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can i use thermal paste on vrm? - Page 3

post #21 of 32
Thread Starter 
Quote:
Originally Posted by just_nuke_em View Post

First thing I thought of when I saw the pic. You need a heatsink first before TIM becomes usable thumb.gif
heat sink for vrm??could you post me a link?and so for now i should not just use the thermal paste on my vrm then right?
post #22 of 32
Quote:
Originally Posted by omgzombie View Post

heat sink for vrm??could you post me a link?and so for now i should not just use the thermal paste on my vrm then right?

You can but it will have practically no effect. Cooling needs heatsink+airflow.
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post #23 of 32
MOS-C10 are recommended heatsinks for the VRM's, even VRAM heatsinks like Swiftech's will do. They have double-sided thermal tape already pre-attached (though I use Sekisui).

You should really only use thermal paste on area's like between CPU/GPU die's/IHS and a fixed heatsink (clamped, bolted etc.), unless you use one with a fixing compound like Ceramique.
As stated, you need a heatsink ontop of whatever thermal interface you use, to dissipate the heat regardless.

I'm curious as to why exactly you're looking at adding cooling to your Mobo's VRM's, are you overclocking and/or overvolting your CPU? Are you concerned about their current heat output?
What Motherboard and CPU do you have?
 
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post #24 of 32
Quote:
Originally Posted by omgzombie View Post

heat sink for vrm??could you post me a link?and so for now i should not just use the thermal paste on my vrm then right?


Just thermal paste on a component will increase temperatures.


The point of TIM is to fill gaps between a heat load and a heat dispersing device. Ultimately, the heat is generally dispersed into the air. By applying TIM and no heatsink, you are just insulating the head load device from dispersing into the air.
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post #25 of 32
Thread Starter 
Quote:
Originally Posted by EvoBeardy View Post

MOS-C10 are recommended heatsinks for the VRM's, even VRAM heatsinks like Swiftech's will do. They have double-sided thermal tape already pre-attached (though I use Sekisui).
You should really only use thermal paste on area's like between CPU/GPU die's/IHS and a fixed heatsink (clamped, bolted etc.), unless you use one with a fixing compound like Ceramique.
As stated, you need a heatsink ontop of whatever thermal interface you use, to dissipate the heat regardless.
I'm curious as to why exactly you're looking at adding cooling to your Mobo's VRM's, are you overclocking and/or overvolting your CPU? Are you concerned about their current heat output?
What Motherboard and CPU do you have?
phenom ii 560 and mobo gigabyte ga 78-lmt-s2pt.i have unlocked the third core and currently looking forward to overclock it by 300mhz
post #26 of 32
Thread Starter 
Quote:
Originally Posted by DuckieHo View Post

Just thermal paste on a component will increase temperatures.
The point of TIM is to fill gaps between a heat load and a heat dispersing device. Ultimately, the heat is generally dispersed into the air. By applying TIM and no heatsink, you are just insulating the head load device from dispersing into the air.
Quote:
Originally Posted by DuckieHo View Post

Just thermal paste on a component will increase temperatures.
The point of TIM is to fill gaps between a heat load and a heat dispersing device. Ultimately, the heat is generally dispersed into the air. By applying TIM and no heatsink, you are just insulating the head load device from dispersing into the air.
okay..thanks a lot..gained some knowledge today thumb.gif by the way what would you recommend the cabinet fan which is placed just above the heatsink to be?input or output?
post #27 of 32
Quote:
Originally Posted by omgzombie View Post

okay..thanks a lot..gained some knowledge today thumb.gif by the way what would you recommend the cabinet fan which is placed just above the heatsink to be?input or output?

If I managed to get a 120mm fan close to the top/front of the case (like one bay down) and this fan is an intake (in the front of the case),I would make the one on the back exhaust,agumented with an exhaust on the top of the case.This setup would aid whatever hot air wanted to rise on its own and complete the front to back airflow scheme you designed by placing a intake fan at the front of the case and an exhaust at the rear.

In an open air case (like a test station) I get air blowing over these VRM's in any direction possible.Watercoolers sometimes forget to maintain airflow over these VRM's
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post #28 of 32
I have experimented with thermal paste on top of things like ram or vrm's that have thermal pads as the primary heat transfer medium. I have found that using a little bit will not raise temps but that it won't really lower them in any meaningful way either.
Probably best to stick to the pads unless your pads are falling apart a little bit. If they are falling apart a lot you need to replace them.
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post #29 of 32
My suggestion would be double sided thermal tape. Most non conductive thermal paste are capacitive. If you ever do go to overclocked they can mess with the vrm enough to cause you issues.
Wouldn't type it, if I hadn't seen it.
post #30 of 32
Have any of you, ever used Arctic Alumina for sticking heat sinks on vrm? I have been using it with great success for years. Thermal pads wear out, and thermal paste doesn't stick very well, especially when gravity is a factor. Arctic Alumina transfers heat very well, is non conductive, and bonds solid as a rock. The only two issues with using it, is that the bond is so strong it is permanent, and will destroy mosfets, when you attempt to remove the heat sinks. Also, when you mix it, you have to mix small amounts, and move fast, because it will be set in three to five minutes.
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