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[Official] Delidded Club / Guide - Page 945

post #9441 of 34072
I've got a quick question about delidding a 3570K, I've seen several processes of taking the IHS off of the chip, and then applying different TIM's to the die, what then do you do to re-attach the IHS back to the chip? some sort of adhesive?
Also one other question, should I bother sourcing myself some Liquid Pro/Ultra or just use some GC Extreme on it? (That I have laying around) Is there that big of a difference between the two? also has anyone bothered to lap their IHS after removal? or should I just not bother and use something like IX or Liquid Pro, GC Extreme for contact with my water block?
post #9442 of 34072
Quote:
Originally Posted by GHADthc View Post

I've got a quick question about delidding a 3570K, I've seen several processes of taking the IHS off of the chip, and then applying different TIM's to the die, what then do you do to re-attach the IHS back to the chip? some sort of adhesive?
Also one other question, should I bother sourcing myself some Liquid Pro/Ultra or just use some GC Extreme on it? (That I have laying around) Is there that big of a difference between the two? also has anyone bothered to lap their IHS after removal? or should I just not bother and use something like IX or Liquid Pro, GC Extreme for contact with my water block?

the bracket will hold down the ihs when you place it back, no need for glueing it back on smile.gif
use the liquid pro/ultra on the die, it has the highest w/mk, so it will work best,
on the ihs both tim's will perform good enough, because the heat dispensing area is bigger..
some here have lapped the ihs, but there no big difference in tempdrop doing so,
1-3C max, if any difference at all smile.gif

if after delid, and everything is seated good, and you still have high temps,
or big difference in temps between cores,
then you should look into lapping, it could be the ihs is concave ..
Edited by VonDutch - 1/22/13 at 1:21pm
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post #9443 of 34072
Quote:
Originally Posted by VonDutch View Post

what tim are you using?
Going to use as5 its the best I can get locally and I've seen a delidding review done with it with good temps
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post #9444 of 34072
Quote:
Originally Posted by GHADthc View Post

I've got a quick question about delidding a 3570K, I've seen several processes of taking the IHS off of the chip, and then applying different TIM's to the die, what then do you do to re-attach the IHS back to the chip? some sort of adhesive?
Also one other question, should I bother sourcing myself some Liquid Pro/Ultra or just use some GC Extreme on it? (That I have laying around) Is there that big of a difference between the two? also has anyone bothered to lap their IHS after removal? or should I just not bother and use something like IX or Liquid Pro, GC Extreme for contact with my water block?

Use CLP or Ultra but I recommend pro. Like the other guy said, no glue is needed at all. I plan on lapping my IHS just for the slight imperfections that may exist.
post #9445 of 34072
Quote:
Originally Posted by chann3l View Post

Going to use as5 its the best I can get locally and I've seen a delidding review done with it with good temps

yea np, ive used it too, had to wait for liquid pro to arrive,

AS5 used on the die


liquid pro used on the die


25C difference between using AS5 or liquid pro,
dont care about other reviews etc, i know that liquid pro beats all other tim's when used on the die biggrin.gif

you can also order direct from their site, if you cant get it locally..
http://coollaboratory.com/shop/product_info.php/products_id/26/osCsid/77214543f8f25f1d38dcf0837bd7dd63

another thing to note when using tim's like AS5, is the pump out effect that can happen, due to fast temp going up and down,
ever wondered why the tim on a just delidded ivy looks like this?

you see how much time is spread out on the ihs, its pumped out, making temps even worse after a while.
some notes,

pump out effect, basic concept

"Large and fast decreases in temperature when coupled with HLT instructions.
A usage pattern that alternates between full idle and full load conditions
will cause die temps to swing WIDE AND FAST, particularly with overclocked/overvolted CPUs.

This thermal cycling causes TIM pump-out, wherein the TIM gets ejected and displaced by air,
which is of course not a good thing.

Greases also creep, again worsening the situation."

I think this happens more often with IB because of how quick it heats up and cools off.
The die contact area is so small with such drastic temperatures is another reason.

liquid pro and ultra dont have pump out effect as much as other tims, another reason to use it on the die wink.gif
k, enough of my babbling, i feel like a salesman..lol..G'night guys smile.gif
Edited by VonDutch - 1/22/13 at 1:30pm
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post #9446 of 34072
uh guys is this correct? i can do this benchmark again easily. i did it like 4 times to get this score. reran the test and got same score. im just making sure.

http://www.hwbot.org/submission/2348155_
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post #9447 of 34072
Quote:
Originally Posted by DiamondCut View Post

wha-smiley.png Hire me! I started my own full acrylic build but I couldn't get hardware sponsors so I put it on hold tongue.gif

http://www.overclock.net/t/1285164/scratch-acrylic-case-project-diamond

No, i want a steel test bench and has to be powder coated.. so the phobya is the choice. also,. can fit 2 360 rads one on each side. smile.gif
post #9448 of 34072
Thread Starter 
Quote:
Originally Posted by GHADthc View Post

I've got a quick question about delidding a 3570K, I've seen several processes of taking the IHS off of the chip, and then applying different TIM's to the die, what then do you do to re-attach the IHS back to the chip? some sort of adhesive?
Also one other question, should I bother sourcing myself some Liquid Pro/Ultra or just use some GC Extreme on it? (That I have laying around) Is there that big of a difference between the two? also has anyone bothered to lap their IHS after removal? or should I just not bother and use something like IX or Liquid Pro, GC Extreme for contact with my water block?

I left a small amount of glue on the PCB to keep it still but I was worried about the traces so don't be afraid and make that baby's butt shine! thumb.gif Also with the Lapping don't do it just in case of a issue with the chip so you might be able to fix it. I loved IX for my IHS I have one more application left to and I'm very excited to use it again.

I really need to do that review of it as well. new chip should be here this week!.... im uuuuber excited wheee.gif
Quote:
Originally Posted by chann3l View Post

Going to use as5 its the best I can get locally and I've seen a delidding review done with it with good temps

I don't like as5 look at the OP and check out the TIM list I added to there just look at the thermal movements of Liquid pro/ ultra vs as5 it's amazing stuff. That's why all of us use it! biggrin.gif
post #9449 of 34072
Quote:
Originally Posted by Vi0lence View Post

uh guys is this correct? i can do this benchmark again easily. i did it like 4 times to get this score. reran the test and got same score. im just making sure.

http://www.hwbot.org/submission/2348155_

looks like it, i can only get to 10.32 at that speed
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post #9450 of 34072
Quote:
Originally Posted by Valgaur View Post

I left a small amount of glue on the PCB to keep it still but I was worried about the traces so don't be afraid and make that baby's butt shine! thumb.gif Also with the Lapping don't do it just in case of a issue with the chip so you might be able to fix it. I loved IX for my IHS I have one more application left to and I'm very excited to use it again.

I really need to do that review of it as well. new chip should be here this week!.... im uuuuber excited wheee.gif
I don't like as5 look at the OP and check out the TIM list I added to there just look at the thermal movements of Liquid pro/ ultra vs as5 it's amazing stuff. That's why all of us use it! biggrin.gif

we have such good timing, i go to bed, and you wake up ..hahaha biggrin.gif
G'night boss wink.gif
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