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[Official] Delidded Club / Guide - Page 2460

post #24591 of 33678
Quote:
Originally Posted by MaKe OuT View Post

I am thinking about doing this even though I am voltage limited (so not to push OC higher, just temps cooler) as the summer months are coming and it will be getting hot folding all day. Delidding cold help keep my room a little cooler.wink.gif

Colder means it last longer... I think I am voltage locked as well. I tried my hardest to get stable at 4.6 and just kept feeding it more, and it didn't care, just kept shutting off. Maybe with the bare naked booty out there, we can find some hidden gold.
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post #24592 of 33678
I have CLU and Gelid GC Extreme on hand. Once I throw everything into my new case (whenever the 760T will finally arrive:rolleyes:) I think I will just fix this crappy TIM issue. I ain't got much to lose. If I screw it up, I buy a new chip to replace this dud. And, if I am lucky, Haswell refresh will work on this Z87 board. Who knows, maybe I should break the chip, sell the board, and go Z97 all together.biggrin.gif
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post #24593 of 33678
Hi, I'm gonna delid and watercool a 4670k and I'd like to know what's the best way to go ( temps-wise ). The infos I can find contradict themselves so I don't know what to do and what will be the coolest :

- CLU between die/IHS and CLU between IHS/block ?
- CLU between die/IHS and prowled thermal grease between IHS/block ?
- prowled thermal grease between die/IHS and CLU between IHS/block ?
- prowled thermal grease between die/IHS and prowled thermal grease between IHS/block ?
- CLU between die/block ( no IHS )
- prowled thermal grease between die/block ( no IHS )

..assuming the grease chosen is the best of its kind.

I would have thought there'd be a consensus on that question, but it seems that not... even amongst tests the results go both way
So I prefer to ask
post #24594 of 33678
Quote:
Originally Posted by MaKe OuT View Post

I am thinking about doing this even though I am voltage limited (so not to push OC higher, just temps cooler) as the summer months are coming and it will be getting hot folding all day. Delidding cold help keep my room a little cooler.wink.gif

That was also why I delidded my 3570k. When summer came around, it started crashing. It only needed +0.005 or +0.010 V more Vcore, but it was enough to make me flip out and delid. tongue.gif

You are by the way mistaken about the room getting colder. It's overall the same amount of heat being produced inside your room. The PC will still pull the same amount of power and all of that gets turned into heat. After the delid, it just gets put a little bit faster into your room than previously.
post #24595 of 33678
Your processor does not dump less heat into your room unless you are also able to use less voltage, it simply means that you are pulling that heat away from your processor quicker. The air around you heats up just the same.
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post #24596 of 33678
Quote:
Originally Posted by deepor View Post

That was also why I delidded my 3570k. When summer came around, it started crashing. It only needed +0.005 or +0.010 V more Vcore, but it was enough to make me flip out and delid. tongue.gif

You are by the way mistaken about the room getting colder. It's overall the same amount of heat being produced inside your room. The PC will still pull the same amount of power and all of that gets turned into heat. After the delid, it just gets put a little bit faster into your room than previously.
ahhh, you are correct! i can't believe i said that.redface.gif I know better. smh. I'm going to need to buy a chiller for just the cpu room haha.
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post #24597 of 33678
I hope my question won't get burried x) ..oh well mignt as well open a new thread
Quote:
Originally Posted by MaKe OuT View Post

I'm going to need to buy a chiller for just the cpu room haha.

I had myself a nasty thought crossing my mind, that was to dig a hole in the wall to push the rad heat into the other room haha... hem
post #24598 of 33678
Quote:
Originally Posted by White Wind View Post

Hi, I'm gonna delid and watercool a 4670k and I'd like to know what's the best way to go ( temps-wise ). The infos I can find contradict themselves so I don't know what to do and what will be the coolest :

- CLU between die/IHS and CLU between IHS/block ?
- CLU between die/IHS and prowled thermal grease between IHS/block ?
- prowled thermal grease between die/IHS and CLU between IHS/block ?
- prowled thermal grease between die/IHS and prowled thermal grease between IHS/block ?
- CLU between die/block ( no IHS )
- prowled thermal grease between die/block ( no IHS )

..assuming the grease chosen is the best of its kind.

I would have thought there'd be a consensus on that question, but it seems that not... even amongst tests the results go both way
So I prefer to ask

AFAIK folks cannot say anything beyond this: metallic (CLU for example) die/ihs and any decent TIM paste ihs/block works quite well. you could use CLP for die/ihs but it is harder to clean off if. It seems the CLU/metallics or CLP work best for die/ihs.
CLU and Naked may work best as long as your block is making good contact with die.

HTH, not really sure what else you are asking for?
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post #24599 of 33678
Quote:
Originally Posted by MaKe OuT View Post

HTH, not really sure what else you are asking for?

Nothing else than that, just trying to know what people think about it smile.gif get opinions, maybe hear about experiences..

just like you did, thank you thumb.gif
post #24600 of 33678
Quote:
Originally Posted by White Wind View Post

I would have thought there'd be a consensus on that question, but it seems that not... even amongst tests the results go both way
So I prefer to ask

There is consensus. It's all written in the first post.

The Intel stock paste isn't so bad. Replacing with another paste does not result in significant temp drop. It's the liquid metallic formulas that allow Ivy/Haswell to transfer heat similarly as soldered chips.

However, maybe surprisingly, liquid metal isn't so super between IHS and block. Well it's good, but not worth the clean-up. You see, sometimes CLU can be absorbed into the copper surface of the block. Not on the IHS because it is nickel.

So long story short: CLU on die, grease on block.
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