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[Official] Delidded Club / Guide - Page 3115

post #31141 of 34072
Quote:
Originally Posted by dmfree88 View Post

It is not an issue with the design because they chose to do it possibly for multiple reasons.
1) The sealant provides a barrier of protection from moisture
2) They leave a small channel without sealant likely to give it breathing so heat has no way to build up under the IHS
3) The small gap protects from you crushing the die during handling or getting damaged during shipping.
4) The "issue" is easily resolved by using cooling sufficient enough to dissipate it

Really delidding is for the additional cooling. It is not really a design flaw as much as it is designed to easily be stuck together and sealed and protected with more then enough dissipation. They aren't giving you the best possible they are giving you what is efficient. The TIM is still good but they have been known to fail in application (very rare) which is when someone may see a spike in 1-2 cores because one side of the die is not getting sufficient contact which is where delidding would fix the issue (since new TIM is applied). Of course after years of use TIM should be replaced but even MX-4 is rated to last 8 years but pumps out from under the IHS in days so they are using a more of a solid TIM that works and lasts a very long time likely exceed the life of the CPU if it is applied correctly. After 5+ years of use especially with overclocking any TIM would need replacing but that is not the fault of Intel who did all their testing at stock and likely rated the TIM at 10+ years.
Quote:
3) The small gap protects from you crushing the die during handling or getting damaged during shipping.

Are you suggesting that with every recent Intel consumer CPU, a gap must exist even after re-lidding? If so, then we can only agree to disagree.
post #31142 of 34072
Quote:
Originally Posted by Benjiw View Post

The IHS was invented because people used to put their coolers on wrong and damage the die. I don't use mine, I see no reason to and my cooling is pretty epic as I can go all the way up to 1.6v without hitting thermal limits.

Use of heat spreaders is SOP in certain thermal interface designs. Read all about it;

https://en.wikipedia.org/wiki/Heat_spreader
Quote:
"The use of a heat spreader is an important part of an economically optimal design for transferring heat from high to low heat flux media."
post #31143 of 34072
Quote:
Originally Posted by oparr View Post

Use of heat spreaders is SOP in certain thermal interface designs. Read all about it;

https://en.wikipedia.org/wiki/Heat_spreader

Ah thats why my cpu stays a lot more cooler without my "heat spreader"? even cooler than people who have delidded and then reused the IHS? I can go all the way up to 1.6v and I never hit 100c.
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post #31144 of 34072
Quote:
Originally Posted by Benjiw View Post

Ah thats why my cpu stays a lot more cooler without my "heat spreader"? even cooler than people who have delidded and then reused the IHS? I can go all the way up to 1.6v and I never hit 100c.

Just indicating that you made this up;
Quote:
The IHS was invented because people used to put their coolers on wrong and damage the die.

Also, let us be the second to know when your die develops cracks or becomes chipped. Quite common with Skylake bare die setups.
Edited by oparr - 8/31/16 at 12:01pm
post #31145 of 34072
I am stating there is no gap after relidding except the tiny gaps of the surface and the curve of the die/IHS surfaces. Before delidding it appears there is a 0.06mm gap created by the sealant. When people use their own sealent they probably press it down hard enough the gap is not there or small enough that they still see temperature drops. I would guess at the Intel manufacturers they press down the IHS gently to squish the sealant but not hard enough to completely push it out so that a small layer creates the gap and properly seals. The TIM is also fairly thick so that itself may assist in creating the gap when they press down the IHS.

As far as the crushing I meant the gap helps protect you from accidentally crushing it by dropping it or something. If there is an additional 0.06mm of thermal paste it should protect the die from minor impacts on the IHS (like dropping the heatsink onto the CPU while its in the socket for example). The gap doesn't necessarily need to be there but it probably protects it. And as I said before it only raises temps by minor amounts at stock voltages so it is likely a trade off they decided was worth it. Having TIM instead of Solder also gives the user the ability to delid and do direct on die and could reduce failure rate at the factory as they can always re-apply TIM but Solder is much more difficult
Quote:
Originally Posted by oparr View Post

Just indicating that you made this up;
Also, let us be the second to know when your die develops cracks or becomes chipped. Quite common with Skylake dies.

I am sure he meant the use of a heatspreader on a CPU. But you also made a good point it allows you to switch from high flux to low flux which means you can use thermal paste instead of liquid metal which is also likely a reason they use the heatspreader.
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post #31146 of 34072
Quote:
Originally Posted by oparr View Post

Just indicating that you made this up;
Also, let us be the second to know when your die develops cracks or becomes chipped. Quite common with Skylake bare die setups.

Any links? You go around saying things with no proof quite a lot and my die is perfectly fine, I've taken the block off about 5 times and temps are still great.





Just a quick note, the last image I didn't have enough LM on the die so a bit more and my temps where great. thumb.gif
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post #31147 of 34072
Quote:
Originally Posted by Benjiw View Post

Any links? You go around saying things with no proof quite a lot and my die is perfectly fine, I've taken the block off about 5 times and temps are still great.

Just a quick note, the last image I didn't have enough LM on the die so a bit more and my temps where great. thumb.gif
Quote:
Any links

Only two...Okay embellishment factor exists but nowhere as large as in the Lochte/Rio incident.biggrin.gif

BTW, your Cinebench CPU score is low, mine is over a 1000.
post #31148 of 34072
Quote:
Originally Posted by oparr View Post


Only two...Okay embellishment factor exists but nowhere as large as in the Lochte/Rio incident.biggrin.gif

BTW, your Cinebench CPU score is low, mine is over a 1000.
Can you post the links and can I see the screenshots of your amazing score?
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post #31149 of 34072
Quote:
Originally Posted by Benjiw View Post

Can you post the links and can I see the screenshots of your amazing score?



Die links coming up.
post #31150 of 34072
Quote:
Originally Posted by oparr View Post



Die links coming up.

That isn't a 4670k Oparr... That's an 6600k. rolleyes.gif


Edited by Benjiw - 8/31/16 at 12:45pm
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