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[Official] Delidded Club / Guide - Page 568

post #5671 of 33991
Quote:
Originally Posted by LukeJoseph View Post

I Delided my 3570k this past Saturday. I do have a few suggestions for those nervous, not sure what to do, etc.... This is the first time I have ever done a delid, but I do have a lot of experience with "similar" processes.
I personally did not see a large decrease in temps. But that may be due to the fact that I used AS5 on the die. I have ordered the liquid ultra. Once I get that I will take pics to verify.
My buddy is building a Ivy system here in a couple weeks, so I will make a proper tutorial video.

first, gratz on the successfull delid thumb.gif
ive used AS5 at first too, waiting for liquid pro to arrive,
saw a 5-10C tempdrop with AS5, later using liquid pro on the die etc another 15+C
looking forward to your tutorial smile.gif
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post #5672 of 33991
Quote:
Originally Posted by PuffinMyLye View Post

I'll have to get back to you on that. It lasted 12+ hrs prime and now I'm testing it again with tighter RAM timings and it's been running 4 hours so far. Once I'm done with this test I'll be using it throughout the week just as you described so I'll report back.

please do. mine was passing everything at full load that I threw at it and could idle for hours ... and yet when I sometimes pressed a stupid button in a browser (checked with cpu-z it was causing a temporary jump from 16x to 50x multi) it would BSOD (124) sometimes. memory was not an issue, I have seen it with all memory clocks. what's worse it wasn't dependent also on neither PLL, VCCIO, VCCSA or actually anything I could find. it was just like sometimes the offset voltage was getting out of sync with multiplier and causing a rare crash.

interested if you see this too. I use ASUS MVE board with BIOS 704 (works best for me), but I have seen the same on latest BIOS 1501 as well, however this one was calling for lower offset to have this chip stable at very same 50x multi clock (not affecting clocks below this multi), which makes me think it IS a BIOS issue on my board.
post #5673 of 33991
Thanks all for the info. I now have some Pro on the way. To bad I can't buy it local. Or even find out exactly what it is made of and just make it myself, kind of surprised no one has yet lol.

Think I will just do the Pro on the Die and then some AS5 (or similar), between the IHS and heatsink. My IHS might be concave, I looked though, and it looked pretty damn flat, will put a straight edge on it to be sure. I have a Delta between Core 1 and Core 3 (3 being the hottest) of about 12-14 degrees. But only underload. At idle 3 is actually the coolest, but only my like 1-2c so that is fine.
post #5674 of 33991
Quote:
Originally Posted by LukeJoseph View Post

Thanks all for the info. I now have some Pro on the way. To bad I can't buy it local. Or even find out exactly what it is made of and just make it myself, kind of surprised no one has yet lol.
Think I will just do the Pro on the Die and then some AS5 (or similar), between the IHS and heatsink. My IHS might be concave, I looked though, and it looked pretty damn flat, will put a straight edge on it to be sure. I have a Delta between Core 1 and Core 3 (3 being the hottest) of about 12-14 degrees. But only underload. At idle 3 is actually the coolest, but only my like 1-2c so that is fine.

LP is actually made of Gallium...You can try to find some of it, not sure if it will be easy or cheaper.
post #5675 of 33991
AS5 has a longer "curing time" than other TIMs. It is not at full efficiency until it has been through 200 hours of "heat cycling". i haven't noticed any mention of that here, so just for those who didn't know, AS5 improves its cooling performance over a break in period. It used to tell you this in the instructions that came with it.
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post #5676 of 33991
Quote:
Originally Posted by PuffinMyLye View Post

Hey Hokies, will 5.1 @ 1.414vcore suffice for the e-peen? biggrin.gif

That is awsome....drool.gif

EDIT: 400mhz more than me with the same vcore and HT on!!!!! buttkick.gif
Edited by chris-br - 12/18/12 at 1:40am
post #5677 of 33991
Thread Starter 
Quote:
Originally Posted by LukeJoseph View Post

