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[Official] Delidded Club / Guide - Page 3119

post #31181 of 34072
Quote:
Originally Posted by oparr View Post

Quote:
Originally Posted by Benjiw View Post

I really thought this was over and done with, it was concluded that normal thermal paste is too thick and pumps out from under the IHS and die because that is what it's designed to do when applied to the IHS and then compressed with a cooler for full coverage and closes gaps. LM TIM doesn't do this because of how it is, it's thin and doesn't react to pressure the same way, it will literally sit there for years not giving a single .....

This is why everyone says to use any LM under the IHS and any TIM on top or better yet get rid of the IHS and run naked with LM. biggrin.gif
Quote:
it will literally sit there for years not giving a single .....

October will make it one year since doing two Skylake delids using CLU. Noticed increasing CPU core temperatures during stress testing as the months went by. My CLU sample has hardened in the syringe/cap and is now unusable.


Any method to fix this? Clu drying/hardening in the tube? Maybe really hot water over the closed syringe will help? I think it'll reliquify under some heat...
post #31182 of 34072
Quote:
Originally Posted by sav4 View Post

Yes I have only read the ln2 guys having cracking issues on bare die also.

I've not seen anyone run bare die LN2 they seem to reuse the IHS.
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post #31183 of 34072
Thread Starter 
Quote:
Originally Posted by Benjiw View Post

I've not seen anyone run bare die LN2 they seem to reuse the IHS.

The reason being is the silicone can't handle those levels of temperature change. Even with Delidded you can still have issue as the cpu needs that spacing for a heat barrier to take effect and protect the silicone. Additionally the LN2 pots are so heavy you can easily destroy cpu and mobo pins.
post #31184 of 34072
Quote:
Originally Posted by Valgaur View Post

The reason being is the silicone can't handle those levels of temperature change. Even with Delidded you can still have issue as the cpu needs that spacing for a heat barrier to take effect and protect the silicone. Additionally the LN2 pots are so heavy you can easily destroy cpu and mobo pins.

Yeah reading about it now on HWbot, someone did mention doing it naked though but not sure how lol, they seem to post a lot of words and not pics but at a guess that might be due to the urgent attention needed when doing LN2 or DI.

I really wanted to run my 6700k naked on water but the only VRM block I can get is the full mono block from EK so I'm stuck to either getting a custom block made which I can't fund or be bothered doing have a really loud fan running at full speed to cool the cooking vrm or just use the full cover block with the IHS intact. Really not sure.
Edited by Benjiw - 9/2/16 at 7:32am
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post #31185 of 34072
Quote:
Originally Posted by Benjiw View Post

Yeah reading about it now on HWbot, someone did mention doing it naked though but not sure how lol, they seem to post a lot of words and not pics but at a guess that might be due to the urgent attention needed when doing LN2 or DI.

I really wanted to run my 6700k naked on water but the only VRM block I can get is the full mono block from EK so I'm stuck to either getting a custom block made which I can't fund or be bothered doing have a really loud fan running at full speed to cool the cooking vrm or just use the full cover block with the IHS intact. Really not sure.

Easy just sand down the IHS a mm or so, lap the IHS and the waterblock should get u closer to bare die temps. thumb.gif
    
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post #31186 of 34072
Thread Starter 
Quote:
Originally Posted by Benjiw View Post

Yeah reading about it now on HWbot, someone did mention doing it naked though but not sure how lol, they seem to post a lot of words and not pics but at a guess that might be due to the urgent attention needed when doing LN2 or DI.

I really wanted to run my 6700k naked on water but the only VRM block I can get is the full mono block from EK so I'm stuck to either getting a custom block made which I can't fund or be bothered doing have a really loud fan running at full speed to cool the cooking vrm or just use the full cover block with the IHS intact. Really not sure.

Use the IHS and Mono block thumb.gif
post #31187 of 34072
Quote:
Originally Posted by bluej511 View Post

Easy just sand down the IHS a mm or so, lap the IHS and the waterblock should get u closer to bare die temps. thumb.gif

Man I doubt it lol, I dunno yet, from what I'm reading I can see why Oparr glues the lid back on his skylake. The guys with LN2 have been keeping the glue on because it creates a gap which has been shown to help with the cracking issue in some cases, not all.
Quote:
Originally Posted by Valgaur View Post

Use the IHS and Mono block thumb.gif

The mono block has a funky camo pattern on it I'd have to mod but man, I just don't know lol. Kinda deflated right now, I might need to try getting a block made for the VRM and still go naked. devil.gif
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post #31188 of 34072
Quote:
Originally Posted by Benjiw View Post

Man I doubt it lol, I dunno yet, from what I'm reading I can see why Oparr glues the lid back on his skylake. The guys with LN2 have been keeping the glue on because it creates a gap which has been shown to help with the cracking issue in some cases, not all.
The mono block has a funky camo pattern on it I'd have to mod but man, I just don't know lol. Kinda deflated right now, I might need to try getting a block made for the VRM and still go naked. devil.gif

My guess, the skylake pcb is such garbage, when removing the glue the IHS sits right on the wafer. Unfortunately its so thin that the pressure from the IHS cracks it. Bare die would actually be even better. All you have to do is shave down the cpu socket so it sits flush with the die and bam no problems, no cracking, no bending.
    
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post #31189 of 34072
Quote:
Originally Posted by bluej511 View Post

My guess, the skylake pcb is such garbage, when removing the glue the IHS sits right on the wafer. Unfortunately its so thin that the pressure from the IHS cracks it. Bare die would actually be even better. All you have to do is shave down the cpu socket so it sits flush with the die and bam no problems, no cracking, no bending.

The problem is they don't know what's causing it, it might just be that the die is so thin its naturally fragile and anything could damage it. If Oparr would of stated this in his previous posts it would of taken a lot of confussion out of the whole thing.

I'm not sure why they decided a thinner PCB was a better idea but I'm sure they had their reasons, I'm still unsure about the block making contact with the die even with a shaved down socket. Do I really want to shave down the socket? It would void the warranty that's for sure...
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post #31190 of 34072
Quote:
Originally Posted by Benjiw View Post

Quote:
Originally Posted by bluej511 View Post

My guess, the skylake pcb is such garbage, when removing the glue the IHS sits right on the wafer. Unfortunately its so thin that the pressure from the IHS cracks it. Bare die would actually be even better. All you have to do is shave down the cpu socket so it sits flush with the die and bam no problems, no cracking, no bending.

The problem is they don't know what's causing it, it might just be that the die is so thin its naturally fragile and anything could damage it. If Oparr would of stated this in his previous posts it would of taken a lot of confussion out of the whole thing.

I'm not sure why they decided a thinner PCB was a better idea but I'm sure they had their reasons, I'm still unsure about the block making contact with the die even with a shaved down socket. Do I really want to shave down the socket? It would void the warranty that's for sure...

Armchair QB says it might be a more efficient pin layout, requiring less layers in the PCB. more layers=more cost.
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