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[Official] Delidded Club / Guide - Page 3295

post #32941 of 33102
Quote:
Originally Posted by Anth0789 View Post

Watch this guide:
https://www.youtube.com/watch?v=bwg0HRw17lY&list=FLuc2sjsIxcOSwL8pHr8LymA&index=1

I put scotch tape and it helps.

Thank you for the video. Best one I have seen yet. How about the super glue, will it come off if I ever have to delid again?
post #32942 of 33102
Quote:
Originally Posted by socalmvp View Post

Thank you for the video. Best one I have seen yet. How about the super glue, will it come off if I ever have to delid again?


Just use RTV silicone i do not understand why people use superglue.
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post #32943 of 33102
Quote:
Originally Posted by socalmvp View Post

Thank you for the video. Best one I have seen yet. How about the super glue, will it come off if I ever have to delid again?


As long as it's a gel superglue. The liquid super glues can damage the pcb
https://rockitcool.myshopify.com/products/loctite-super-glue-gel-control
post #32944 of 33102
Quote:
Originally Posted by socalmvp View Post

Thank you for the video. Best one I have seen yet. How about the super glue, will it come off if I ever have to delid again?

Yeah just use Permatex Black RTV instead of super glue.
 
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post #32945 of 33102
Quote:
Originally Posted by socalmvp View Post

Thank you for the video. Best one I have seen yet. How about the super glue, will it come off if I ever have to delid again?

I don't like Superglue Gel because have a small "window" for correction. dries in 30s.
Automotive Silicone start forming a "skin" in 20m, you have time to put the glue, place the IHS and install the processor on the socket to make the smallest gap possible. So you can make this delicate operation without having to rush wink.gif
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post #32946 of 33102
I think Superglue was selected due to it allowing the ihs to sit on the die closer than an rtv type adhesive.

Check this article out if you haven't already.

This one, too.
Edited by bfe_vern - 5/1/17 at 7:10am
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post #32947 of 33102
Yes that is why. But in most cases, the chip will not be deli died again. In case you tinker I would suggest not applying an adhesive and go with that or use RTV. Just because one or a couple people happily report success using superglue or superglue gel doesn't mean everyone will have the same success. Remember, results may vary . wink.gif

~Ceadder smil3dbd4e4c2e742.gif
 
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post #32948 of 33102
Quote:
Originally Posted by bfe_vern View Post

I think Superglue was selected due to it allowing the ihs to sit on the die closer than an rtv type adhesive.

Check this article out if you haven't already.

This one, too.

I never had such a big difference of temps between "zero gap" and glued, but I always sand a bit the IHS base of the processors i delid
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post #32949 of 33102
I'm not a pro or something like that, i just delidded my first CPU 2 Pages back.

Thickness:
But I think it doesn't matter of you have 1,5mm of LM between IHS and Die or just 0,5mm (no exact numbers, just an example). The thermal conductivity of LM is just that good.
Thermal Paste is a different matter, thinner is better in that case, otherwise The Tim-Paste might act as a Thermal isolator (or kind of a weakness in the Thermalchain)

It IS important to get it to cover the WHOLE gap between Die and IHS.
Since the LM really likes to stick to itself its a good choice to put LM on Die AND IHS, so gets into the gaps inside the Materials pushing the air out.
By putting it only on the Die there may be miniscule Airbubbles trapped between LM and IHS.

So first cover the whole surface by dropping a maybe 2-3mm drop in the middle and smearing it outwards. Dont worry about covering it evenly the LM also spreads a bit like normal Paste, as long as it is enough in the middle. Repeat with the other one. (with the IHS try to only cover the place where the Die is)

Lapping:
When using LM, lapping is only useful if you want to remove either old LM or that Nickelcoating (which has the same or a bit higher thermal conductivity then the LM, so its less of a reason).
If you use Thermal Paste lapping can reduce the miniscule cracks in the Metal, thus greatly enhance contact. But removing the Nickel can make the copper vulnerable to oxidizing.
Ive heard that some IHS's don't have an even surface but are either concave or convex in which lapping can help making an even surface.

Thermal Paste and Liquidmetal are different about that, since LM does go easier into little cracks inside the Metal (thats why it sticks so hard later on).

Glueing:
Well in this regard i can only say glueing shouldnt make a difference in Temperature, but it secures the IHS on the PCB. When installing the CPU the IHS might slip forward when its not glued or move around when moving the Case. That could raise Temperatures since the TIM isnt spread properly anymore if the IHS moves. If the TIM is dry it can even result in air pockets.



All that is more opinion then fact, but i tend to be close to the truth XD


@ Valgaur
My TIM on the outside of the IHS was Kryonaut not Conductonaut tongue.gif
post #32950 of 33102
How about my other concern. What if the CLU gets onto the PCB, can I just remove it or is this stuff pretty tacky that it won't spill onto the PCB? I don't want to fry my chip.
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