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[OFFICIAL] FX-8320/FX-8350 Vishera Owners Club - Page 4760

post #47591 of 67890
Yup, those are my buddies. Awesome bunch of guys. I'm not in the bench off but I am a Mod over at CP. wink.gif
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post #47592 of 67890
Hello again guys.
I must bother you with,i hope, final rig for my friend.smile.gif

ASUS SABERTOOTH 990FX R2.0, AM3+
AMD FX-Series X8 8370
Sapphire R9 295X2 8GB GDDR5, 1024 -bit
Samsung SSD 500GB 840 EVO Basic
4x DDR3 8GB (1x8GB) Kingston, HyperX Fury, 1866MHz
Thermaltake Level 10 GT, Big tower, ATX,E-ATX,µATX
SEASONIC 1050W, SS-1050XM,
HDD WD 4TB, WD4003FZEX,
Corsair Hydro Series H110

That rig would be used for Adobe indesign,illustrator,video rendering and gaming. All in one.

Am i missing something?
Do you have any ideas or suggestions?

Thanks in advance.
post #47593 of 67890
Quote:
Originally Posted by hawker-gb View Post

Hello again guys.
I must bother you with,i hope, final rig for my friend.smile.gif

ASUS SABERTOOTH 990FX R2.0, AM3+
AMD FX-Series X8 8370
Sapphire R9 295X2 8GB GDDR5, 1024 -bit
Samsung SSD 500GB 840 EVO Basic
4x DDR3 8GB (1x8GB) Kingston, HyperX Fury, 1866MHz
Thermaltake Level 10 GT, Big tower, ATX,E-ATX,µATX
SEASONIC 1050W, SS-1050XM,
HDD WD 4TB, WD4003FZEX,
Corsair Hydro Series H110

That rig would be used for Adobe indesign,illustrator,video rendering and gaming. All in one.

Am i missing something?
Do you have any ideas or suggestions?

Thanks in advance.

Keep in mine that video card does NOT have 8GB of usuable VRAM.

It's 4GB dedicated to each GPU on the board. They use crossfire to double the bus speed, but the available memory is only 4GB....

Think RAID1 HDD setup where the drives are mirrored, versus a RAID 0 where they are one logical drive thumb.gif
Edited by Agent Smith1984 - 3/19/15 at 1:06pm
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post #47594 of 67890
Quote:
Originally Posted by Spacebug View Post

Didn't take any pics during the process, but if you want pics of delidded visheras just google for it, there are a few out there wink.gif

I won't remove the chip just to take pics unless i get more CLU, seems I used up the last of the syringe on my last mount.
That stuff is not easy to apply btw.
I had a thermal shutdown during boot after my previous mount, good even mounting preassure and the die was covered in CLU but it seems it wouldn't stick to the waterblock.
After I removed and reapplied CLU and also paintbrushed the waterblock with CLU in the approximate area that the die would sit in I got good and stable temps, better than ever actually.
So it seems to be critical that the liquid metal sticks good to the two surfaces, and not just touching because of preassure.

I tried a few normal thermal pastes also but they did not give much different temps than before with the IHS,
so I can't say that the better temps were from delidding or the switch to CLU for TIM...

I also tried switching to my 8350 (with lapped IHS) and CLU but I could not get it stable any higher than before lapping and CLU, 4950ish MHz.
More than that would not get stable, and temps would go haywire at over 1.6V Vcore.
This delidded 8370E is different, good temps now at 1.6V, will soon be trying higher.
Will be interesting to see when temps go haywire here...

I don't understand why you delidded a soldered chip which doesn't suffer any of the issues that Intel chips do hence why they get delidded, could you explain why? are you using a naked mounting kit or reusing the IHS in which case... why?
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post #47595 of 67890
Well as I said! 4.95GHz! Here are some pics! Warning: Spoiler! (Click to show)
Yes I forgot to run CPU-Z in Windows 7, so I just ran it now on my Windows 8 system.

Two random temp spikes there. But otherwise pretty uniform.



Some Benches with Sandra. BTW I don't see people using Sandra much any more? Why not?

