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post #30881 of 34178

@bluej511 @Benjiw True enough. I shall be ordering more CLU. Do you also spread the clu onto the waterblock large enough to cover the die?

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post #30882 of 34178
Quote:
Originally Posted by Castaile View Post

@bluej511
 @Benjiw
 True enough. I shall be ordering more CLU. Do you also spread the clu onto the waterblock large enough to cover the die?

What I have done in the past is mount it, then take it off and see how much was actually contacting, since you spread it with a brush, you can just flatten it all back out. If there are spots missing on the block, then add a little CLU to ensure contact. This improved my temps over just putting it on one side, but depends on your surface shape, ect.
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post #30883 of 34178
Quote:
Originally Posted by GTRtank View Post

What I have done in the past is mount it, then take it off and see how much was actually contacting, since you spread it with a brush, you can just flatten it all back out. If there are spots missing on the block, then add a little CLU to ensure contact. This improved my temps over just putting it on one side, but depends on your surface shape, ect.

Yea theres so many variables cant ever tell. Plus The cores are only on the side of the die, probably 1/4 of the chip is the graphic section lol.
    
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post #30884 of 34178
Quote:
Originally Posted by GTRtank View Post


What I have done in the past is mount it, then take it off and see how much was actually contacting, since you spread it with a brush, you can just flatten it all back out. If there are spots missing on the block, then add a little CLU to ensure contact. This improved my temps over just putting it on one side, but depends on your surface shape, ect.

 

 

Quote:
Originally Posted by bluej511 View Post


Yea theres so many variables cant ever tell. Plus The cores are only on the side of the die, probably 1/4 of the chip is the graphic section lol.

I've applied CLU on the die as well as onto the waterblock. This might have led to the scare I had.

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post #30885 of 34178
Quote:
Originally Posted by Castaile View Post


I've applied CLU on the die as well as onto the waterblock. This might have led to the scare I had.

You really only need it on the die, after a couple cycles it ends up sticking to the waterblock/ihs anyways.
    
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post #30886 of 34178
Has anyone ever done it both ways and compared?

I only put clu on the die, and i got great temp improvement. But on haswell you have to be a bit more careful about getting lm everywhere. If i remounted i might try putting on both and comparing. But placing the ihs on top of the die isn't that precise either...i imagine if you go with a water block instead you can get it more consistent.

And a real question! If you remount do you need to replace the clu? Logically it is still just liquid sitting there and you shouldn't have to...
Edited by jdorje - 8/9/16 at 1:35am
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post #30887 of 34178
Quote:
Originally Posted by jdorje View Post

Has anyone ever done it both ways and compared?

I only put clu on the die, and i got great temp improvement. But on haswell you have to be a bit more careful about getting lm everywhere. If i remounted i might try putting on both and comparing. But placing the ihs on top of the die isn't that precise either...i imagine if you go with a water block instead you can get it more consistent.

And a real question! If you remount do you need to replace the clu? Logically it is still just liquid sitting there and you shouldn't have to...

Ive done both ways but its only going to be a fact on my system. Like ive said before there's so much inconsistencies and manufacturing tolerances that it might vary greatly. Ive done it stock, then bare die/tim then bare die/clu (temps were IDENTICAL btw but it pumped out rapidly at 1.2v.), then i did ihs/clu.

ihs/clu was 53°C and bare die was 46-47°C IN MY CASE. It really depends on the waterblock, the waterblock convex, the die flatness. Some people said it made no difference. I did it the same day, same tests, and i got way better temps bare die.

This time im going straight from stock to delid and bare die with CLU to see what temp drops i get. RIght now at 1.21v im at 59-60°C under water. Yes i know its quite high, its also because my case ambien is 30-31°C with NO AC.

Oh and no need to reapply, and on haswell and ivy, you can just nail polish over the resistors or wtv and youll be fine. A coat or two fully cured is perfect, then even if the clu runs a tiny bit its totally fine.
    
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post #30888 of 34178
Quote:
Originally Posted by bluej511 View Post

Ive done both ways

Whoops I wasn't clear! I know people have done both bare die and with IHS. What I meant was, has anyone compared putting CLU on both sides (block + die or IHS + die) to just putting it on one side (die) and letting it cover the other through pressure?
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post #30889 of 34178
Quote:
Originally Posted by jdorje View Post

Whoops I wasn't clear! I know people have done both bare die and with IHS. What I meant was, has anyone compared putting CLU on both sides (block + die or IHS + die) to just putting it on one side (die) and letting it cover the other through pressure?

Honestly, i could try but to my understanding it would be way too much clu. Its not like TIM, i just find it way easier and safer to put on the die away from all pc parts, make sure the pcb is totally clean then put it in straight and flat into the socket then put the waterblock on. If i dont like the temps, ill totally remove it and reapply or respread then reinstall. Sounds like a pain but better safe then sorry, i wont apply clu directly with the cpu in the socket, and my mobo is also horizontal which makes it easier, but also easier to get drops in nooks and crannys haha.
    
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post #30890 of 34178
Quote:
Originally Posted by jdorje View Post

Quote:
Originally Posted by bluej511 View Post

Ive done both ways

Whoops I wasn't clear! I know people have done both bare die and with IHS. What I meant was, has anyone compared putting CLU on both sides (block + die or IHS + die) to just putting it on one side (die) and letting it cover the other through pressure?
Anecdotal of course, because I have not done any scientific "testing", but it was easier for me to get good contact with less LM when applied to both sides. I have reapplied several times over several years like this. Its almost like there is some amount of surface tension to LM, and brushing it helps overcome that tension and adhere to the surface, so it just made sense to do both sides. This had been my experience when doing die-ihs, die-copper block, and die-plated block.
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