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[Official] Delidded Club / Guide - Page 803

post #8021 of 33557
Im wondering if somebody has test it or seen somebody reusing intel thermal paste once delided for testing??

As everybody blames the thermal paste and have read somewhere else that the main culprit is the contact between the die and ihs because of the glue intel uses. The die dont make a good contact with the ihs because of it...

I know of course with a better tim you are going to see better results.. But just for science!!!

Delid the chip and remove IHS carefully Clean the glue around chip and ihs...

Hoping it do a good contact again...Just for testing... I would have do it but didnt think about it back then...
Edited by zGunBLADEz - 1/12/13 at 10:11pm
post #8022 of 33557
Thread Starter 
Quote:
Originally Posted by zGunBLADEz View Post

Im wondering if somebody has test it or seen somebody reusing intel thermal paste once delided for testing??

As everybody blames the thermal paste and have read somewhere else that the main culprit is the contact between the die and ihs because of the paste intel uses...

I know of course with a better tim you are going to see better results.. But just for science!!!

Delid the chip and remove IHS carefully Clean the glue around chip and ihs...

Hoping it do a good contact again...Just for testing... I would have do it but didnt think about it back then...

I guess you could but with the paste being the way it is I wouldn't be surprised it isn't already dried. I wouldn't recommend it honestly.

With the CLP and the die and IHS coating for you Swag I just put it on the die as for the reason is that when you put it on the IHS underside you can have the possibility of it moving around and getting onto other parts of the PCB wasting it basically.
post #8023 of 33557
Quote:
Originally Posted by Valgaur View Post

I guess you could but with the paste being the way it is I wouldn't be surprised it isn't already dried. I wouldn't recommend it honestly.

With the CLP and the die and IHS coating for you Swag I just put it on the die as for the reason is that when you put it on the IHS underside you can have the possibility of it moving around and getting onto other parts of the PCB wasting it basically.

I know that.. Mine was still wet i regret not testing it lol....

But im trying to find if intels tim is the problem perse or the glue used, making the die and ihs to not make a good contact or a combination of both problems...

Knowing how problematic is a bad seated cpu cooler im wondering this... Which is actually the same issues lol...
post #8024 of 33557
Thread Starter 
Quote:
Originally Posted by zGunBLADEz View Post

I know that.. Mine was still wet i regret not testing it lol....

But im trying to find if intels tim is the problem perse or the glue used, making the die and ihs to not make a good contact or a combination of both problems...

Knowing how problematic is a bad seated cpu cooler im wondering this... Which is actually the same issues lol...

The problem isn't the TIM at all. it's the distance from the IHS and the die itself mainly. I guess you could say it is the glue mainly as thats what's making the IHS farther from the die because the glue hardend.
post #8025 of 33557
Quote:
Originally Posted by Valgaur View Post

Quote:
Originally Posted by zGunBLADEz View Post

Im wondering if somebody has test it or seen somebody reusing intel thermal paste once delided for testing??

As everybody blames the thermal paste and have read somewhere else that the main culprit is the contact between the die and ihs because of the paste intel uses...

I know of course with a better tim you are going to see better results.. But just for science!!!

Delid the chip and remove IHS carefully Clean the glue around chip and ihs...

Hoping it do a good contact again...Just for testing... I would have do it but didnt think about it back then...

I guess you could but with the paste being the way it is I wouldn't be surprised it isn't already dried. I wouldn't recommend it honestly.

With the CLP and the die and IHS coating for you Swag I just put it on the die as for the reason is that when you put it on the IHS underside you can have the possibility of it moving around and getting onto other parts of the PCB wasting it basically.

I was thinking, if you put it under the IHS too, it'll waste a lot of CLP and it introduces air bubbles! Thanks again Val! +rep and to you too PCWar!
Quote:
Originally Posted by zGunBLADEz View Post

Quote:
Originally Posted by Valgaur View Post

I guess you could but with the paste being the way it is I wouldn't be surprised it isn't already dried. I wouldn't recommend it honestly.

With the CLP and the die and IHS coating for you Swag I just put it on the die as for the reason is that when you put it on the IHS underside you can have the possibility of it moving around and getting onto other parts of the PCB wasting it basically.

I know that.. Mine was still wet i regret not testing it lol....

But im trying to find if intels tim is the problem perse or the glue used, making the die and ihs to not make a good contact or a combination of both problems...

Knowing how problematic is a bad seated cpu cooler im wondering this... Which is actually the same issues lol...

