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post #11 of 29
Depending on the usage, anywhere from 5C to as much as 12C, with newer chips tending towards the former (5-7C) and older chips like the P4 and A64 more towards the latter (8-12C).
   
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post #12 of 29
Quote:
Originally Posted by nleksan View Post

Depending on the usage, anywhere from 5C to as much as 12C, with newer chips tending towards the former (5-7C) and older chips like the P4 and A64 more towards the latter (8-12C).

I've tried it with my GPU and it doesn't seem to produce any difference with the line method?

Is the tint method applicable for everything?
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post #13 of 29
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post #14 of 29
I hope this Helps thumb.gif

*EDIT*http://www.youtube.com/watch?annotation_id=annotation_461720&feature=iv&src_vid=EyXLu1Ms-q4&v=ffK7L0Qj13QHope that helped thumb.gif
Edited by Tarun - 12/30/12 at 4:16am
post #15 of 29
People have already given you good brands to consider. I myself grabbed some GELID GC-2, because it was cost effective for the volume. It's a hard decision, but after research I realized the brand does not matter much. I would have got some PK or MX-4, but ncix did not have it in stock.

Anyhow, spread a thin layer on, you can even "prime" the other side (heatsink) with a very thin layer, just to fill the grind marks, if any then scrape it off.

The pea sized method is somewhat idiot-proof, but does not fully cover the heatsink, if that matters to you. A line or 5-6 small dots would be better then a pea sized dot. Frankly I'm not convinced that the pea method gives you the thinnest layer either.

Spread it out with a glove or card etc. If you are concerned about bubbles, just make a bunch of grooves for the air to escape as you tighten down.
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post #16 of 29
Quote:

I hate this video (no pun intended towards you). It has been analyzed in several forums that acrylic and pressure from your hands will never replicate accurately heatsinks. Also, heat from the CPU will have an effect on how it spreads after mounting.
Quote:
Originally Posted by All3n View Post

People have already given you good brands to consider. I myself grabbed some GELID GC-2, because it was cost effective for the volume. It's a hard decision, but after research I realized the brand does not matter much. I would have got some PK or MX-4, but ncix did not have it in stock.
Anyhow, spread a thin layer on, you can even "prime" the other side (heatsink) with a very thin layer, just to fill the grind marks, if any then scrape it off.
The pea sized method is somewhat idiot-proof, but does not fully cover the heatsink, if that matters to you. A line or 5-6 small dots would be better then a pea sized dot. Frankly I'm not convinced that the pea method gives you the thinnest layer either.
Spread it out with a glove or card etc. If you are concerned about bubbles, just make a bunch of grooves for the air to escape as you tighten down.

Try and test how the pea size method works best for Intel CPUs with IHS, you will be surprised that it is the best among the rest.
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post #17 of 29
lol, so the brand of CPU matters to how or what technique is used to apply a bit of paste? I guess science has just left the building.

Also I have never seen any indication that acrylic is used instead of glass. Surely somebody would not go to the trouble to make that video with a floppy piece of plastic.

That video does show flow patterns and what appears to be microscopic air bubbles, however no follow up testing is done to see how much of a difference there was between application techniques.
All we can do is speculate, still an interesting video though.
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post #18 of 29
Quote:
Originally Posted by All3n View Post

lol, so the brand of CPU matters to how or what technique is used to apply a bit of paste? I guess science has just left the building.
Also I have never seen any indication that acrylic is used instead of glass. Surely somebody would not go to the trouble to make that video with a floppy piece of plastic.
That video does show flow patterns and what appears to be microscopic air bubbles, however no follow up testing is done to see how much of a difference there was between application techniques.
All we can do is speculate, still an interesting video though.

No not the brand. Usually Intel CPUs have IHS. I'm pointing out the "IHS" here not the Intel brand. The IHS concentrates the heat in the center area.

I mean glass, not acrylic. I don't have the links to the analysis of this video but I'm just relaying the information.

Yes, indeed an interesting video but not an accurate representation.
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post #19 of 29
IHS- I understand now and can see how that would be sufficient.
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post #20 of 29
In my experience, from best to worst:
1) Tinting
2) Line Method w 1-3 lines (Multi-Core CPU's)
2) BB-Sized Drop in Center (Single-Core and SOME Multi-Core Chips)
3) Spreading with Finger/Card/etc and then Directly Applying HSF (terribly uneven temps)
4) Pea-Sized Drop in Middle (WAY TOO MUCH!)
   
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