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[Official] Delidded Club / Guide - Page 2105

post #21041 of 33576
Quote:
Originally Posted by alancsalt View Post

So is this die more delicate than Ivy, is what I'm wondering....

It's possible... I used the razor method so I can't confirm but I'm guessing that the issue has something to do with a bowed IHS from the vice. Perhaps some people are tightening the vice up a bit too much?

I'm considering putting a little something (construction paper or a few layers of liquid electrical tape) under the IHS to prevent putting a bit too much pressure on the die just in case it's something else causing this to happen.
post #21042 of 33576
Quote:
Originally Posted by HairyGamer View Post

It's possible... I used the razor method so I can't confirm but I'm guessing that the issue has something to do with a bowed IHS from the vice. Perhaps some people are tightening the vice up a bit too much?

I'm considering putting a little something (construction paper or a few layers of liquid electrical tape) under the IHS to prevent putting a bit too much pressure on the die just in case it's something else causing this to happen.

if you do the tape under the IHS you going back to stage zero again. it makes no sense.
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post #21043 of 33576
Quote:
Originally Posted by skyn3t View Post

if you do the tape under the IHS you going back to stage zero again. it makes no sense.

Making a tiny gap and filling it with the CLP/CLU is far better than the huge gap left from the RTV and the crap paste from Intel. If I do it out of paranoia then I'll post my results. I highly doubt it would be enough to send my temps into the danger zone... In any event, slightly higher temps are far superior to a cracked die; it makes perfect sense.
post #21044 of 33576
Quote:
Originally Posted by HairyGamer View Post

Making a tiny gap and filling it with the CLP/CLU is far better than the huge gap left from the RTV and the crap paste from Intel. If I do it out of paranoia then I'll post my results. I highly doubt it would be enough to send my temps into the danger zone... In any event, slightly higher temps are far superior to a cracked die; it makes perfect sense.

keep in mind too much thermal compound won't work as it intend to. .wink.gif
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post #21045 of 33576
The Intel stock TIM isn't terrible. It's actually really good. The RTV adhesive is the main culprit. A liquid metal TIM does help, needless to say, because it is the closest thing we can get to solder.
post #21046 of 33576
Quote:
Originally Posted by stickg1 View Post

The Intel stock TIM isn't terrible. It's actually really good. The RTV adhesive is the main culprit. A liquid metal TIM does help, needless to say, because it is the closest thing we can get to solder.

lachen.gif
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post #21047 of 33576
Quote:
Originally Posted by skyn3t View Post

keep in mind too much thermal compound won't work as it intend to. .wink.gif

Yeah, kind of common knowledge on here I figure.
Quote:
Originally Posted by stickg1 View Post

The Intel stock TIM isn't terrible. It's actually really good. The RTV adhesive is the main culprit. A liquid metal TIM does help, needless to say, because it is the closest thing we can get to solder.

Stock TIM is bad, real bad. RTV isn't helping but the TIM is closing the gap and clearly not transferring the heat nearly as well as the CLP/CLU - If it comes down to it I'll make a small gap as explained (far thinner than the RTV from Intel, I work with RTV often when repairing equipment and I can see Intel used a LOT) and post results. I'd rather have slightly higher temps than a cracked die if the issue is found not to be associated/isolated to the hammer and vice method.
Edited by HairyGamer - 8/10/13 at 11:21pm
post #21048 of 33576
Quote:
Originally Posted by HairyGamer View Post

Yeah, kind of common knowledge on here I figure.
Stock TIM is bad, real bad. RTV isn't helping but the TIM is closing the gap and clearly not transferring the heat nearly as well as the CLP/CLU - If it comes down to it I'll make a small gap as explained (far thinner than the RTV from Intel, I work with RTV often when repairing equipment and I can see Intel used a LOT) and post results. I'd rather have slightly higher temps than a cracked die if the issue is found not to be associated/isolated to the hammer and vice method.

The stock tim is comparable the the best regular pastes. Bad compared to CLP/CLU like other paste, but the main problem is too much of it & the little bit of gap from the glue.
    
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post #21049 of 33576
All I know is that this is yet another reason I'm glad I just decided to stay with Ivy and skip Haswell altogether. I realize that's cold comfort to you 4770K guys... but sometimes it's nice to accidentally make a good decision - usually I go in the other direction and I'm the guy with the dead hardware. rolleyes.gif
post #21050 of 33576
I'm thinking about getting an EK Naked Ivy kit and ditching the IHS to be safe. Don't know if I'll be safer or not though.. tongue.gif
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