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[Official] Delidded Club / Guide - Page 913

post #9121 of 33816
Quote:
Originally Posted by [CyGnus] View Post

use that amd clean driver app they released days a go and give it another try with 13.2b

just installed fresh windows smile.gif
think thats the best way after a while,
and changing/updating drivers, ocing with crashes etc to much,
so i go with the new drivers on a new windows,
i downloaded the 13.2b drivers from guru3d, thats ok right..
should i use another site to download from?
first install all updates from microsoft? sp1 is already pre-installed from cd
Edited by VonDutch - 1/20/13 at 5:16am
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post #9122 of 33816
well i usually after win install follow this: Chip7 drivers, vga, lan, sound, office and all win updates
post #9123 of 33816
yea, thats done, first set updates microsoft installed,
vga is windows default now,
but i needed to separate download the .NET Framework 4.0 for the 12.11 drivers to run on a fresh copy, they are included in the new 13.2 driver i think ..nvm, will get it done ,

laterz wink.gif

edit,
bit harder to install then " official" drivers,
but its up and running now smile.gif

fresh install sure did good for my cinebench score ..lol

4.8ghz, 9.78 points cinebench biggrin.gif

Edited by VonDutch - 1/20/13 at 6:11am
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post #9124 of 33816
Ok guys, update here, I've removed the glue and put a lot less TIM on and at stock Core 0 is at 89C in Prime Load Core 4 is at 38-39C Prime load, so I've gone wrong somewhere.

Gonna strip down and try again

EDIT

Ok, stripped her down cleaned everything off and re did all the paste. Back to normal again. I did put a bit more paste on the DIE this time as the small dot in the middle I tried really didn't get good coverage. So I chose to go with a thin line down the middle of the DIE instead.

Also I have noticed that by removing the remaining glue from the PCB it has made positioning the IHS a little more tricky, I guess the glue added some resistance to the surfaces stopping the IHS moving around so easily so I took more care in positioning the IHS.

I also took more care in putting the WC block back on, since I'm not draining I'm sort of swinging the block around (its on rotary fittings) and as I swung it back into place it was pushing the paste around on the IHS, perhaps not the DIE though as thats quite fixed when the bracket is down.

Going to do another Prime run, however it looks like I'm still achieving around a 15C drop. Next step will be Liquid Pro.

I also took a couple photos, no idea how good they'll be, as it wasn't with the gf's DSLR and just a point and shoot, but I'll upload them, there also from the previous failure I didn't take new ones when I just re did everything.
Edited by Matt26LFC - 1/20/13 at 7:44am
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post #9125 of 33816
I have both TIMS and just for easy of use quantity/perf for your (($$$)) i prefer the PK1 on the IHS.. Specially for the ease of removal alone....

PK1 getting blowing away by 1C from CLP/U or INDIGO using it on the IHS is out of proportion (which can be gained down the line wth a better equipment on your cooling/case setup XD) and very exaggerated like almost anything i read in this forum related to ((COOLING STUFF)) my friend...

I do like CLP/U on the die tho XD.. Thats where it really woks best.
Edited by zGunBLADEz - 1/20/13 at 7:53am
post #9126 of 33816
I never actually put down my info for the "club". I was giving my chip a few days to set in with the thermal paste. So here's my recordings:


OCN name: MegaWatz
CPU: i5-3570K
on die-TIM: AS5
ihs-TIM: AS5
Mhz gained: 0
OC after delid: 4.5Ghz
Temp drops: 0
CPU-Z validation of max OC: http://valid.canardpc.com/2660685
Photo of delidded crap chip: Warning: Picture (Click to show)

With those stats does anyone want to donate some CLP/U? lol
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post #9127 of 33816
Quote:
Originally Posted by megawatz View Post

I never actually put down my info for the "club". I was giving my chip a few days to set in with the thermal paste. So here's my recordings:


OCN name: MegaWatz
CPU: i5-3570K
on die-TIM: AS5
ihs-TIM: AS5
Mhz gained: 0
OC after delid: 4.5Ghz
Temp drops: 0
CPU-Z validation of max OC: http://valid.canardpc.com/2660685
[/SPOILER]

With those stats does anyone want to donate some CLP/U? lol

How do you apply the tim?

Maybe you got one of the cpus with fixed gap between die and ihs and dont notice the difference like we did..
Edited by zGunBLADEz - 1/20/13 at 8:01am
post #9128 of 33816
You should still have a slight temp drop with AS5. Make sure you removed all the black glue, and perhaps you need to polish the lips of the IHS so it sits closer to the die. That's what I started doing and I get better results.

Also I'm a huge fan of the Antec Formula 7 TIM. Diamond based like the IC Diamond and its been widely available at local stores like Staples or Best Buy so if I run out theres no waiting. I put it on every GPU I get and experience 5-15C temp drops. It's very thick though and spreading is difficult so I usually just use the grain of rice in the center method.
post #9129 of 33816
Quote:
Originally Posted by Hokies83 View Post

I build for silence...

+1

Dont see the point on water cooling when the crap is gonna sound worst that went you jumped from air cooling...
post #9130 of 33816
Quote:
Originally Posted by zGunBLADEz View Post

How do you apply the tim?

Maybe you got one of the cpus with fixed gap between die and ihs and dont notice the difference like we did..

My CPUs (besides Core0) have been more consistent than ever. Core3 usually liked to roll with Core0 temps, but I guess they're not friends anymore.

Quote:
Originally Posted by stickg1 View Post

You should still have a slight temp drop with AS5. Make sure you removed all the black glue, and perhaps you need to polish the lips of the IHS so it sits closer to the die. That's what I started doing and I get better results.

Also I'm a huge fan of the Antec Formula 7 TIM. Diamond based like the IC Diamond and its been widely available at local stores like Staples or Best Buy so if I run out theres no waiting. I put it on every GPU I get and experience 5-15C temp drops. It's very thick though and spreading is difficult so I usually just use the grain of rice in the center method.

I removed as much of the black stuff as I could without damaging the chip. Then again, I don't have finger nails. I might try with a CC and see if that gets more off of it, but it looked to me like I removed most of it off.

No, seriously though, anyone want to donate some thermal paste? haha. I'll trade ya for some AS5 thumb.gif
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White Flood
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