Merry Christmas to all!!! Bigdale7
Originally Posted by Bigdale7
Alrighty! Finished my delid and the good news is it boots.. Pics and app to join will follow.. I used CLP on the die and between the IHS and my H100 block.. the problem is It didn't help lower temps much.. Using prime95 I saw the following
Core 1 - 10C drop
Core 2 - 7C drop
Core 3 4C drop
and Core 4 the same... frustrating.. I have reapplied once aready with no improvement.. what do you suggest?
Very happy I didn't nick the PCB or die.. went pretty well actually.. oh I also lapped the CPU IHS as it was definately concave
, seems your temp gains are smaller than expected. Sounds like you did everything right, but you might need to reapply TIM and remount again just to verify it is right or not as temp gain is normally much better than that.
First though, what are your temps for 4.5GHz @ your vcore now that you are delided. Let us have some data to see if they look good or not. Also, any before and after temp comparison at same clock and voltage. Real data - not just delta.
Maybe your chip was already running cool as the major issue with IB is not the Intel TIM, but the gap. If your chip had better glue application, maybe the IHS was not so high off of the die, and thus not as bad at temps than most IB chips are. If so, that would explain why you would see little gain through delidding.
But I would also strongly consider redoing all the TIM and mounting if it were my rig. I'd want some better temp drops for getting up the guts to delid!!!