GFLOP's and stuffs. ~79-80 GFLOP's (Less than what IBT reports? Yeah I know IBT is unreliable. If you go to the CPU information page it says peak theoretical performance is 103GFLOP's though.)

Memory Bandwidth. ~21GB/s (Slow results. I guess Aida is better for this. But I do not have an up to date paid for version of Aida.

Latency. 50.6ns


There you have it. Will try getting a torrent version of Aida for a once off bench. Now for the all night run! thumb.gif

Edited by Alastair - 3/19/15 at 2:14pm
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post #47596 of 67890
Quote:
Originally Posted by Benjiw View Post

I don't understand why you delidded a soldered chip which doesn't suffer any of the issues that Intel chips do hence why they get delidded, could you explain why? are you using a naked mounting kit or reusing the IHS in which case... why?

Mostly for the fun of it, and some portion of last resort cause I was disappointed in how it clocked.
I had started to get more interested in overclocking lately and bought the 8370E fairly cheap cause these new chips seemed to clock fine and with fairly low voltages.

It is a lottery and i lost, this was a pig chip needing almost 1.6V to get 5GHz stable and that got too hot for my liking.
To be fair it has the characteristics of the newer chips of low voltages but it seems to hit a wall at 4.8GHz where it took much more voltage to get stable, otherwise it would cause system freeze.
My previous 8350 behaved about the same with frequency but threw errors instead if freezing if voltages were too low.
The new chip was basically as bad/good as my previous 8350 but different behavior, about the same voltage for the same clocks in the region 4.8+GHz.

As others have pointed out, delidding has been done before so I knew it could work and I was prepared to sacrifice the chip as I had the 8350 as a spare.
I pondered around either lapping or delidding in search of little better cooling, so I could perhaps run 5GHz stable at acceptable temps.
In the end i thought "eff it" if i can get the waterblock closer to the heat source then I'll go for it.
The water is what is cooling the die, and I think it would be better, although not by much, to have die-TIM-waterblock-water and avoid having solder and a copper IHS between the die and TIM-waterblock-water...
Sure the soldered IHS is much better than the way intel chips are made, but would it be better with no IHS at all?

Anyhow, it all turned out fine, the chip survived and is running fine now.
Voltage requirements for the same frequency has not changed but it runs about 5 degrees cooler than before the de-lid, however, I'm not sure if that is all due to the de-lid or not.
Because shortly after the de-lid, had basically just verified that the chip worked, I rebuilt the PC, this time adding waterblocks to the saberkitty and a fan blowing on the back of the socket.
So any temperature drop could have been caused by any of these modifications, or most likely a combination of them all...


I mount the EK supremacy waterblock with its standard AMD mounting kit to the naked die with CLU in between.
With the IHS gone the waterblock sits a little deeper than before, thereby loosing some mounting pressure from the springs.
I'm not sure how much pressure a naked die should have but I'm driving the mounting nuts until they stop, in small and even increments.
That way i would think that is is even mounting pressure from all springs, as the nuts are all tightened down to the bottom.
I have not yet cracked the die at least but i guess there is a real possibility, though I suspect it is more dangerous to have uneven preassure than too much and even pressure.


As I said before, I do NOT recommend this but it is not impossible.
You just have to be willing to potentially kill the chip, but then again, how is this any different from say suicide runs pumping insane voltages through a chip?
All in the name of good fun eh? biggrin.gif
post #47597 of 67890
Quote:
Originally Posted by Johan45 View Post

AS5 is still OK, I use Gelid just because it's cheap and easy to clean up. From best to worst you're looking at 5c. The crucial part is the mounting.

nothing wrong with AS5 other than the curing time.
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post #47598 of 67890
Quote:
Originally Posted by Spacebug View Post

Quote:
Originally Posted by Benjiw View Post

I don't understand why you delidded a soldered chip which doesn't suffer any of the issues that Intel chips do hence why they get delidded, could you explain why? are you using a naked mounting kit or reusing the IHS in which case... why?
Warning: Spoiler! (Click to show)

Mostly for the fun of it, and some portion of last resort cause I was disappointed in how it clocked.
I had started to get more interested in overclocking lately and bought the 8370E fairly cheap cause these new chips seemed to clock fine and with fairly low voltages.

