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[Official] Delidded Club / Guide - Page 3291

post #32901 of 33114
My delid apparently went fine. I got a decent OC on air, then delidded the 7700K and stuck it back together. Booted up just to bios with the CPU water block on it - no water - and the OC was still registering just like before I delidded, volts fine, RAM OC still showing. Temp never got above 35C even without water in the system, but just posting to bios isn't too stressful.

Rockit de/re lid kit, CLU, Permatex black RTV (just a tiny smear), Gelid Extreme on the IHS before the waterblock went on. Quite a bit of stuff just for a single use, I don't know that delidding is something I'll make a habit of. It was a lot easier than I figured it would be.

Looking forward to getting the loop finished so I can see how it stacks up to before,
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post #32902 of 33114
When putting liquard metal on the Die, do you also have to put some on the inside of the IHS where it touches the die.

Ive seen videos of people only putting it on the die and some putting it also on the inside of the IHS
post #32903 of 33114
Quote:
Originally Posted by Zyther View Post

When putting liquard metal on the Die, do you also have to put some on the inside of the IHS where it touches the die.

Ive seen videos of people only putting it on the die and some putting it also on the inside of the IHS

Yes put some on the inside of the IHS, as you may have seen, applying CLU evenly requires a lot of brush strokes and even then it can be a bit stubborn to get to spreading at first. If you dont apply any on the IHS and just put the lid back on, chances are you wont have filled the microscopic spaces for better thermal transfer and you'll get less bang out of your delid.
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post #32904 of 33114
Quote:
Originally Posted by Zyther View Post

When putting liquard metal on the Die, do you also have to put some on the inside of the IHS where it touches the die.

Ive seen videos of people only putting it on the die and some putting it also on the inside of the IHS



while any TIM is supposed to fill up only the smallest imperfections between 2 surfaces, I have to say I found the inside of my IHS to be more on the rough side
so I ended up adding just a tad more even

we're also trying to bridge a gap between IHS and DIE
we just don't know how much of a gap it is
and I think I even read somewhere here that there are variances in the IHS itself, depending where it was sourced from apparently
Quote:
Originally Posted by Malinkadink View Post

Yes put some on the inside of the IHS, as you may have seen, applying CLU evenly requires a lot of brush strokes and even then it can be a bit stubborn to get to spreading at first. If you dont apply any on the IHS and just put the lid back on, chances are you wont have filled the microscopic spaces for better thermal transfer and you'll get less bang out of your delid.

what he said biggrin.gif
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post #32905 of 33114
I know there a tools out there for delid, but this guy make it look easy haha. biggrin.gif

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post #32906 of 33114
I'm hoping to get my Delid-Die-Mate 2 this Week.

My Current PC (less then a Month old):
i7-7700k
AIO be Quiet! Silent Loop with 280mm Rad and 2x140mm Stock Pure Wing 2 Fans.
ASUS IX HERO (Z270)
2x8GB 3200MHz Corsair Vengeance RAM (Running on 3200MHz XMP)
ASUS STRIX GTX 1080 TI
An 5 Year old Gold 660W PSU from Seasonic (scavanged from my old PC, hey Quality build for life)


atm my CPU is at 60-65°C under full load at baseclock with 1,296V Vcore and 1,280V LCC

Tested it with Multiplicator on 50 = 5.004GHz no change on other settings.
Ran with Cinebench R15 and Prime 95 for about 5 min....
Temp was about 90-92°C and Vcore about 1,380V (dont know the exact V anymore)
I didnt want it to run too long at 90°C to I reversed the OC. But still I didn't have a BSoD.

My Preparation for delidding:
First this Vid. Nice step by step from a neat German:
https://www.youtube.com/watch?v=y6KFzoFwYrE

What im gonna do:
On-Die Tim: TG Conductonaut
IHS TIM: TG Kryonaut
LM on Die and downside of IHS.
No taping at all (im confident that im not gonna spill anything)
Quality Black Silicon (UHU) put on like original.
No Lapping


My idea is having it at 50°C or less at Baseclock (5GHz at maybe 70°C) after delidding. So I hope for around 20 less.

