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[Official] Delidded Club / Guide - Page 1878

post #18771 of 33576
Quote:
Originally Posted by L36 View Post

The amount of effort i would have to put into getting at 4.8 without deliding is either winning the silicon lottery or chilled wc setup to keep temps under 80. Stop being silly, for proper and safe overclock for most chips out there this is necessary if you care about the longevity of your chip within safe temperatures.

Have you overclocked yet?
post #18772 of 33576
Quote:
Originally Posted by chronicfx View Post

Have you overclocked yet?
I'm still waiting for my WC hardware to come in. Getting some new fans for rads and a new block. Titan hasn't gotten here yet so waiting until i get all parts to assemble everything. Should be here by tomorrow or Wednesday. Only cooler i can use is the stock Intel fan as i have no other air coolers on hand.
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post #18773 of 33576
I want to slap whoever works at Intel that dropped the ball on publishing 4th Gen Core package dimensions. Overall height of PCB+IHS is the same between 1155 and 1150, but I can't find the drawing that indicates the package dimensions from which the die height can be found. Unless the IHS is more hollowed out than it was with Ivy, the die would be the same height (.5mm).

However, I don't think this is possible as those look like 0402 surface mount components that have a .5mm height (typically). Because the die appears to be at least twice as tall as these components, the die would have to be 1mm or more thick.
post #18774 of 33576
Quote:
Originally Posted by FtW 420 View Post

Quote:
Originally Posted by Skullwipe View Post

I love liquid electrical tape, but it's much harder to remove than a non conductive TIM. I personally wouldn't put it on any surface that could be damaged by abrasion...like a PCB.

You'll notice in that video that they don't mention or show the removal of the liquid tape, it's not going to dissolve with Alcohol or any readily available solvent...that won't also damage your PCB.

I've been putting LET on all my mobos & gpus for a couple years, never scratched a PCB removing it when I need to. Just have to use a fingernail to get an edge lifted, then peel it off. Might have to use tweezers to get any tiny ripped bits for a perfect clean up, but taking 30 seconds to do it instead of 2 seconds can keep the PCB pristine.
Quote:
Originally Posted by dr/owned View Post

Sorry, but why are you guys worried about the resistors up top? If the IHS goes over them then they're lower height than the die itself and thus shorting isn't an issue.

EDIT: For LN2, dielectric grease and cover with some teflon pipe thread tape.





Anyhoo regarding Haswell....I really want one to turn loose my direct die + chilled water loop on it, which pretty much makes thermal throttling non-issue for me on my 3770k no matter the voltage. Then we can see how well it really overclocks.

For Ln2, don't delid, at least until someone finds out if it behaves the same as ivy did, where delidding turned golden chips into average chips for extreme cooling.

the only thing I found annoying with LET is hard to apply places since it's pretty thick (if you make it run you will weaken the LET and have to apply multiple times in order to peel easy ),I start using Vaseline and it's not that bad if you use sponge-brush and heat-gun (not hair dryer )
    
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post #18775 of 33576
Is anyone planning to or has already delidded the 4770K?
I really do wanna know if Intel used their low-quality TIM or not?
post #18776 of 33576
Quote:
Originally Posted by Ali Man View Post

Is anyone planning to or has already delidded the 4770K?
I really do wanna know if Intel used their low-quality TIM or not?

Page 1875
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post #18777 of 33576
Quote:
Originally Posted by Watagump View Post

Page 1875

Thanks, I guess Haswell and delidding it is then.
post #18778 of 33576
Quote:
Originally Posted by Ali Man View Post

Is anyone planning to or has already delidded the 4770K?
I really do wanna know if Intel used their low-quality TIM or not?

The TIM intel uses is actually very good, as good or better than what most OCNers use. It's not liquid metal, but right up there with the best of the regular paste types.
The problem was mostly the gap between the die & IHS.
    
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post #18779 of 33576
Quote:
Originally Posted by L36 View Post

I'm still waiting for my WC hardware to come in. Getting some new fans for rads and a new block. Titan hasn't gotten here yet so waiting until i get all parts to assemble everything. Should be here by tomorrow or Wednesday. Only cooler i can use is the stock Intel fan as i have no other air coolers on hand.

Understandable
post #18780 of 33576
Quote:
Originally Posted by FtW 420 View Post

The TIM intel uses is actually very good, as good or better than what most OCNers use. It's not liquid metal, but right up there with the best of the regular paste types.
The problem was mostly the gap between the die & IHS.

Maybe intel was counting on the fact that "OVERTIME" the heating would warp and mold the ihs "flatter"? Is this possible? biggrin.gif
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