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[Official] Delidded Club / Guide - Page 3397

post #33961 of 34072
Quote:
Originally Posted by postem View Post

Did you cleared the glue or just used the tool to break the glue dots?

Please use nail polish remover to remove old loctite gel superglue!!! it comes RIGHT off! then clean off the residue left by the acetone/nail polish remover with isopropyl alcohol.

And yes, putting too much new silicon/rtv can possibly create a bigger gap between the die and IHS when doing a relid. This is why the 4 dot superglue method is recommended.

I personally like to sand down the part of the IHS that makes contact with the PCB to make absolutely sure the gap between the IHS and die is as thin as possible. Just make sure you don't sand it down too far where it becomes entirely flat.. although with a relid tool even then it shouldn't be that big of a deal. But the end goal is to make the gap between the IHS and die as small as possible while also keeping the mounting pressure even across the entire CPU PCB. I ran a naked ivy kit with my 4790k for a bit and ended up with a slightly warped pcb. Ended up just relidding it as the temps weren't even that great.
Edited by IMI4tth3w - 11/16/17 at 4:58pm
post #33962 of 34072
Quote:
Originally Posted by IMI4tth3w View Post

Please use nail polish remover to remove old loctite gel superglue!!! it comes RIGHT off! then clean off the residue left by the acetone/nail polish remover with isopropyl alcohol.

And yes, putting too much new silicon/rtv can possibly create a bigger gap between the die and IHS when doing a relid. This is why the 4 dot superglue method is recommended.

I personally like to sand down the part of the IHS that makes contact with the PCB to make absolutely sure the gap between the IHS and die is as thin as possible. Just make sure you don't sand it down too far where it becomes entirely flat.. although with a relid tool even then it shouldn't be that big of a deal. But the end goal is to make the gap between the IHS and die as small as possible while also keeping the mounting pressure even across the entire CPU PCB. I ran a naked ivy kit with my 4790k for a bit and ended up with a slightly warped pcb. Ended up just relidding it as the temps weren't even that great.

I'm not planning in breaking or opening my 7700k it has the same temps from release day, stable as ever.

I also like the superglue,the only issues I can think and bother me
1) the glue has a service temperature of 82c. I know the IHS probably don't reach this, even my chip didn't reach 70c+ even on Brazilian summer.
2) z height. If your die for whatever reason needs additional space, like the spinning IHS, gluing could be worse?
post #33963 of 34072
Hello everybody super new here but I'm gonna jump right in.. I'm going to be delidding my 7700k here in few days I have a question. I've been reading and reading and watching information on this subject for months and I'm ready to go through with procedure. I just have this nagging sensation to put the tiniest bead of rtv around the die before I shut it back up. Can someone tell me if and why this would be a horrific idea.My thinking is to seal the liquid metal in place. I'm a big time garage tinkerer and I'm always modifying this and cutting on that. So I need someone to tell me to calm down or thoughtfully go ahead.
post #33964 of 34072
Quote:
Originally Posted by GoodDeath View Post

Hello everybody super new here but I'm gonna jump right in.. I'm going to be delidding my 7700k here in few days I have a question. I've been reading and reading and watching information on this subject for months and I'm ready to go through with procedure. I just have this nagging sensation to put the tiniest bead of rtv around the die before I shut it back up. Can someone tell me if and why this would be a horrific idea.My thinking is to seal the liquid metal in place. I'm a big time garage tinkerer and I'm always modifying this and cutting on that. So I need someone to tell me to calm down or thoughtfully go ahead.

If you check out how to properly apply the liquid metal, then there would be no need to use any RTV around the die. There are many posts in this thread on how to properly apply the liquid metal. thumb.gif
post #33965 of 34072
First dilid with success on a fresh 8700k! Hoping to be added wink.gifWarning: Spoiler! (Click to show)






OCN name: foxlite
CPU: Intel i7 8700k
on die-TIM: Thermal Grizzly Conductonaut
ihs-TIM: Thermal Grizzly Kryonaut
Mhz gained: 2000Mhz
OC after delid: 5.2Ghz
Temp drops: Unkown (delid performed out of box)
CPUZ Validation: see image (will post link ASAP when tested in my rig and not on my workbench)
vlidation screen shots: Warning: Spoiler! (Click to show)


post #33966 of 34072
Been looking into delidding my 8700k, and the glue method seems to be a nice compromise between the two extremes of sealing or not sealing. Just wanted to confirm that I have to use a gel-based super glue, and it's a dab at each corner of the IHS on the outside?
post #33967 of 34072
Quote:
Originally Posted by UnknownSoldier View Post

Been looking into delidding my 8700k, and the glue method seems to be a nice compromise between the two extremes of sealing or not sealing. Just wanted to confirm that I have to use a gel-based super glue, and it's a dab at each corner of the IHS on the outside?
I used a tiny amount of high temp gasket sealer for my delid, left spacing and a really thin application, I feel like this is a better method for resealing, my reasoning here is that if I need to ever delid it again I have less chance of damaging the silicon, super glue can cause damage to the area the ihs is attached to if you need to delid it again for any reason.
post #33968 of 34072
Quote:
Originally Posted by foxlite View Post

I used a tiny amount of high temp gasket sealer for my delid, left spacing and a really thin application, I feel like this is a better method for resealing, my reasoning here is that if I need to ever delid it again I have less chance of damaging the silicon, super glue can cause damage to the area the ihs is attached to if you need to delid it again for any reason.

Doesn't acetone just dissolve the glue nice and easy?
post #33969 of 34072
Quote:
Originally Posted by UnknownSoldier View Post

Doesn't acetone just dissolve the glue nice and easy?
Don't know about easy, but yes. I've done it. Pro tip is giving the chip a bath in acetone upside down..IHS side down.. Just keep the liquid below the gap with the PCB. Then many patient swabs with cotton and acetone will entirely remove the glue.
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Gaming Rig
(14 items)
 
  
CPUMotherboardGraphicsRAM
Intel 7700K ASRock Z270 K6 Gaming Fatality RX VEGA 64 TridentZ 3600 15-15-35 
Hard DriveCoolingOSMonitor
Samsung EVO 850 Corsair H115i Windows 10 Nixeus NX-Vue24a 
KeyboardPowerCaseMouse
Corsair K70 Rapidfire  Corsair RM850X Corsair 600Q Logitech G303 
Mouse PadAudio
Steelseries Qck+ Integrated  
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post #33970 of 34072
how often should liquid metal applied to the die be replaced? Annually? Or can you get away with waiting longer?
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