My Question:
Did i get a good CPU?
It wasn't pretested or binned. Just bought regulary as bulk.

Do you want Pictures from delidding?
I havent found Pictures from how putting the IHS back on for the Delid device i intend to use. tongue.gif

Edit:
Btw
Does it matter if i make the LM on the Die thicker in the Mid then on the edge? That should prevent airbubbles, doesnt it? And yeah it does sound far more easy then to actually do it XD At least the tighthly bound cottonswaps from the Conductonaut are far better then the brush from CLU.
Edited by theGucky - 4/24/17 at 2:47am
post #32907 of 33114
Quote:
Originally Posted by Malinkadink View Post

Yes put some on the inside of the IHS, as you may have seen, applying CLU evenly requires a lot of brush strokes and even then it can be a bit stubborn to get to spreading at first. If you dont apply any on the IHS and just put the lid back on, chances are you wont have filled the microscopic spaces for better thermal transfer and you'll get less bang out of your delid.

So it would be a good idea to take apart again and put some on the IHS? I only put it on the DIE.
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post #32908 of 33114
Quote:
Originally Posted by jetpuck73 View Post

So it would be a good idea to take apart again and put some on the IHS? I only put it on the DIE.

Consider this as advice from a guy who had zero delid experience before I just did my first one...

After I put the CLU on the die, I placed the IHS on the die/PSB to check that it was making contact. When I pulled it back off, there was just a faint trace of an outline where the die had made contact - no CLU to speak of had stuck to the IHS. So I used that outline as a guide of where to apply CLU to the IHS, and I pulled CLU from the die to apply to the IHS as I thought I might have had just a touch too much on the die itself.

So I don't think it would be a bad idea to apply CLU directly to the underside of the IHS, though I have no data to say it will help or not.

Tangential thought. When gluing structures together, applying the glue to one part is called wetting the part, if you apply glue to both parts to be joined it's called double wetting. And double wetting generally produces better bonds than single wetting. That was what was going through my mind when I put the CLU on the IHS.
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post #32909 of 33114
Quote:
Originally Posted by GnarlyCharlie View Post

Consider this as advice from a guy who had zero delid experience before I just did my first one...

After I put the CLU on the die, I placed the IHS on the die/PSB to check that it was making contact. When I pulled it back off, there was just a faint trace of an outline where the die had made contact - no CLU to speak of had stuck to the IHS. So I used that outline as a guide of where to apply CLU to the IHS, and I pulled CLU from the die to apply to the IHS as I thought I might have had just a touch too much on the die itself.

So I don't think it would be a bad idea to apply CLU directly to the underside of the IHS, though I have no data to say it will help or not.

Tangential thought. When gluing structures together, applying the glue to one part is called wetting the part, if you apply glue to both parts to be joined it's called double wetting. And double wetting generally produces better bonds than single wetting. That was what was going through my mind when I put the CLU on the IHS.

That's how I've done all of mine... hasn't let me down yet.
post #32910 of 33114
Quote:
Originally Posted by GnarlyCharlie View Post

Consider this as advice from a guy who had zero delid experience before I just did my first one...

After I put the CLU on the die, I placed the IHS on the die/PSB to check that it was making contact. When I pulled it back off, there was just a faint trace of an outline where the die had made contact - no CLU to speak of had stuck to the IHS. So I used that outline as a guide of where to apply CLU to the IHS, and I pulled CLU from the die to apply to the IHS as I thought I might have had just a touch too much on the die itself.

So I don't think it would be a bad idea to apply CLU directly to the underside of the IHS, though I have no data to say it will help or not.

Tangential thought. When gluing structures together, applying the glue to one part is called wetting the part, if you apply glue to both parts to be joined it's called double wetting. And double wetting generally produces better bonds than single wetting. That was what was going through my mind when I put the CLU on the IHS.

Thank you for the info, I will do it over again. REP+
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