Originally Posted by HairyGamer
Not being ignorant at all... I guess you'll just have to take my word for it and not be ignorant about that. Thanks for repeating what we already know.
@Val - thanks for the info... Is there a chance that the two cracked dies from delidded 4770K's (both were hammer and vice method and cracked about a month after delidding) may be related to the liquid metal TIM we are all using?
what I'm here for (that phone call took like 3 hours as well was kinda insane)
anyways I am trying to diagnose those 4770K's myself and having a hard time believing that the die itself which is covered by a protective layer of glass to keep TIM's doing what they do from shorting it instantly, and to think that the vise method would be bending IHS's is prettyy silly as the lips for the glue areas are strengthening the entire peice and it wouldn't bend with the slight pressure we are putting on it, you'd have to take a sledgehammer and heat the IHS up to ultiple hunred degrees to really notice.
I am kinda leaning towards the IHS pressure from heatsinks... but im not quite sold on that one yet either... im just wondering why it started on the top part then as if it was pressure it should start in the middle almost where the mass of the weight goes.
Tiss a brain teaser this!