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[Official] Delidded Club / Guide - Page 1882

post #18811 of 33536
FYI got ahold of the package mechanical drawing for 1150....it isn't published in the specs for some reason.

News flash: the IHS sealant thickness on Haswell has much stricter tolerances than it did for Ivy, where delidding might not even be needed. The IHS is also redesigned.
post #18812 of 33536
Quote:
Originally Posted by dr/owned View Post

FYI got ahold of the package mechanical drawing for 1150....it isn't published in the specs for some reason.

News flash: the IHS sealant thickness on Haswell has much stricter tolerances than it did for Ivy, where delidding might not even be needed.

Yeah right, like people are really gonna listen to that. biggrin.gif
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post #18813 of 33536
Everything I've seen so far seems to indicate that you would not want to push haswell past 4.7GHz without de-lidding.

The only board not available is the one I want. ASRock OC Formula. I almost grabbed a Gigabyte z87 OC but I really want the LCD on the ASRock.
post #18814 of 33536
Quote:
Originally Posted by SonDa5 View Post

Self-fusing silicone rubber general purpose class H electrical tape over the conductive parts will probably work well for insulating that part of the die for safety for running bare die mount.

I feel like getting a 4770k just to have fun delidding it. biggrin.gif

Would this do?

http://www.ebay.com/itm/SCOTCH-70-Self-Fusing-Silicone-Rubber-Electrical-Tape-Class-H-1-x-30-ft-GRAY-/150899451551?pt=LH_DefaultDomain_0&hash=item23224ee69f

Not sure regarding thickness of the tape or if there are options. You sure I can't just use Arctic MX-4 on it? =P...Just cover it up and let it sit...lol...

Any other solution?
post #18815 of 33536
Quote:
Originally Posted by Kamrooz View Post

Quote:
Originally Posted by SonDa5 View Post

Self-fusing silicone rubber general purpose class H electrical tape over the conductive parts will probably work well for insulating that part of the die for safety for running bare die mount.

I feel like getting a 4770k just to have fun delidding it. biggrin.gif

Would this do?

http://www.ebay.com/itm/SCOTCH-70-Self-Fusing-Silicone-Rubber-Electrical-Tape-Class-H-1-x-30-ft-GRAY-/150899451551?pt=LH_DefaultDomain_0&hash=item23224ee69f

Not sure regarding thickness of the tape or if there are options. You sure I can't just use Arctic MX-4 on it? =P...Just cover it up and let it sit...lol...

Any other solution?

http://www.amazon.com/gp/product/B004V411D6/ref=wms_ohs_product?ie=UTF8&psc=1

Is .15mm thick on my caliper measurement. It's what I use on my mouse feet so it would be dual-purpose if applied on top of the surface mount components.

Anyone who wants to try it out for thickness on their delidded 4770k, I'll mail a sample in an envelope.
Edited by dr/owned - 6/4/13 at 12:21am
post #18816 of 33536
If someone else wants to be the guinea pig that would be great. I just placed an order for all my parts mostly. Probably have everything by next week. But I want to order the tape needed asap before my parts arrive =O. God I spent so much money today...=*(
Edited by Kamrooz - 6/4/13 at 12:34am
post #18817 of 33536
Quote:
Originally Posted by tw33k View Post

Everything I've seen so far seems to indicate that you would not want to push haswell past 4.7GHz without de-lidding.

The only board not available is the one I want. ASRock OC Formula. I almost grabbed a Gigabyte z87 OC but I really want the LCD on the ASRock.

Those same terrible review sites said the same thing about Ivy. You need to delid the chip to really make it shine.

It's like people saying the 7950 is a bad card, well yea, but once you override the stupid stock power limit that throttles the card when it goes over 250w (which it does at stock) it performs great.
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post #18818 of 33536
Do all IB's suffer from the poor factory application of the tim or just a bad batch. Has intel corrected this problem with later batches of the 3770k?
    
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post #18819 of 33536
AFAIK every 3770k suffers from it to some extent.


Any last minute tips? If not then I'm off to the vise. biggrin.gif
     
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post #18820 of 33536
As has been stated many, many times in this thread (and every other thread on the internet) there is nothing wrong with the quality of the TIM Intel used or the way it has been applied. The high temperatures are caused by the gap between the die and the IHS. Intel has still not come out and said why they chose to manufacture 22nm chips this way as opposed to using solder.
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