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[Various] Swiftech H220 240mm AIO Water Cooler (Expandable) - Page 29  

post #281 of 3166
Quote:
Originally Posted by zinfinion View Post

@stephenm: How concerned are you that the "L" shape of the reservoir on the rad will limit case compatibility? Mainly cases that have a split top such as the CM 690 II (amongst many others) that also doesn't have ~55mm of space to mount both rad and fans below the metal:



Whereas a competing AIO (or custom loop) would fit with the fans above the metal and the rad below the metal.

not a real concern - the MCR-x20-Res series has been out for a few years already, same thing with our MCR-x20-Drive series. they both have a similar reservoir on one of the radiator. in most situation you will install the kit as shipped with the fans already preinstalled on the rad. In this configuration the reservoir is always lower than the fans so there is no possible interference with the top panel of the chassis.

in some smaller case where there isn't much room under the top panel, you would want to install the radiator under the panel and the fans on top. The number of chassis in this case is pretty small - it will fit most cases as is, and even smaller mid towers like the ones we used at CES.
post #282 of 3166
Quote:
Originally Posted by stephenm View Post

I can take one on monday, if I am not mistaken it was about 1.37V - will confirm on monday - if I forget just remind me by email stephen at swiftech dot com

Thanks Stephenm! Now, 1.37v is quuite hard to cool it so well...what was ambient at the time? It's the only piece missing, and what was the stress test running at the time?
I'm really impressed by that so far.
post #283 of 3166
Quote:
Originally Posted by stephenm View Post

in some smaller case where there isn't much room under the top panel, you would want to install the radiator under the panel and the fans on top. The number of chassis in this case is pretty small - it will fit most cases as is, and even smaller mid towers like the ones we used at CES.

Looks like I will be needing a new case then as I don't see the reservoir fitting through those small cutouts on the 690 II.

Even the Ghost looks as though it would have issues with the fans above the metal and the rad beneath. The cutouts that extend past the 120mm holes aren't wide enough. It might be able to mount the rad and fans combined below, but it's hard to tell if it would interfere with the mobo or the rear fan. As well, that top area largely becomes wasted space.



I'm guessing most cases like this will be a bit of a crapshoot then. Back to looking for a good case.
Edited by zinfinion - 1/12/13 at 7:53pm
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post #284 of 3166
Quote:
Originally Posted by stephenm View Post

in some smaller case where there isn't much room under the top panel, you would want to install the radiator under the panel and the fans on top. The number of chassis in this case is pretty small - it will fit most cases as is, and even smaller mid towers like the ones we used at CES.

Would that make a difference in performance though? Sorry if this sounds trivial, I'm new to watercooling.
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post #285 of 3166
Quote:
Originally Posted by ivanlabrie View Post

Thanks Stephenm! Now, 1.37v is quuite hard to cool it so well...what was ambient at the time? It's the only piece missing, and what was the stress test running at the time?
I'm really impressed by that so far.
we use CPU burn over prime/linpack because it doesn't cycle so it gives better thermal data - it also stresses the cpu 5% more than prime and maybe 2-3% less than linpack. We stress all 8 threads to 100%.
ambient temperature was 70-72 F .
Quote:
Originally Posted by zinfinion View Post

Looks like I will be needing a new case then as I don't see the reservoir fitting through those small cutouts on the 690 II.
how much room do you have between motherboard and top panel?
Quote:
Originally Posted by Roadkill95 View Post

Would that make a difference in performance though? Sorry if this sounds trivial, I'm new to watercooling.
no it wouldn't make a difference smile.gif
Edited by stephenm - 1/12/13 at 10:08pm
post #286 of 3166
Thanks a lot Stephenm!
Nice data you guys provided...70c would be quite toasty and this thing provides sub ambient cooling! tongue.gif jk (I know you meant F)
post #287 of 3166
Quote:
Originally Posted by stephenm View Post

we use CPU burn over prime/linpack because it doesn't cycle so it gives better thermal data - it also stresses the cpu 5% more than prime and maybe 2-3% less than linpack. We stress all 8 threads to 100%.
ambient temperature was 70-72C.
how much room do you have between motherboard and top panel?
no it wouldn't make a difference smile.gif

I think you meant to say 70-72F or 21-22c
With those ambient, 100% stress with 1400rpm settings, very good.
    
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post #288 of 3166
Quote:
Originally Posted by stephenm View Post

how much room do you have between motherboard and top panel?

33mm in the CM 690 II. And based on where the 120mm mounting holes are, things would definitely start crashing into each other. Bummer. My new combined metric/imperial tape measure is cool though.
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post #289 of 3166
Anyone think this outperforms a XSPA Rasa 240 kit? I'd be pretty interested to know. (and if it comes close or is better in terms of the pump...consider me sold for my next rig) I was debating between the H100i or the Rasa, but the cost was too high for the Rasa 240. This changes things for me in terms of future expansion and no setup.
Edited by SOCOM_HERO - 1/12/13 at 8:56pm
post #290 of 3166
Quote:
Originally Posted by stephenm View Post

we use CPU burn over prime/linpack because it doesn't cycle so it gives better thermal data - it also stresses the cpu 5% more than prime and maybe 2-3% less than linpack. We stress all 8 threads to 100%.
ambient temperature was 70-72C.
how much room do you have between motherboard and top panel?
no it wouldn't make a difference smile.gif

Thanks smile.gif
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