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post #31091 of 34072
Quote:
Originally Posted by bluej511 View Post

Actually i wouldnt say its too thick, if anything its too thin under heat. Case in point? Intel TIM is ridiculously thick and not viscous at all and that stuff lasts for AGES on the die. I wish i could get my hands on some to try bare die see how long it lasts.

https://www.dowcorning.com/content/electronics/electronicsproducts/thermal-management-solutions-overview.aspx

http://www.ebay.com/itm/like/232060616950?lpid=82&chn=ps&ul_noapp=true

You can get them in tubs too.
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post #31092 of 34072
Quote:
Originally Posted by oparr View Post


October will make it one year since doing two Skylake delids using CLU. Noticed increasing CPU core temperatures during stress testing as the months went by. My CLU sample has hardened in the syringe/cap and is now unusable.


Strange as mine came with a blocked nozzle too but temps have never changed and its been months, ambient temps might be your issue not really anything CLU can do to magic that away.
Quote:
Originally Posted by bluej511 View Post

Actually i wouldnt say its too thick, if anything its too thin under heat. Case in point? Intel TIM is ridiculously thick and not viscous at all and that stuff lasts for AGES on the die. I wish i could get my hands on some to try bare die see how long it lasts.

Considering we delid to remove that TIM and the silicone, I'm not sure why you would put that ish back on the die at all.
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post #31093 of 34072
Quote:
Originally Posted by Benjiw View Post

Quote:
Originally Posted by oparr View Post


October will make it one year since doing two Skylake delids using CLU. Noticed increasing CPU core temperatures during stress testing as the months went by. My CLU sample has hardened in the syringe/cap and is now unusable.


Strange as mine came with a blocked nozzle too but temps have never changed and its been months, ambient temps might be your issue not really anything CLU can do to magic that away.

Mine has the same issue. I just barely had enough non-hardened CLU to get my die covered...the rest, like 0.5g is solidified... Maybe pop it in the microwave for a few seconds to turn it back into a liquid...

tongue.gif:p jkjkjk but I do have the hardening issue. And this is my 2nd tube that'd done it...
post #31094 of 34072
Quote:
Originally Posted by Benjiw View Post

Strange as mine came with a blocked nozzle too but temps have never changed and its been months, ambient temps might be your issue not really anything CLU can do to magic that away.
Considering we delid to remove that TIM and the silicone, I'm not sure why you would put that ish back on the die at all.

Youd be quite surprised at how good it actually is. I need to find the thread online somewhere BUT, the thread starter compared the intel TIM to Noctua TIM on the die WITHOUT the silicone and the IHS back on and the Intel TIM did better in every single instance, idle, stock speed and overclocked.

Its a common misconception that intel tim is garbage but its not. It doesnt pump out, it doesnt change temps over a couple years (i know because my spare pc has never had the TIM changed under the die and temps haven't changed one bit). It just keeps getting repeated online and people keep believing it. Its actually quality stuff, the main issue is the .06mm gap that the silicone leaves, thats enough to create a 10°C average temp difference between stock and delided. Its why skylake and haswell havent seen as dramatic a temp change as ivy and sandy as they used even more silicone and had a bigger gap. Just an fyi lol.
    
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post #31095 of 34072
Quote:
Originally Posted by Cakewalk_S View Post

Mine has the same issue. I just barely had enough non-hardened CLU to get my die covered...the rest, like 0.5g is solidified... Maybe pop it in the microwave for a few seconds to turn it back into a liquid...

tongue.gif:p jkjkjk but I do have the hardening issue. And this is my 2nd tube that'd done it...

Btw i think the CLU that has a hardening issue probably has problems harderning over time on the die but im not sure. This application ive put on my die won't be taken off for a while so ill check it in a while to see if it etched my block and hardened.
    
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post #31096 of 34072
Quote:
Originally Posted by Benjiw View Post

Strange as mine came with a blocked nozzle too but temps have never changed and its been months, ambient temps might be your issue not really anything CLU can do to magic that away.
Quote:
Strange as mine came with a blocked nozzle

Check out one and two star CLU reviews at Amazon here;

http://tinyurl.com/zanodf4
Quote:
ambient temps might be your issue

Ambient temps haven't increased by more than 5F but CPU core max temps have increased by 7-10C during stress testing. I tend to keep fairly good records with screenshots of test results.
post #31097 of 34072
Quote:
Originally Posted by bluej511 View Post

Youd be quite surprised at how good it actually is. I need to find the thread online somewhere BUT, the thread starter compared the intel TIM to Noctua TIM on the die WITHOUT the silicone and the IHS back on and the Intel TIM did better in every single instance, idle, stock speed and overclocked.

Its a common misconception that intel tim is garbage but its not. It doesnt pump out, it doesnt change temps over a couple years (i know because my spare pc has never had the TIM changed under the die and temps haven't changed one bit). It just keeps getting repeated online and people keep believing it. Its actually quality stuff, the main issue is the .06mm gap that the silicone leaves, thats enough to create a 10°C average temp difference between stock and delided. Its why skylake and haswell havent seen as dramatic a temp change as ivy and sandy as they used even more silicone and had a bigger gap. Just an fyi lol.
Quote:
the main issue is the .06mm gap that the silicone leaves, thats enough to create a 10°C average temp difference between stock and delided

That gap is there after cleaning away old silicone sealant and old TIM and just resting the clean IHS on the clean die. I assume you're referring to the gap that can be seen here;

http://www.pbase.com/eldata/image/161598087/original
post #31098 of 34072
Quote:
Originally Posted by oparr View Post


Check out one and two star CLU reviews at Amazon here;

http://tinyurl.com/zanodf4


Ambient temps haven't increased by more than 5F but CPU core max temps have increased by 7-10C during stress testing. I tend to keep fairly good records with screenshots of test results.

Not sure then, use what you like but I've had no issues with CLU yet so I'll continue to use it, I've sold my 4670k and z97 board etc so the next chip that's getting the naked treatment is a 6700k which I'm going to use a shim to enable me to completely remove the IHS.
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post #31099 of 34072
Quote:
Originally Posted by oparr View Post


That gap is there after cleaning away old silicone sealant and old TIM and just resting the clean IHS on the clean die. I assume you're referring to the gap that can be seen here;

http://www.pbase.com/eldata/image/161598087/original

Well that .06mm im talking about is the gap caused by the silicone increasing the height of the ihs by .06mm off the wafer. That in turn causes the IHS to leave a gap between the TIM the die and the IHS. In a perfect world you want NO thermal material between two surfaces. But we don't live in a perfect world so it must be used. It must be used as microscopic as possible.

Its why running bare die is another advantage. Less copper, less TIM, better temps.
    
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post #31100 of 34072
Quote:
Originally Posted by bluej511 View Post

Well that .06mm im talking about is the gap caused by the silicone increasing the height of the ihs by .06mm off the wafer. That in turn causes the IHS to leave a gap between the TIM the die and the IHS. In a perfect world you want NO thermal material between two surfaces. But we don't live in a perfect world so it must be used. It must be used as microscopic as possible.

Its why running bare die is another advantage. Less copper, less TIM, better temps.

The gap between the base of the IHS and wafer is by design. This ensures that the top inside of the IHS rests on the die instead of the IHS resting on the wafer. Also, it leaves sufficient room for a thin layer of sealant to exist between IHS and wafer for a better bond. Pressure has to be applied to the top of the IHS, during the sealant drying process, in order to ensure that what you have described doesn't happen. Unfortunately, there are those who see the gap and sealant, as in the picture linked to above, and assume what you have.
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