I Delided my 3570k this past Saturday. I do have a few suggestions for those nervous, not sure what to do, etc.... This is the first time I have ever done a delid, but I do have a lot of experience with "similar" processes.
The number 1 thing I would suggest, a Heat Gun. You can pick one up from Walmart for cheap. Keep it on the low setting and don't ever hold the gun in one place, just move it left to fit about 8-10" away from the chip. Once warm enough the chip will be hot to the touch. Not burn your self hot, but I would suggest a glove (I used one of my mechanic gloves, as they are thin enough for good feel, but good for heat).
I have a slew of different style razor blades/exacto's and what I found best by far was just a standard plain ol razor. Problem with exacto's, or break away blades, is that are made to be held at the handle, away from the blade. When using a regular razor, you can actually lay the razor flat on th chip, and if you just bend it a tiny bit (like a U), you can almost ensure you will not nick the chip. And if you slip at all, the you should just hit th IHS. Oh and use a new blade, don't pull the blade out of your box cutter that has been sitting around for a year or two.
Of course, always cut away from yourself. I actually put the chip up on its side, and cut down.
The whole idea of the heat gun, is to get the glue soft. The softer the glue, the easier the cut. And the less force you use to cut, the less chance of something going wrong.
I personally did not see a large decrease in temps. But that may be due to the fact that I used AS5 on the die. I have ordered the liquid ultra. Once I get that I will take pics to verify.
My buddy is building a Ivy system here in a couple weeks, so I will make a proper tutorial video.

Im making a tutorial video once I get my second chip through RMA. Don't worry about it Ill be taking lots of pics and many different ways to delid. Video will probably be made as well. People tel to not watch videos, Ill still make one though, wont be pretty but it'll be one. Will include a short detail of liquid pro on the die. Along with the IHS concave and such info.

Thanks though for the info! I also completely agree on the normal blade. Exactos scare me with the handling on them, even with the scare of a blade snapping.

Gratz on the new successful delid and hope you enjoyed the info here. Now hurry up and give us your info so we can give you our amazing sig.
Quote:
Originally Posted by dmanstasiu View Post

I was wondering as well ... what are the specific advatnages of Ultra vs pro?
If Pro is liquid metal, then what's Ultra...
"Coollaboratory Liquid Ultra 100% Metal Thermal Interface Material"
"Coollaboratory Liquid PRO Thermal Interface Material"

Ultra is liquid metal but with ultra and pro there are slight differences. With pro it is all about performance on the thermal conductivity. Now with Ultra you have great performance but not Pros amazing performance standard, BUT is much easier to remove. Honestly with the extra element in Ultra pro isn't that hard to remove.

Again to make it easy. Pro = best performance out there. Ultra = very good performance, and easier to remove.
Quote:
Originally Posted by eBombzor View Post

Wait, you gotta put the IHS back on after delidding? I just thought you put the heatsink on top of the die...

You can and this can result in crazy temp drops in one way only. That one way is a custom loop, with custom loops you have a much better heat dissipation area to your disposal so with items like the H100 you can't really do that.
Quote:
Originally Posted by VonDutch View Post

first, gratz on the successfull delid thumb.gif
ive used AS5 at first too, waiting for liquid pro to arrive,
saw a 5-10C tempdrop with AS5, later using liquid pro on the die etc another 15+C
looking forward to your tutorial smile.gif

Like I said ill be making a couple diffferent versions. tongue.gif
Quote:
Originally Posted by alancsalt View Post

AS5 has a longer "curing time" than other TIMs. It is not at full efficiency until it has been through 200 hours of "heat cycling". i haven't noticed any mention of that here, so just for those who didn't know, AS5 improves its cooling performance over a break in period. It used to tell you this in the instructions that came with it.

Will remember this for the future.
post #5678 of 33991
Please add me to the list smile.gif

I delidded the chip with zalman zm-stg2 tim and for cooler surface i used zalman zm stg2 too. Here are the photos before and after;

Before Delidded room temp 23.2



After Delidded room temp 24.1



10 °C difference which is good for a 4.1 w/mk conductivity tim. i purchased alphacool 82 w/mk liquid metal which will arrive in 2 days. I'm getting excited maaan thumb.gif
Edited by I_shot - 12/18/12 at 8:02am
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post #5679 of 33991
Quote:
Originally Posted by I_shot View Post

Please add me to the list smile.gif
I delidded the chip with zalman zm-stg2 tim and for cooler surface i used zalman zm stg2 too. Here are the photos before and after;
Before Delidded room temp 23.2

After Delidded room temp 24.1

Nicely done, however you could probably lower temps even more if you used Liquid Pro. I'm of the belief that if anyone is going to put in the time and effort while risking damage to their CPU, why not get the absolute maximum benefit by using the best TIM you can.
post #5680 of 33991
Just ordered myself some Liquid Pro, hopefully it'll arrive on Thursday and I can get this delidded over the weekend, getting tired of seeing 80C at 4.5GHz.
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