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[Official] Delidded Club / Guide - Page 21

post #201 of 33682
Quote:
Originally Posted by kgtuning View Post

Just asking because I don't know... when does the die, IHS, or heatsink/ water block get to 150c? Or even close to that?


Good question. I asked the IC Diamond rep that in that thread.

http://www.techpowerup.com/forums/showthread.php?t=170121&page=10

I think it is just and extreme test but maby the unrealistic condition will never happen with lower temps. Looking forward to response from IC Diamond representative.
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B.K.T.
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post #202 of 33682
Quote:
Originally Posted by kgtuning View Post

Just asking because I don't know... when does the die, IHS, or heatsink/ water block get to 150c? Or even close to that?

Nothing will reach those temperatures. The cores in the die will be the hottest points in the setup and those will not exceed much of what you see Realtemp displaying.
post #203 of 33682
I see. I was just curious. Numbers and testing that mean nothing to us. Don't get me wrong, I use i c diamond between my IHS and water block. But real world testing is what we need.
post #204 of 33682
Quote:
Originally Posted by ivanlabrie View Post

I remember back in the XP-90 days, that the all copper version needed higher airflow fans to cool more efficiently than the Alu one, but with the same high cfm it did have an advantage, temp wise.
I think it is related to the ability to let go of heat alu has, which is better than copper's, despite copper absorbs heat faster.

yea..besides the extra weight, a while ago i read a article/review about coolers,
and saw a company made one of their models pure copper..a anniversary model ..lol
so the reviewers tested that one too, to see if it would do better then the "normal" one,
it got the temps 3-4C more down smile.gif
will look for the link , but theres alot of reviews about coolers out there ..lol
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post #205 of 33682
Quote:
Originally Posted by kgtuning View Post

I see. I was just curious. Numbers and testing that mean nothing to us. Don't get me wrong, I use i c diamond between my IHS and water block. But real world testing is what we need.

I agree. I understand that "pump out" can be a problem, but I doubt I will ever notice anything in the time I will be using this chip. Nobody can say with certainty that what that representative describes will actually happen. I will stay using Liquid Pro for under the IHS because it is simply the best and as long as I don't experience any problems (which I now have no reason for to suspect) I will keep using and recommending Liquid Pro.
post #206 of 33682
Thread Starter 
Quote:
Originally Posted by kgtuning View Post

I see. I was just curious. Numbers and testing that mean nothing to us. Don't get me wrong, I use i c diamond between my IHS and water block. But real world testing is what we need.
do the folding test then lol if you can fold for 4 days straight then your good lol
post #207 of 33682
Quote:
Originally Posted by SonDa5 View Post

IC Diamond rep posted some good damage control posts at TPU about the problems I have had with IC Diamond. Very good read and now I am not sure if Coollaboratory Liquid Pro/ultra is a good choice. I'm worried it will suffer from fast pump out/Burn out. This is when the TIM turns to dust and doesn't work very well.
http://www.techpowerup.com/forums/showpost.php?p=2740927&postcount=239
http://www.techpowerup.com/forums/showpost.php?p=2740998&postcount=240
Good read. Read the whole thread as it develops.

IC Diamond Spreads like crap You have to heat it or use a bunch of it to get it to spread. Ive used it for years and it is on both my gpus and my Cpu.

Gpu Tim will be replac3ed with Cool Lab Pro.
    
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post #208 of 33682
I have some ic diamond still...using it atm. Works good, after heating it and waiting for 5-10 minutes before slapping the heatsink on it though.
Good thing is it's not conductive, bad thing is it scratches stuff if you twirl your cooler while mounting it lol
post #209 of 33682
I got mine when IC diamond first hit the market Review Samples etc.. Had like 30G of the stuff gave away 25G but i still have about 3G left lol...

After reading up Cool Lab Pro is the best tim.. And by the time any tim turned to dust the hardware would be so out dated or no longer working it would not matter anymore.
    
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post #210 of 33682
this is a nice read too., about de-lidding etc.
http://forum.avsim.net/topic/387006-ivy-bridge-pictorial-de-lidding-guide/

The final step is to apply your choice of TIM. I recommend using a liquid metal TIM such as Coollaboratory Liquid Pro or Liquid Ultra, Phobya Liquid Metal is a good option as well. In my testing, temperature drops by 20-30 degrees C over the stock thermal paste with the use of any liquid metal TIM when applied properly. Note: it may be necessary to apply some liquid metal to the underside of the IHS. You can check this by placing the IHS on the CPU die (simply let it rest, no force required, no need to use any adhesive to re-attach either) and placing the CPU back in the socket on the motherboard. You then use the CPU retention mechanism to hold it in place. Remove the CPU from the socket and the lid from the CPU to check the contact of the TIM. If you don't see a nice even splotch of TIM on the underside of the IHS go ahead and apply a thin layer of TIM to the underside of the IHS and then reinstall the CPU in the socket as described above.

For further temperature reduction one can lap their IHS (top side only!) and heatsink/waterblock base.

Good luck, and happy overclocking!


especialyy the Note,where he says,
" it may be necessary to apply some liquid metal to the underside of the IHS". etc.

thats what i did, did all the sides actually,
the manual from liquid pro mentoins it too,
you could/can apply a thin layer on both sides..something like that.
with the 1gram you could apply it like that several times..
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