-75, temp difference 18deg, avg 81.75deg *mx4 die and ihs
lapped 72-87-87-73, temp difference 15deg, avg 79.75deg *mx4 die and ihs
gc ext 62-71-70-61, temp difference 10deg, avg 66.00deg *gc extreme die and ihs

26deg drop on the hottest core and 21.75deg avg across all core drop, now I am happy. I did contemplate CLU/P but never managed to source any.

As you can see, gelid came out far superior this time which has shocked me how bad mx4 was for this particular application considering all previous experience with both compounds the difference has been negligible.

With the drop in max temperatures I tried a further overclock but the voltage increase to get 8-12hr prime blend stable was too large at 1.464, however I could pass IBT with 1.408 but failed with encoding so the 100mhz gain is not worth the voltage increase.
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post #15955 of 33688
Quote:
Originally Posted by shamanik1320 View Post


Welcome to the forum man! I'm sure Valgaur will add you anyways if you want. Just try filling out the info from the first page in the thread the best that you can and post it. Also, I think you applied too much CLU. All you need to do is push the syringe so it is just below the tip and then stick the brush in the tip to coat it and that might be enough for the die and the bottom of the IHS. The stuff preads like wildfire.
post #15956 of 33688
Quote:
Originally Posted by nemm View Post

Before delidding I was running 4.8@1.336 hitting 78-97-96-80 in IBT 10 pass using a custom loop, I wasn't too amused with the temperatures especially with my setup but after testing and remounting numerous times checking the imprint on ihs and cpu block, good consistent cover every time and the same consistency applied the temperatures in each test. Not being happy and knowing the IB run hot I at least thought my loop should have been doing a better job so I dismantled the loop and inspecting the cpu block for blockages. My main focus was this block because the gpu temps were fine and there was no air trapped in the loop, anyway nothing wrong with block.

Loop reassembled, trapped air removed and all temperatures were once again the same as previous so I decided to delid using mx4 on both die and ihs which gave temperatures of 72-90-90-75. Not impressed with the drops thinking something is a miss here, time to reapply paste again which gave pretty much the same results so I lapped the ihs and using a micrometer to measure the change in thickness once the surface became flat and concave center was no more. The before thickness was 2.42mm, after was 2.16mm which is a large difference in my opinion which surprised me. Thermal compound reapplied and not expecting miracles since seeing others who have lapped results but it was worth a shot I began testing, results were 72-87-87-73.

After these not so impressive results I managed to get hold of some Gelid extreme, so I applied it to both die and ihs. Again not expecting much since I have used mx4 and gc extreme before finding the performance the same, however the results shocked me, 62-71-70-61. Not only did the difference between the lowest and highest core decrease to a more anticipated value of 10 instead of 19 before delid and 15 after delid and lapping, the temperatures across all cores dropped further more.

To summarise delid findings,

before 78-97-96-80, temp difference 19deg, avg 87.75deg *mx4 ihs
after 72-90-90-75, temp difference 18deg, avg 81.75deg *mx4 die and ihs
lapped 72-87-87-73, temp difference 15deg, avg 79.75deg *mx4 die and ihs
gc ext 62-71-70-61, temp difference 10deg, avg 66.00deg *gc extreme die and ihs

26deg drop on the hottest core and 21.75deg avg across all core drop, now I am happy. I did contemplate CLU/P but never managed to source any.

As you can see, gelid came out far superior this time which has shocked me how bad mx4 was for this particular application considering all previous experience with both compounds the difference has been negligible.

With the drop in max temperatures I tried a further overclock but the voltage increase to get 8-12hr prime blend stable was too large at 1.464, however I could pass IBT with 1.408 but failed with encoding so the 100mhz gain is not worth the voltage increase.

Good post, glad to see such positive results.
post #15957 of 33688
Thread Starter 
Quote:
Originally Posted by Jayjr1105 View Post


OCN name: Jayjr1105
CPU: 3770K
On-die TIM: Coollaboratory Liquid Pro
IHS TIM: Coolermaster HTK-002
Mhz gained: none yet
OC after delid: 4.4
Temp drops: 19c max 9c min.

