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[Official] Delidded Club / Guide - Page 769

post #7681 of 33558
Planning on doing this at the end of the month and had some questions. Is liquid pro better than Ultra and will lapping the inner/outer IHS along with lapping the NH-D14 give better temps? What about putting a thermal pad around the die on the PCB under the IHS?

specs:

CPU - Intel Core i7-3770K 3.5GHz Quad-Core Processor
CPU Fan - Noctua NH-D14 65.0 CFM CPU Cooler
MOBO - Asus SABERTOOTH Z77 ATX LGA1155 Motherboard
GPU - EVGA GeForce GTX 680 2GB Video Card
SSD - SAMSUNG 830 Series 2.5" 256GB SATA III MLC
Ram: G.SKILL Ripjaws X Series 8GB (2 x 4GB) 240-Pin DDR3 SDRAM DDR3 1866

What I already have:

Case: COOLER MASTER HAF 932

PSU: CORSAIR Enthusiast Series CMPSU-850TX 850W

Windows x64 Ultimate
post #7682 of 33558
Quote:
Originally Posted by mystiksinner View Post

Direct die is a dangerous process with little gain. I tried it and didn't see much of a benefit (3-4c). When I first tried it, the system wouldn't post. Turns out the cpu needs compression in the socket to make proper contact with the pins. usually the bracket takes care of that but without it, I had to really tighten down my waterblock to properly socket the cpu. It did post and I did some stress tests but I just didn't see enough of a benefit to justify cooling direct die so I put the lid back on.
Quote:
Originally Posted by Swag View Post

Yes, I didn't see too much of a difference in temps for my try as well. I got a 1C difference which is within the 3C error because it may have just been the ambient or some odd thing happening!

this thumb.gif

why take the extra risk, for prolly little, or no gain at all..
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post #7683 of 33558
Quote:
Originally Posted by Gankfest View Post

Planning on doing this at the end of the month and had some questions. Is liquid pro better than Ultra and will lapping the inner/outer IHS along with lapping the NH-D14 give better temps? What about putting a thermal pad around the die on the PCB under the IHS?

specs:

CPU - Intel Core i7-3770K 3.5GHz Quad-Core Processor
CPU Fan - Noctua NH-D14 65.0 CFM CPU Cooler
MOBO - Asus SABERTOOTH Z77 ATX LGA1155 Motherboard
GPU - EVGA GeForce GTX 680 2GB Video Card
SSD - SAMSUNG 830 Series 2.5" 256GB SATA III MLC
Ram: G.SKILL Ripjaws X Series 8GB (2 x 4GB) 240-Pin DDR3 SDRAM DDR3 1866

What I already have:

Case: COOLER MASTER HAF 932

PSU: CORSAIR Enthusiast Series CMPSU-850TX 850W

Windows x64 Ultimate

they both give about the same results on the die,
ultra is easier to work with, easier to clean later on..
im Pro all the way tho, 25+C tempdrop..

Lapping doesnt always make a difference, it depends on how concave the ihs is really,
but normally, lapping doesnt give a big tempdrop, if any at all..

the thermal pads idk about, i only saw a review somewhere, and they where like, hard to work with,
worse then the other tims they used for that review, no to little gains over other tim's,
but thats on the ihs, no delidding..personally i would just stick to Pro or Ultra on the die,
its has proven to be the best..at least by us smile.gif

found that test/review about the liquid pads,
http://www.xbitlabs.com/articles/coolers/display/thermal-interface-roundup_7.html
scroll down a bit smile.gif
Edited by VonDutch - 1/10/13 at 12:31am
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post #7684 of 33558
Quote:
Lapping doesnt always make a difference, it depends on how concave the ihs is really,
but normally, lapping doesnt give a big tempdrop, if any at all..

I guess from what I read lapping is an issue of space, so I guess if using a good HSF and LP along with a sold ISH it wouldn't make a difference; I just thought Id ask because you guys have more knowledge than I do.

I've never took the ISH of a cpu before, but from reading a lot of guides and watching videos it seems a lot easier then what people make it out to be. Figure if I just use a carpenter razor(Razor in the guide) and take my time working the corners first it shouldn't be an issue. I've read/seen people doing it and killing their chips, but how many of them forced their way in and or didn't reaseach how to do it effectively.
post #7685 of 33558
Quote:
Originally Posted by Gankfest View Post

I guess from what I read lapping is an issue of space, so I guess if using a good HSF and LP along with a sold ISH it wouldn't make a difference; I just thought Id ask because you guys have more knowledge than I do.

I've never took the ISH of a cpu before, but from reading a lot of guides and watching videos it seems a lot easier then what people make it out to be. Figure if I just use a carpenter razor(Razor in the guide) and take my time working the corners first it shouldn't be an issue. I've read/seen people doing it and killing their chips, but how many of them forced their way in and or didn't reaseach how to do it effectively.

issue of space?

this is a example of a concave base plate cooler..


this is after lapping with i think a few strokes with 200/220 or 400 grit


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post #7686 of 33558
lol i have had the same issue with xspc raystorm block.. same as yours... totall bummer.. been through 4 sheets of 2500grit and still not quite there..

good luck with it
post #7687 of 33558
Isn't that good since the middle will concentrate the pressure on the die and get the most contact?
post #7688 of 33558
Quote:
Originally Posted by Notion View Post

lol i have had the same issue with xspc raystorm block.. same as yours... totall bummer.. been through 4 sheets of 2500grit and still not quite there..
good luck with it
Quote:
Originally Posted by Gankfest View Post

Isn't that good since the middle will concentrate the pressure on the die and get the most contact?

guess it depends, i didnt lap mine, and have good temps(difference between cores), bet if i would take a good look, it would be a bit concave at least,
i would only look into lapping, if after delid the temp difference between cores is still big, like 12-15C or more..besides if its a bad mount..
lapping to drop the temps more, of what i see here, doesnt make, or very little, difference,
some just like the shiny mirror looks ..lol




Edited by VonDutch - 1/10/13 at 1:05am
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post #7689 of 33558
Well before lapping i am getting 20+ temp increase at 4.8ghz, but this is with liquid pro on the die and ihs.. basically the water pump failed..blasted cheap thing supplied with the XSPC raystorm 240 kit.. 3rd pump now in 3 months.. but yeah i then noticed the darn thing was rounded.. haven't yet put the pump back in.. will be interesting to see the difference in temp though..
post #7690 of 33558
Quote:
Originally Posted by Notion View Post

Well before lapping i am getting 20+ temp increase at 4.8ghz, but this is with liquid pro on the die and ihs.. basically the water pump failed..blasted cheap thing supplied with the XSPC raystorm 240 kit.. 3rd pump now in 3 months.. but yeah i then noticed the darn thing was rounded.. haven't yet put the pump back in.. will be interesting to see the difference in temp though..

djeez, thats some bad luck then.. 1 broken pump a month..
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