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[Official] Delidded Club / Guide - Page 3109

post #31081 of 34072
Quote:
Originally Posted by Rei86 View Post

So need to rearrange and redo my wiring.
Already used some RV Silicone to mate the IHS back to the chip but thinking about delid it again replace my CLU with some Thermal Grizzly.

Anyone have experience with that stuff? And obviously the Conductonaut one.

Yup don't bother. Ive noticed no difference between Noctua and CLU my temps were identical. Between CLU and Conductonaut youd probably see a tiny bit of difference within the margin of error but would probably be due to a difference in application.
    
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post #31082 of 34072
Quote:
Originally Posted by Rei86 View Post

So need to rearrange and redo my wiring.
Already used some RV Silicone to mate the IHS back to the chip but thinking about delid it again replace my CLU with some Thermal Grizzly.

Anyone have experience with that stuff? And obviously the Conductonaut one.

CLU and Grizzly perform the same within a margin of error so CLU will be fine.
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post #31083 of 34072
Quote:
Originally Posted by bluej511 View Post

Just making sure, its what i used first. And although temps were IDENTICAL to CLU, it lasted about a day or two lol. I went from 43°C or so to 48°C in a matter of days. Couldn't figure out why till i searched the forum.
Damn, you were right. The NT-H1 doesn't last that well on the die. I hit 100 Celsius on one of the cores today.


I get some money on Thursday and I'll order some CLU then. I guess I have to replace the paste daily until then..
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post #31084 of 34072
Quote:
Originally Posted by NiKiZ View Post

Damn, you were right. The NT-H1 doesn't last that well on the die. I hit 100 Celsius on one of the cores today.


I get some money on Thursday and I'll order some CLU then. I guess I have to replace the paste daily until then..

Yea whats even crazier is the 17°C variation between that one core and the other cores. Might have run out right there or the pressure is greater then.

I think there is only one TIM that someone mentioned that actually lasts on bare die. I guess its just the direct heat and pressure that destroys thermal pastes. Its why clu/conductonaut/phobya lm that dont press out or degrade over time.

The issue with MOST thermal paste reviews is they test it on the IHS or between two pieces of copper. Ive yet to see one test on bare die, i tried out 2 different TIMs on the die then CLU. All 3 temps were within a margin of error, however it was durability that was different on all 3.

Whats weird is on my 35w i5 3350p, ive got some hydronaut on bare die with the IHS back on top and its perfectly fine. Temps havent changed in 3months.
    
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post #31085 of 34072
I really thought this was over and done with, it was concluded that normal thermal paste is too thick and pumps out from under the IHS and die because that is what it's designed to do when applied to the IHS and then compressed with a cooler for full coverage and closes gaps. LM TIM doesn't do this because of how it is, it's thin and doesn't react to pressure the same way, it will literally sit there for years not giving a single .....

This is why everyone says to use any LM under the IHS and any TIM on top or better yet get rid of the IHS and run naked with LM. biggrin.gif
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post #31086 of 34072
Quote:
Originally Posted by Benjiw View Post

I really thought this was over and done with, it was concluded that normal thermal paste is too thick and pumps out from under the IHS and die because that is what it's designed to do when applied to the IHS and then compressed with a cooler for full coverage and closes gaps. LM TIM doesn't do this because of how it is, it's thin and doesn't react to pressure the same way, it will literally sit there for years not giving a single .....

This is why everyone says to use any LM under the IHS and any TIM on top or better yet get rid of the IHS and run naked with LM. biggrin.gif

Actually i wouldnt say its too thick, if anything its too thin under heat. Case in point? Intel TIM is ridiculously thick and not viscous at all and that stuff lasts for AGES on the die. I wish i could get my hands on some to try bare die see how long it lasts.
    
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post #31087 of 34072
You guys think I'd be able to shave off a few C if I lapp the CPU? I'm determining if its worth it or not...
CPU cooler is lapped extremely well and I'm sure its flat.
post #31088 of 34072
Quote:
Originally Posted by bluej511 View Post

~
The issue with MOST thermal paste reviews is they test it on the IHS or between two pieces of copper. Ive yet to see one test on bare die, i tried out 2 different TIMs on the die then CLU. All 3 temps were within a margin of error, however it was durability that was different on all 3.
~

Although dated, this should have some worth;

https://forums.anandtech.com/threads/bare-die-testing-a-delidded-3770k-an-h100-and-9-different-tims.2285595/
post #31089 of 34072
Quote:
Originally Posted by Cakewalk_S View Post

You guys think I'd be able to shave off a few C if I lapp the CPU? I'm determining if its worth it or not...
CPU cooler is lapped extremely well and I'm sure its flat.

That already looks like a beautiful spread to be honest. Only the middle of the IHS actually gets hot. The reason the lapping helps is because of heat spread. It helps cool the ENTIRE ihs when its lapped.
Quote:
Originally Posted by oparr View Post

Although dated, this should have some worth;

https://forums.anandtech.com/threads/bare-die-testing-a-delidded-3770k-an-h100-and-9-different-tims.2285595/

Yea ive seen this one a few times, i just dont like how he measured everything. The block is going to sit directly on the cpu socket anyways when bare die so no reason to really put spacers under there. His results are pretty much identical to mine, there is ZERO difference between Noctua and CLU temps at initial installation. He even used WAY too much CLU so his results might be skewed. The main problem, no one tests these long term. I wait a month before posting my results, and that was with Noctua being applied TWICE because of the temp rise within a couple days.
    
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post #31090 of 34072
Quote:
Originally Posted by Benjiw View Post

I really thought this was over and done with, it was concluded that normal thermal paste is too thick and pumps out from under the IHS and die because that is what it's designed to do when applied to the IHS and then compressed with a cooler for full coverage and closes gaps. LM TIM doesn't do this because of how it is, it's thin and doesn't react to pressure the same way, it will literally sit there for years not giving a single .....

This is why everyone says to use any LM under the IHS and any TIM on top or better yet get rid of the IHS and run naked with LM. biggrin.gif
Quote:
it will literally sit there for years not giving a single .....

October will make it one year since doing two Skylake delids using CLU. Noticed increasing CPU core temperatures during stress testing as the months went by. My CLU sample has hardened in the syringe/cap and is now unusable.

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