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[Official] Delidded Club / Guide - Page 2364

post #23631 of 33576
@mat459 I am not sure whether you could lower your vcore down a bit for your clock speed or you need that much to make it stable.
If you could, I can imaging you could get even better temp, imo
@IMI4tth3w also you could try low down your vcore a bit smile.gif it helps if it stables
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post #23632 of 33576
Thread Starter 
Quote:
Originally Posted by inedenimadam View Post

Ivy got hot...but shame on Intel for not only failing to address the issue, but making it worse with Haswell. Freakin 4.5 and a h110 cant keep it under control? SHAME Intel....SHAME!!!! buttkick.gif

Actually it's not their fault here.

Simply put the smaller transistor sizes have caused to great of heat output and temperature deltas involved for the fluxless solder to handle... thus making the die crack and shatter from the heat differences (from actual Intel testing), Thus the reasoning behind the paste they used but the real issue isnt the paste like most people assume it's the spacing of the IHS and the pcb which is the glue holding the IHS down as it hardens it expands slightly making a biger space for the heat to go through more TIM.

The more you know!

thumb.gif
post #23633 of 33576
Quote:
Originally Posted by Valgaur View Post

Quote:
Originally Posted by inedenimadam View Post

Ivy got hot...but shame on Intel for not only failing to address the issue, but making it worse with Haswell. Freakin 4.5 and a h110 cant keep it under control? SHAME Intel....SHAME!!!! buttkick.gif

Actually it's not their fault here.

Simply put the smaller transistor sizes have caused to great of heat output and temperature deltas involved for the fluxless solder to handle... thus making the die crack and shatter from the heat differences (from actual Intel testing), Thus the reasoning behind the paste they used but the real issue isnt the paste like most people assume it's the spacing of the IHS and the pcb which is the glue holding the IHS down as it hardens it expands slightly making a biger space for the heat to go through more TIM.

The more you know!

thumb.gif

All they had to do was shave a little off the bottom of the IHS and apply some pressure while the glue drys. Some of the most amazing, mind blowing engineering goes into the manufacturing of these microprocessors, but then they give it to Barney Fife to get the lid on it.
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post #23634 of 33576
Quote:
Originally Posted by inedenimadam View Post

All they had to do was shave a little off the bottom of the IHS and apply some pressure while the glue drys. Some of the most amazing, mind blowing engineering goes into the manufacturing of these microprocessors, but then they give it to Barney Fife to get the lid on it.

Rofl biggrin.gif
post #23635 of 33576
Quote:
Originally Posted by inedenimadam View Post

All they had to do was shave a little off the bottom of the IHS and apply some pressure while the glue drys. Some of the most amazing, mind blowing engineering goes into the manufacturing of these microprocessors, but then they give it to Barney Fife to get the lid on it.

Lol tongue.gif
 
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post #23636 of 33576
Quote:
Originally Posted by Valgaur View Post

Actually it's not their fault here.

Simply put the smaller transistor sizes have caused to great of heat output and temperature deltas involved for the fluxless solder to handle... thus making the die crack and shatter from the heat differences (from actual Intel testing), Thus the reasoning behind the paste they used but the real issue isnt the paste like most people assume it's the spacing of the IHS and the pcb which is the glue holding the IHS down as it hardens it expands slightly making a biger space for the heat to go through more TIM.

The more you know!

thumb.gif
If it really is because of the smaller process then how come ivy-e is indeed soldered?
post #23637 of 33576
Quote:
Originally Posted by Jetskyer View Post

If it really is because of the smaller process then how come ivy-e is indeed soldered?

I heard somebody blame the iGPU before >.>

Really, hard to know. I won't pretend to have a clue what's going on, and few people will unless intel comes out and says something
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post #23638 of 33576
Thread Starter 
Quote:
Originally Posted by Jetskyer View Post

If it really is because of the smaller process then how come ivy-e is indeed soldered?

been waiting for that one!

With ivy-e being a 2011 socket and having more ompf in the processor itself like the 6 core for example the die is much larger resulting in a better heat distribution over the IHS. the 1155 and 1150 sockets have a hard time since the die is long and so narrow. more surface area more heat distribution.

if anyone has questions like these don't hesitate to ask thumb.gif
post #23639 of 33576
Quote:
Originally Posted by Valgaur View Post

been waiting for that one!

With ivy-e being a 2011 socket and having more ompf in the processor itself like the 6 core for example the die is much larger resulting in a better heat distribution over the IHS. the 1155 and 1150 sockets have a hard time since the die is long and so narrow. more surface area more heat distribution.

if anyone has questions like these don't hesitate to ask thumb.gif

Makes sense..
In other words.. Intel should ditch the iGPU on the K-line making the die more square-sized so they can solder those chips again biggrin.gif


Obviously Intel would never ever do that, guess it's a good thing we all got the nerve to smack the chip with a hammer ^^
post #23640 of 33576
Thread Starter 
Quote:
Originally Posted by Jetskyer View Post

Makes sense..
In other words.. Intel should ditch the iGPU on the K-line making the die more square-sized so they can solder those chips again biggrin.gif


Obviously Intel would never ever do that, guess it's a good thing we all got the nerve to smack the chip with a hammer ^^

I think without the igpu the problem would still exist since the die would be even smaller.

but I agree I'd rather improve tech and make changes in the world than sit there going... im sorry your so hot!! T.T
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