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[Official] Delidded Club / Guide - Page 3111

post #31101 of 33978
Quote:
Originally Posted by oparr View Post

The gap between the base of the IHS and wafer is by design. This ensures that the top inside of the IHS rests on the die instead of the IHS resting on the wafer. Also, it leaves sufficient room for a thin layer of sealant to exist between IHS and wafer for a better bond. Pressure has to be applied to the top of the IHS, during the sealant drying process, in order to ensure that what you have described doesn't happen. Unfortunately, there are those who see the gap and sealant, as in the picture linked to above, and assume what you have.

Its not an assumption, its been proven that the issue is the gap between the ihs and the wafer/die. That .06mm is enough of a gap to raise temperatures. You want the IHS to sit so flush against the die that a microscopic bond of TIM/LM is in between. Your assessment is wrong sorry to say, this has been proven many times by me and many other people.

You WANT zero gap between the IHS and the die, ZERO. Unfortunately because of manufacturing tolerances, and the silicone this does not happen. The temp drops arent just from adding clu or new TIM, the drops are cause because the gap between the IHS and die has been reduced by .06mm, that .06mm is plenty, PLENTY to cause the TIM to do its job poorly.

Btw its easy to check this, just take your IHS off and look at how the TIM is spread. Just look at this picture, the TIM on the die/ihs is too thick, caused by the IHS being elevated .06mm caused by the silicone.

    
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post #31102 of 33978
Quote:
Originally Posted by bluej511 View Post

Its not an assumption, its been proven that the issue is the gap between the ihs and the wafer/die. That .06mm is enough of a gap to raise temperatures. You want the IHS to sit so flush against the die that a microscopic bond of TIM/LM is in between. Your assessment is wrong sorry to say, this has been proven many times by me and many other people.

You WANT zero gap between the IHS and the die, ZERO. Unfortunately because of manufacturing tolerances, and the silicone this does not happen. The temp drops arent just from adding clu or new TIM, the drops are cause because the gap between the IHS and die has been reduced by .06mm, that .06mm is plenty, PLENTY to cause the TIM to do its job poorly.

Btw its easy to check this, just take your IHS off and look at how the TIM is spread. Just look at this picture, the TIM on the die/ihs is too thick, caused by the IHS being elevated .06mm caused by the silicone.

Does the image below help (wafer=substrate);



If not, then nothing will and I have no more time to waste on this.
post #31103 of 33978
If you need more proof... my IHS had a thick coat of sealant between that and the substrate... definite gap. Look at all that TIM!!!! Tim the tool man taylor!
thumb.gif
post #31104 of 33978
Because a gap existed to allow for the sealant. The sealant didn't create the gap.
Edited by oparr - 8/29/16 at 1:21pm
post #31105 of 33978
Quote:
Originally Posted by oparr View Post

Clueless!!! Sorry, I have no patience with frigging idiots!!!

The image you posted is the best possible scenario, but in most cases the glue under the IHS causes it to lift and it doesn't make good pressure so cooling isn't as good.
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post #31106 of 33978
Quote:
Originally Posted by Benjiw View Post

The image you posted is the best possible scenario, but in most cases the glue under the IHS causes it to lift and it doesn't make good pressure so cooling isn't as good.

Not if pressure is applied during the drying process. Why do you think Rockit provides a resealing attachment which does exactly that? I used the Z-axis of my Mill.


Edited by oparr - 8/29/16 at 1:58pm
post #31107 of 33978
Quote:
Originally Posted by oparr View Post

Not if pressure is applied during the drying process. Why do you thing Rockit provides a resealing attachment which does exactly that? I used the Z-axis of my Mill.


You don't need to glue the IHS back on in the first place... the clamp holds it in place or you can do what I do and never use the IHS again.
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post #31108 of 33978
Quote:
Originally Posted by Benjiw View Post

You don't need to glue the IHS back on in the first place... the clamp holds it in place or you can do what I do and never use the IHS again.

Been there done that. I really came here to find out whether there were any LM TIMs with better longevity than CLU and got side tracked.
post #31109 of 33978
I tacked the corners of my IHS back down with PermaTex just to make it easier to install in the socket without having to loosen the hold-down or otherwise prevent the IHS from sliding when I closed the cover.

I suppose reinstalling the IHS at all is totally unnecessary...
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post #31110 of 33978
Quote:
Originally Posted by Arctucas View Post

I tacked the corners of my IHS back down with PermaTex just to make it easier to install in the socket without having to loosen the hold-down or otherwise prevent the IHS from sliding when I closed the cover.

I suppose reinstalling the IHS at all is totally unnecessary...

Yep, want proof? thumb.gif



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