It is a lottery and i lost, this was a pig chip needing almost 1.6V to get 5GHz stable and that got too hot for my liking.
To be fair it has the characteristics of the newer chips of low voltages but it seems to hit a wall at 4.8GHz where it took much more voltage to get stable, otherwise it would cause system freeze.
My previous 8350 behaved about the same with frequency but threw errors instead if freezing if voltages were too low.
The new chip was basically as bad/good as my previous 8350 but different behavior, about the same voltage for the same clocks in the region 4.8+GHz.

As others have pointed out, delidding has been done before so I knew it could work and I was prepared to sacrifice the chip as I had the 8350 as a spare.
I pondered around either lapping or delidding in search of little better cooling, so I could perhaps run 5GHz stable at acceptable temps.
In the end i thought "eff it" if i can get the waterblock closer to the heat source then I'll go for it.
The water is what is cooling the die, and I think it would be better, although not by much, to have die-TIM-waterblock-water and avoid having solder and a copper IHS between the die and TIM-waterblock-water...
Sure the soldered IHS is much better than the way intel chips are made, but would it be better with no IHS at all?

Anyhow, it all turned out fine, the chip survived and is running fine now.
Voltage requirements for the same frequency has not changed but it runs about 5 degrees cooler than before the de-lid, however, I'm not sure if that is all due to the de-lid or not.
Because shortly after the de-lid, had basically just verified that the chip worked, I rebuilt the PC, this time adding waterblocks to the saberkitty and a fan blowing on the back of the socket.
So any temperature drop could have been caused by any of these modifications, or most likely a combination of them all...


I mount the EK supremacy waterblock with its standard AMD mounting kit to the naked die with CLU in between.
With the IHS gone the waterblock sits a little deeper than before, thereby loosing some mounting pressure from the springs.
I'm not sure how much pressure a naked die should have but I'm driving the mounting nuts until they stop, in small and even increments.
That way i would think that is is even mounting pressure from all springs, as the nuts are all tightened down to the bottom.
I have not yet cracked the die at least but i guess there is a real possibility, though I suspect it is more dangerous to have uneven preassure than too much and even pressure.


As I said before, I do NOT recommend this but it is not impossible.
You just have to be willing to potentially kill the chip, but then again, how is this any different from say suicide runs pumping insane voltages through a chip?
All in the name of good fun eh? biggrin.gif
Well honestly you probably hurt the cooling performance more than you improved it. Because on FX you have a pretty close to optimum transfer medium. Die> solder>IHS>Heatsink. Now the IHS gives better surface area for better heat dissipation. So you have removed a lot of contact area that could of essentially aided your transfer of heat. I think it would have been better to lap honestly. As I understand it rule of thumb goes.

Soldered IHS> Delidding non-soldered chip> un-soldered IHS.
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post #47599 of 67890
Quote:
Originally Posted by Alastair View Post

[/SPOILER] Well honestly you probably hurt the cooling performance more than you improved it. Because on FX you have a pretty close to optimum transfer medium. Die> solder>IHS>Heatsink. Now the IHS gives better surface area for better heat dissipation. So you have removed a lot of contact area that could of essentially aided your transfer of heat. I think it would have been better to lap honestly. As I understand it rule of thumb goes.

Soldered IHS> Delidding non-soldered chip> un-soldered IHS.

Afterwards I lapped the old 8350 to see if I could improve that some, but that did not bring any improvements in temps or overclock margin compared to my old notes from before when the saberkitty had stock heatsinks and no fan under socket.
Not one degree better.
Sure, I had not taken notes of ambient temp so there are room for errors here, but still.
And that IHS has not flat by any means, hell almost 2 hours for nothing lapping that IHS, most of that time spent on 240 grit getting it flat.
Then some quick passes on higher grits to get polished surface.

I'm not saying that lapping would not work better on the new chip, it might have, they are different chips after all, but i went for de-lid instead.

Btw Alastair your chip looks pretty good thumb.gif
Good overclock and very sane voltages, wonder what it would do on a better board and moar Vcore biggrin.gif
post #47600 of 67890
The best IMHO:

http://www.gelidsolutions.com/products/index.php?lid=1&cid=3&id=42
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