Before de-lid:
Intel Burn Test 10 passes on high
Max Core Temps: 64,70,70,69
Prime 95 30 minutes on blend
Max Core Temps: 67,72,73,73

After de-lid:
Intel Burn Test 10 passes on high
Max Core Temps: 52,59,62,60
Prime 95 30 minutes on blend
Max Core Temps: 48,53,56,54

You're In! thumb.gif Trow a new sig on man! Show it off! tongue.gif
Quote:
Originally Posted by shamanik1320 View Post

Hello all I wanted to say I also have joined the delidded club unofficially, and learned a lot of interesting stuff on the way. I don't have the proof I did it unfortunately, since I didn't have my name in the photo I shot, but I'll post it as it helps describe the process I went through and what I encountered. I also have a video of my finale PC build (completed, except I can still get two more gpu's (I have only one right now), but besides that, I have 16 fans (minus the power supplies, so 17, but I don't count it since it doesn't connect to inside of case, and my delidded 3770k using Coollabs Liquid Ultra inside and between the heatspreader and my Corsair H100i closed loop cooler. I purchased a lapping kit from frozencpu.com or some site and it was a lot of sandpaper for polishing the cpu really well, I polished the inside and the outside of the heatspreader, as you can see the copper circle inside the heatspreader here, surrounding the Liquid Ultra metal paste. Now this part went swimmingly, it covered and adhered great on the glue covered cpu dye.

My PC
21.jpg 908k .jpg file
This picture is my property, do not reproduce or alter without permission.


My delidded i7-3770k
20.jpg 1116k .jpg file
This picture is my property, do not reproduce or alter without permission.


Now the next part, isn't a problem, I mean my system has been stable for like a month since I delidded.and shows no signs of problems and I've been running prime95 and intel burn test successfully at 4.7 Ghz (however IBT makes things so hot I think every now and then my cpu was throttling down.) but I know it was a success. Here's what I encountered though, the lapped surface of my heatspreader on top of my 3770k when I applied the liquid ultra, I found the extra well polished surface I made made the Liquid Ultra not want to adhere real well, it seemed to roll right over the surface almost like metal water and not actually bond, Now I slowly applied the stuff and rolled it over and over everything really slowly and covered it pretty much perfect and not a drop getting on the PCB, Then I attached the waterblock and that was over a month ago. Now, whenever I do my favorite test, which is run Real Temp's Load Tester for testing your cpu and I run MSI Afterburner's Kombustor at the same time, after hours, my cpu with a +.2 volt offset value @ 4.7 Ghz, I don't see any core go past 85-90 degrees.

Here are my system specs and I have youtube videos of my setup if you want to see my channel it's shamanik1320.

Corsair 400r case
Corsair H100i closed loop radiator and waterblock w/ SP 120 performance edition in pull and fans it came with in push, on a Delidded i7-3770k w/ Coollabs Liquid Ultra as only used thermal paste in both sides of heatspreader. Lapped heatspreader on both sides as well.
8 Gb 1866 mhz DDR3 G. Skill Ares Ram
MSI Geforce 680 GTX twin frozr iii w/ 4 GB vram
Asus Sabertooth Z77 Motherboard
Thermaltake 850 watt PSU

I use this system to make gaming videos on youtube. I like games like Tom Clancy's Ghost Recon: Future Soldier, Battlefield 3, Crysis 3, stuff like that. I also play fps games and most games in general only with a Razer Hydra Motion Controller. It's like a wiimote but a lot better. I gamed with mouse and keyboard for 15 years or so, I haven't had a reason to game with mouse and keyboard since two years ago I picked up the Razer Hydra. It is just so superior in every single way. However you have to kinda set it up yourself, the way it works out of the box sucks.


