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[Official] Delidded Club / Guide - Page 573

post #5721 of 33567
So is the gallium I put on my die in a liquid form all the time? I thought it would harden up. If its always a liquid then it would seem that my PC standing upright would let it all ooze off the die. I know there's pressure on the die but it just doesn't seem right. Do they add something to liquid pro to allow it to harden after it has been spread really thin?
post #5722 of 33567
Quote:
Originally Posted by stickg1 View Post

So is the gallium I put on my die in a liquid form all the time? I thought it would harden up. If its always a liquid then it would seem that my PC standing upright would let it all ooze off the die. I know there's pressure on the die but it just doesn't seem right. Do they add something to liquid pro to allow it to harden after it has been spread really thin?

The process of heating and cooling hardens it, thats why you need to lap to get pro off, because it attaches itself to the block, ultra is different. It hardens, also very thin layer so nothing would EVER drip. Even if it did it wouldnt do anything ive booted with ultra on my cpu's pcb traces lol, pro I wouldnt want to get on a pcb >.>
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post #5723 of 33567
its not 100% pure gallium, they at some other stuff as well,
and look at other compounds, they will harden also over time..


it will be pushed out if you put on to much tho, like this,

thin layers is the key ..

o , just found this,

"The liquid metal behaves similar to mercury. Application of the thermal compound should be done with a small, lint-free brush to distribute the compound evenly across processor or heat sink. After installation the Liquid PRO will mature in 48 hours. It solidifies at that time and achieves its optimal cooling performance."
Edited by VonDutch - 12/19/12 at 6:06am
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post #5724 of 33567
Quote:
Originally Posted by VonDutch View Post

its not 100% pure gallium, they at some other stuff as well,
and look at other compounds, they will harden also over time..

it will be pushed out if you put on to much tho, like this,

thin layers is the key ..
o , just found this,
"The liquid metal behaves similar to mercury. Application of the thermal compound should be done with a small, lint-free brush to distribute the compound evenly across processor or heat sink. After installation the Liquid PRO will mature in 48 hours. It solidifies at that time and achieves its optimal cooling performance."

I dont believe that Mature time... My cpu its on the same temps from the first time i fired up.
Edited by chris-br - 12/19/12 at 6:33am
post #5725 of 33567
Quote:
Originally Posted by chris-br View Post

I dont believe that Mature time... My cpu its on the same temps from the first time i fired up.

Me neither, but i dont think it means the same as break-in period, like with AS5,
in this sentence it means in that time "It solidifies ",
what stickg1 was asking about in his post, if it hardens or not smile.gif
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post #5726 of 33567
Quote:
Originally Posted by zGunBLADEz View Post

Trust me if i was behind the desk as a rep on microcenter returns section he would not get away with it... I only need to have in hand a magnifying glass and he would be mine in a couple of seconds XD..
I cannot condone from this kind of behaviors for alot of reasons when you can felt from this kind of practices as a customer yourself im sorry. Him from damaging product under warranty and microcenter for trying to resell a product as new...
I had returned one delided chip to Microcenter before and exchanged it for another batch, the CS rep inspecting it never saw anything because there was nothing to see. If it's done right, then nobody will know ... even Intel ...
Quote:
Originally Posted by chris-br View Post

If still looks like is green on the scratch, you should be good to go.
I actually nicked my last (current) chip's PCB right by IHS, the green layer came off (exposing copper which was undamaged) on the length of around 1/4'' (5-6mm or so), very thin stripe (less than 0.5mm). I caused it because the way I handled the chip during the insertion of blade nicked it the moment the chip's PCB slipped in my other hand (holding it). TBH, I put some super thin layer of silicone on the exposed copper and then a tiny bit of TIM (I believe it was the one containing silver or aluminum particles), chip works perfectly fine, it's the one I've been using for nearly a month biggrin.gif
post #5727 of 33567
I get liquid pro all over the place the first application. I tried to do the die and the inside of the IHS. I tried to hold it still while I locked the socket clamp but it slid to much to the left and was way of center. So I took it all apart again and it was EVERYWHERE. I cleaned it up real good and reapplied as thin as I could on just the die.
post #5728 of 33567
Quote:
Originally Posted by stickg1 View Post

I get liquid pro all over the place the first application. I tried to do the die and the inside of the IHS. I tried to hold it still while I locked the socket clamp but it slid to much to the left and was way of center. So I took it all apart again and it was EVERYWHERE. I cleaned it up real good and reapplied as thin as I could on just the die.

im looking for good pic's to use, to show how little you liquid pro you need on the die,
all i got so far is this one, its about that, or less..



on ihs


its easier to show a pic, then say "about this or that much" to peeps smile.gif
if to much is applied, use the seringe to suck it up again, np ..
Edited by VonDutch - 12/19/12 at 10:37am
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post #5729 of 33567
Does liquid pro require any cure time?

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post #5730 of 33567
I appled to both the die and IHS just as they show in this video and it worked flawlessly.
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