Actually, I did a test where once I delidded, I took off the TIM and applied a really crappy TIM (with the glue still there). Meaning that the gap made by the glue was still there.
Worst TIM out possible was what I used (went out of my way to get it too!) TIM Used
And used the same TIM for after I took out the glue:

Temps went down considerably after taking out the glue, sorry I didn't take pictures, I actually didn't expect delidding to become an enthusiast recognized thing with Ivy Bridge. tongue.gif So many people now!
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post #8026 of 33557
Quote:
Originally Posted by Swag View Post

I was thinking, if you put it under the IHS too, it'll waste a lot of CLP and it introduces air bubbles! Thanks again Val! +rep and to you too PCWar!
Actually, I did a test where once I delidded, I took off the TIM and applied a really crappy TIM (with the glue still there). Meaning that the gap made by the glue was still there.
Worst TIM out possible was what I used (went out of my way to get it too!) TIM Used
And used the same TIM for after I took out the glue:

Temps went down considerably after taking out the glue, sorry I didn't take pictures, I actually didn't expect delidding to become an enthusiast recognized thing with Ivy Bridge. tongue.gif So many people now!

That stuff isn't too bad for freezing (can pull the pot off a cpu at -180° & it wasn't stuck like glue or turned to powder), have never tried it for anything that wasn't subzero though. Probably like ceramique, fine for phase & DICE but not the best choice for air cooling.
    
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post #8027 of 33557
Hey Ftw i have a question for you btw...

My coldest core is core1 as you see here in this picture

Why it idles higher temp as the other cores..

Now when i do a load on the cpu 100%
look at this


It just happens at those low temps tho...
post #8028 of 33557
Quote:
Originally Posted by FtW 420 View Post

Quote:
Originally Posted by Swag View Post

I was thinking, if you put it under the IHS too, it'll waste a lot of CLP and it introduces air bubbles! Thanks again Val! +rep and to you too PCWar!
Actually, I did a test where once I delidded, I took off the TIM and applied a really crappy TIM (with the glue still there). Meaning that the gap made by the glue was still there.
Worst TIM out possible was what I used (went out of my way to get it too!) TIM Used
And used the same TIM for after I took out the glue:

Temps went down considerably after taking out the glue, sorry I didn't take pictures, I actually didn't expect delidding to become an enthusiast recognized thing with Ivy Bridge. tongue.gif So many people now!

That stuff isn't too bad for freezing (can pull the pot off a cpu at -180° & it wasn't stuck like glue or turned to powder), have never tried it for anything that wasn't subzero though. Probably like ceramique, fine for phase & DICE but not the best choice for air cooling.

Yea, I didn't try it at sub-zero, with sub-zero I used my trust Shin-Etsu. tongue.gif How do you guys check your RAM OC? I just ran Cinebench and it passed so I assume it's working... 2400MHz! tongue.gif
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Samsung 830 Crucial M4 Corsair H100i Windows 7 
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post #8029 of 33557
Quote:
Originally Posted by zGunBLADEz View Post

Hey Ftw i have a question for you btw...

My coldest core is core1 as you see here in this picture Warning: Spoiler! (Click to show)
Why it idles higher temp as the other cores..

Now when i do a load on the cpu 100%
look at this Warning: Spoiler! (Click to show)

It just happens at those low temps tho...

Because software sucks at reading Idle temps, that's why. Only at load temps these programs are good enough to use.
Swag's Venus
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CPUMotherboardGraphicsRAM
i5 3570k @ 4.8GHz Asus Maximus V Gene EVGA GTX 680 G.Skill RipJaws X 16GB (2x8GB) 
Hard DriveHard DriveCoolingOS
Samsung 830 Crucial M4 Corsair H100i Windows 7 
MonitorMonitorKeyboardPower
Dell U2713HM Crossover 27Q (3x) Ducky TKL OCN-Version Corsair AX650 
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Swag's Venus
(18 items)
 
  
CPUMotherboardGraphicsRAM
i5 3570k @ 4.8GHz Asus Maximus V Gene EVGA GTX 680 G.Skill RipJaws X 16GB (2x8GB) 
Hard DriveHard DriveCoolingOS
Samsung 830 Crucial M4 Corsair H100i Windows 7 
MonitorMonitorKeyboardPower
Dell U2713HM Crossover 27Q (3x) Ducky TKL OCN-Version Corsair AX650 
CaseMouseMouse PadAudio
Corsair C70 (Military Green) Razer DeathAdder BE Steelseries QCK+ Beats Pro 
AudioAudio
Bose Surround Sound 5.1 Beats Tours 
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post #8030 of 33557
Quote:
Originally Posted by Swag View Post

I was thinking, if you put it under the IHS too, it'll waste a lot of CLP and it introduces air bubbles! Thanks again Val! +rep and to you too PCWar!
Actually, I did a test where once I delidded, I took off the TIM and applied a really crappy TIM (with the glue still there). Meaning that the gap made by the glue was still there.
Worst TIM out possible was what I used (went out of my way to get it too!) TIM Used
And used the same TIM for after I took out the glue:

Temps went down considerably after taking out the glue, sorry I didn't take pictures, I actually didn't expect delidding to become an enthusiast recognized thing with Ivy Bridge. tongue.gif So many people now!
repped XD
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