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[Official] Delidded Club / Guide - Page 3272

post #32711 of 33962
Quote:
Originally Posted by Ceadderman View Post

Wonder if anyone is going to attempt a delid of Ryzen 7? thinking.gif

~Ceadder smil3dbd4e4c2e742.gif

Already been done and shows like no improvement, its already soldered so honestly why would you? Plus it sits lower in the socket so youd hit the am4 socket/bracket before the die.
    
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post #32712 of 33962
How would you hit the socket/bracket? That sorta makes no sense my friend. Considering we don't delid while sitting in the socket. thinking.gif

mellowsmiley.gif Color me confused. mellowsmiley.gif

~Ceadder smil3dbd4e4c2e742.gif
 
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post #32713 of 33962
Quote:
Originally Posted by Ceadderman View Post

How would you hit the socket/bracket? That sorta makes no sense my friend. Considering we don't delid while sitting in the socket. thinking.gif

mellowsmiley.gif Color me confused. mellowsmiley.gif

~Ceadder smil3dbd4e4c2e742.gif

The waterblock/heatsink would hit the am4 gray cpu socket that sits behind the cpu, the latch mechanism. Der8bauer already tried and said it made zero difference, was a 1°C drop in temps.
    
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post #32714 of 33962
Quote:
Originally Posted by Ceadderman View Post

How would you hit the socket/bracket? That sorta makes no sense my friend. Considering we don't delid while sitting in the socket. thinking.gif

mellowsmiley.gif Color me confused. mellowsmiley.gif

~Ceadder smil3dbd4e4c2e742.gif

https://www.youtube.com/watch?v=lOZbK3tP7EU

https://www.youtube.com/watch?v=wz_-Q5QzRqg
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post #32715 of 33962
Quote:
Originally Posted by bluej511 View Post


The waterblock/heatsink would hit the am4 gray cpu socket that sits behind the cpu, the latch mechanism. Der8bauer already tried and said it made zero difference, was a 1°C drop in temps.

His mounting was flawed. The Cpu sits higher than the socket retention bracket. I've de-lidded some 15 soldered AMD processors. The socket style is the same since s754. We where de-lidding these since then, few have done soldered chips.

He should have seen an easy 5c temp drop but in most cases 10c.

I only bring these numbers to the table by experience. My FX-9590 showed very nice improvement in temp drops.

I won't have any Ryzen de-lid information for at least another month or so. I'd really like to do more than one chip to have additional data provided.
post #32716 of 33962
Quote:
Originally Posted by ShrimpBrime View Post

His mounting was flawed. The Cpu sits higher than the socket retention bracket. I've de-lidded some 15 soldered AMD processors. The socket style is the same since s754. We where de-lidding these since then, few have done soldered chips.

He should have seen an easy 5c temp drop but in most cases 10c.

I only bring these numbers to the table by experience. My FX-9590 showed very nice improvement in temp drops.

I won't have any Ryzen de-lid information for at least another month or so. I'd really like to do more than one chip to have additional data provided.

Its soldered and soldered well why bother. There is no way you'll see 10°C from going from solder to lw. Especially on ryzen. Fx is a different story all together

Btw the socket style may be the same, HOWEVER the cpu and wafer are FAR from the same from my understanding.
Edited by bluej511 - 3/29/17 at 6:25am
    
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post #32717 of 33962
Quote:
Originally Posted by bluej511 View Post

Its soldered and soldered well why bother. There is no way you'll see 10°C from going from solder to lw. Especially on ryzen. Fx is a different story all together

I agree, whatever gains are expect will come purely from the closer intimacy of cooler to die. Unlikely to yield 10 degrees unless the solder job was super bad and there are voids/debonds everywhere.




Also was testing out the Rockit tool on a poor old E2140
dayummm, Intel have been using thermal paste since C2D, esp for budget units. Check out that phat Silicon liner. gg
post #32718 of 33962
Quote:
Originally Posted by bluej511 View Post


Its soldered and soldered well why bother. There is no way you'll see 10°C from going from solder to lw. Especially on ryzen. Fx is a different story all together

Btw the socket style may be the same, HOWEVER the cpu and wafer are FAR from the same from my understanding.

Why Bother?

Why bother to do anything we do with LN2? Or a water cooling setup with a chiller.....

Well, because I can. Simple as that.
post #32719 of 33962
Thread Starter 
Quote:
Originally Posted by ShrimpBrime View Post

I'm not going anywhere. I'm a de-lidder and happen to belong to this thread as much as any one.

However I've already flagged your previous post. Perhaps you should take a step.

Quote:
Originally Posted by bluej511 View Post

Flag anything you want man. Unless you've delided 17 ryzen chips you really can't talk. I guess you forgot the fact that its a new chip, new architecture, new design and might be soldered differently. Or you just think its a remade am3 chip and its going to be delided the exact same way.

Eh hem.....

Move to PM, or end the argument please. thumb.gif
post #32720 of 33962
Any thoughts regarding Conductonaut vs Liquid Ultra? Any advantages of using one over the other? I hear conductonaut is more runny/watery?
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