Originally Posted by Benjiw
I don't understand why you delidded a soldered chip which doesn't suffer any of the issues that Intel chips do hence why they get delidded, could you explain why? are you using a naked mounting kit or reusing the IHS in which case... why?
Mostly for the fun of it, and some portion of last resort cause I was disappointed in how it clocked.
I had started to get more interested in overclocking lately and bought the 8370E fairly cheap cause these new chips seemed to clock fine and with fairly low voltages.
It is a lottery and i lost, this was a pig chip needing almost 1.6V to get 5GHz stable and that got too hot for my liking.
To be fair it has the characteristics of the newer chips of low voltages but it seems to hit a wall at 4.8GHz where it took much more voltage to get stable, otherwise it would cause system freeze.
My previous 8350 behaved about the same with frequency but threw errors instead if freezing if voltages were too low.
The new chip was basically as bad/good as my previous 8350 but different behavior, about the same voltage for the same clocks in the region 4.8+GHz.
As others have pointed out, delidding has been done before so I knew it could work and I was prepared to sacrifice the chip as I had the 8350 as a spare.
I pondered around either lapping or delidding in search of little better cooling, so I could perhaps run 5GHz stable at acceptable temps.
In the end i thought "eff it" if i can get the waterblock closer to the heat source then I'll go for it.
The water is what is cooling the die, and I think it would be better, although not by much, to have die-TIM-waterblock-water and avoid having solder and a copper IHS between the die and TIM-waterblock-water...
Sure the soldered IHS is much better than the way intel chips are made, but would it be better with no IHS at all?
Anyhow, it all turned out fine, the chip survived and is running fine now.
Voltage requirements for the same frequency has not changed but it runs about 5 degrees cooler than before the de-lid, however, I'm not sure if that is all due to the de-lid or not.
Because shortly after the de-lid, had basically just verified that the chip worked, I rebuilt the PC, this time adding waterblocks to the saberkitty and a fan blowing on the back of the socket.
So any temperature drop could have been caused by any of these modifications, or most likely a combination of them all...
I mount the EK supremacy waterblock with its standard AMD mounting kit to the naked die with CLU in between.
With the IHS gone the waterblock sits a little deeper than before, thereby loosing some mounting pressure from the springs.
I'm not sure how much pressure a naked die should have but I'm driving the mounting nuts until they stop, in small and even increments.
That way i would think that is is even mounting pressure from all springs, as the nuts are all tightened down to the bottom.
I have not yet cracked the die at least but i guess there is a real possibility, though I suspect it is more dangerous to have uneven preassure than too much and even pressure.
As I said before, I do NOT recommend this but it is not impossible.
You just have to be willing to potentially kill the chip, but then again, how is this any different from say suicide runs pumping insane voltages through a chip?
All in the name of good fun eh?