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[Official] Delidded Club / Guide - Page 1909

post #19081 of 33574
If you plan on using LN2 or anything more extreme than watercooling, below freezing, then yes - do not delid. *I think* but don't quote me on this, the thermal paste actually blocks the transfer of heat at subzero temperatures thus causing the die to heat up instead of freeze - causing it to die.

Don't quote me on it, I'm sure a more experienced bencher whos used extreme cooling can clarify this for you. smile.gif
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post #19082 of 33574
I'm not planning on going sub-ambient. Just plain watercooling.

The thing you said about the paste, does this also apply to Intel's TIM? If so then Phase/DICE/LN2 cooling shouldn't be used either way with Ivys.
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post #19083 of 33574
Quote:
Originally Posted by Daredevil 720 View Post

I'm not planning on going sub-ambient. Just plain watercooling.

The thing you said about the paste, does this also apply to Intel's TIM? If so then Phase/DICE/LN2 cooling shouldn't be used either way with Ivys.

I'm de-lidded and run a loop just fine, there are many other users too.

Honestly I've noticed a slight bit more voltage needed for the same overclocks, but that is because I was running it at 1.49x volts day by day (that was on air too at the time) but it's fine. I have to re seat as it was my first ever waterblock mount to anything which is different to a CPU cooler in getting right, I think I used too much thermal paste also and it was only MX-2 haha. smile.gif

I get 28c idle with a 360 RX and say 45-50c load at stock.
 
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post #19084 of 33574
Quote:
Originally Posted by Daredevil 720 View Post

I'm not planning on going sub-ambient. Just plain watercooling.

The thing you said about the paste, does this also apply to Intel's TIM? If so then Phase/DICE/LN2 cooling shouldn't be used either way with Ivys.

No no, do not replace intels TIM if you plan to use anything more than water cooling. If you want to water-cool, by all means pop the lid and apply CLU/CLP thumb.gif
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post #19085 of 33574
I delidded yesterday and noticed an immediate 10c drop in temps, but I've noticed today that my temps have shot back up to almost pre-delid. Anyone have a guess as to why? I used CLU between the IHS and chip and some AS5 between the chip and H80. Position of the chip also looks normal (covering part of the black bar at the bottom). Idle temps are 35-37c, load temps hit about 60c, everything at stock.

//edit

So I went back and removed some of the CLU thinking I may have had too much, and now my temps went up even more. What the heck is going on here.
Edited by Sozin - 6/9/13 at 8:11am
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post #19086 of 33574
Quote:
Originally Posted by Sozin View Post

I delidded yesterday and noticed an immediate 10c drop in temps, but I've noticed today that my temps have shot back up to almost pre-delid. Anyone have a guess as to why? I used CLU between the IHS and chip and some AS5 between the chip and H80. Position of the chip also looks normal (covering part of the black bar at the bottom). Idle temps are 35-37c, load temps hit about 60c, everything at stock.

//edit

So I went back and removed some of the CLU thinking I may have had too much, and now my temps went up even more. What the heck is going on here.
My simple advice: try again, double check everything, and take pics.
It is very hard for people to assess the situation without seeing how much CLU you used on the die and on the IHS if you used any there. Pics of the CLU application, of the chip in the mobo, of the AS5 application, etc.

I have applied CLU many times, and it is definitely possible to use too much or too little.
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post #19087 of 33574
I think I'll be attempting to delid very shortly. Just purchased a 2700k as a back up should I screw myself or should I say if Murphy decides to rear his ugly head. I'm excited about playing with the 2700k as well. Have a nice vise and a variety of wood to choose from. Has anyone tried placing a "cutout" over the pcb and just twisting or is the "glue" more hard than it is pliable and requires the impact to loosen it. If it is RTV silicone it should just come off twisting back and forth.
    
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post #19088 of 33574
Quote:
Originally Posted by justanoldman View Post

My simple advice: try again, double check everything, and take pics.
It is very hard for people to assess the situation without seeing how much CLU you used on the die and on the IHS if you used any there. Pics of the CLU application, of the chip in the mobo, of the AS5 application, etc.

I have applied CLU many times, and it is definitely possible to use too much or too little.

Here is a terrible picture of IHS and die. I only applied CLU to the die, the IHS is just transfer after being mounted.

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post #19089 of 33574
Quote:
Originally Posted by hotrod717 View Post

I think I'll be attempting to delid very shortly. Just purchased a 2700k as a back up should I screw myself or should I say if Murphy decides to rear his ugly head. I'm excited about playing with the 2700k as well. Have a nice vise and a variety of wood to choose from. Has anyone tried placing a "cutout" over the pcb and just twisting or is the "glue" more hard than it is pliable and requires the impact to loosen it. If it is RTV silicone it should just come off twisting back and forth.
I suggested the twisting method quite some time ago, but I am not aware that anyone has actually tried it. With a properly formed cutout I think it would work, but hey, I wouldn’t be the one losing the chip if it doesn’t work.
Quote:
Originally Posted by Sozin View Post

Here is a terrible picture of IHS and die. I only applied CLU to the die, the IHS is just transfer after being mounted.
Warning: Spoiler! (Click to show)
Well, that doesn’t look like too little, but it is hard to see from the pic if it is actually too much. I can tell you that I spent a number of hours testing different amounts on the die before I found what worked best for my particular die and IHS.

It also took me awhile to test different configurations and TIM amounts between the IHS and cooler. No two IHS are the exactly the same, so if temps don’t seem right then testing different things is the best way to go.

You should also take pic of the AS5 fingerprint on the IHS and cooler when you take it off. That will help you see if your cooler is making good contact.
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post #19090 of 33574
Quote:
Originally Posted by justanoldman View Post

Well, that doesn’t look like too little, but it is hard to see from the pic if it is actually too much. I can tell you that I spent a number of hours testing different amounts on the die before I found what worked best for my particular die and IHS.

It also took me awhile to test different configurations and TIM amounts between the IHS and cooler. No two IHS are the exactly the same, so if temps don’t seem right then testing different things is the best way to go.

You should also take pic of the AS5 fingerprint on the IHS and cooler when you take it off. That will help you see if your cooler is making good contact.

So I went ahead and reapplied the CLU and my paste, checked for good contact between the H80 and the die, ran IBT and am sitting 48-52-54-58 across all four cores, and my idle temps have improved as well. Safe to say, I think she's back to normal.
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