Anyone who reproduces this system will find one minor problem, the radiator for the Corsair H100i, and the radiator port on top of the Corsiar 400r case, will not line up with the Asus Sabertooth Z77 motherboard, the plastic armour is way too in the way, I love the armour, and luckily it's pretty minor because you can get it in almost straight but with only 3 screws able to line up (not the original centered holes where it's meant to line up, but it doesn't affect the airflow, nothing is covered, just the two fans on top are centered and not perfectly lined up but the only a couple cm's skewed, I don't even consider that to be a problem, the problem I see, is I can only get 3 screws pinning the radiator to the case, and when I add the fans on pull (top of case), I could only get 2 screws in where there are four screw holes, however the radiator feels super secure anyways. But something you will definitely need to know going into it.

I also used a lot of electrical tape to cover up any gaps that would affect the airflow of the Corsair H100i since out of the box, looking at it, there were so many gaps. I figured duct tape the **** of everything around it that would allow air to leak out and not be pushed through the radiator.

I love this thing's fans, it puts off so much air, I just think it's fun seeing how much air you can move through a case. Now soon as I have an extra $120 I don't need, I'll get 3 delta fans for the inside (since the ones on top it wouldn't be a good idea as Delta fans can slice a finger apart if you were to touch it.

Another idea I had, I duct taped three small 80 mm fans in conjunction with one another so they all blow the same direction, does this help them really put out a lot more air working together like that? There is no way for air to leak out of it.

Here is the link to the video of my finalized pc if you want to see.

http://www.youtube.com/watch?v=Oql3aerGS5k

Holy long page batman.....
Quote:
Originally Posted by RavageTheEarth View Post

Welcome to the forum man! I'm sure Valgaur will add you anyways if you want. Just try filling out the info from the first page in the thread the best that you can and post it. Also, I think you applied too much CLU. All you need to do is push the syringe so it is just below the tip and then stick the brush in the tip to coat it and that might be enough for the die and the bottom of the IHS. The stuff preads like wildfire.

What Ravage said give me info and I'll add ya! tongue.gif
post #15958 of 33688
I can be sure of one thing for my next build, my motherboard will not be ASUS. I have already had 3 boards from there and have had bad experiences with all of them... my current one being the worse, and they have all been high end.
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post #15959 of 33688
Quote:
Originally Posted by Arm3nian View Post

I can be sure of one thing for my next build, my motherboard will not be ASUS. I have already had 3 boards from there and have had bad experiences with all of them... my current one being the worse, and they have all been high end.

frown.gif sorry to hear that. I mean I have heard tons of stories about asus boards but I currently own 3 asus boards and they work great! (p5q pro turbo, MIVG/gen3, and MVG. They all seem to be very nice in quality.
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post #15960 of 33688
Quote:
Originally Posted by RavageTheEarth View Post

Welcome to the forum man! I'm sure Valgaur will add you anyways if you want. Just try filling out the info from the first page in the thread the best that you can and post it. Also, I think you applied too much CLU. All you need to do is push the syringe so it is just below the tip and then stick the brush in the tip to coat it and that might be enough for the die and the bottom of the IHS. The stuff preads like wildfire.

Well, my problem with filling in the info is I used a 3770 like since Ivy Bridge came out last April a year ago and I only switched to a 3770k a little over a month ago, I never got to really mess with it overclocking, even though I did have the 3770k attached to an air cooler before my Corsair H100i came, I never got around to overclocking it until I finished doing everything so I can't really provide good temperature data.

However, I did start using Real Temp instead of my Asus software because I've found Real Temp gives a different result, Asus usually tells me my cpu is 10 degrees cooler, and it doesn't even tell me what temp all the cores are. So I didn't even know about Real Temp before I finished everything on this pc build and started learning how to overclock the cpu.


OCN name:shamanik1320
CPU:Intel i7-3770k w/ Corsair H100i
on die-TIM:Coollabs Liquid Ultra
ihs-TIM:Coollabs Liquid Ultra
Mhz gained:Never overclocked before delidding
OC after delid:4.7
Temp drops:
CPU-Z validation of max OC:If you watch my youtube video I posted, or on my channel it's "Ultimate PC Update" you can see myself running CPU-Z and it applying my +.2v offset and my Intel Turbo Boost monitor hitting 4.7 when I run Intel Burn Test.

I will follow the temperature recording thing tomorrow after work.
Edited by shamanik1320 - 4/4/13 at 7:20pm
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