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3770k - 300watts , CPU cores same temp. Suddenly. - Page 2

post #11 of 23
Watercooling will not help you. The cpu gets hot because the chip is not soldered to the cover (IHS). Instead intel used cheap thermal paste like the one you use between your cooler and the IHS.
The result is a poor thermal transfer capping at a certain wattage. This is why the temperature skyrocket.
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post #12 of 23
Correct me if i'm wrong, but Arctic Silver 5 is electrically conductive, so putting it directly on the die will fry it?

Also i'm still confused as to why people still use AS5:
http://skinneelabs.com/2011-thermal-paste-review-comparison/2/
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post #13 of 23
Its capacitive - Not necessarily conductive. Also, the surface of the die itself isn't the billions of transistors and doesn't have electricity coursing through it - in case you haven't noticed, the IHS itself is metal and probably more electrically conductive than AC5. The resistors and thingys surrounding the die are what you want to worry about getting AC5 on.
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post #14 of 23
Quote:
Originally Posted by Just a nickname View Post

Watercooling will not help you. The cpu gets hot because the chip is not soldered to the cover (IHS). Instead intel used cheap thermal paste like the one you use between your cooler and the IHS.
The result is a poor thermal transfer capping at a certain wattage. This is why the temperature skyrocket.

Watercooling still does better than air (custom type water, AIO coolers are typically comparable to high end air), but yeah ivy runs pretty warm, water should allow some higher overclock though (enough to be worth the extra cost is another question, hard call there)..
    
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post #15 of 23
Software based power sensors are completely useless.
post #16 of 23
Thread Starter 
Hi again,
Thanks for the responses!
Replacing the IHS thermal paste was an easy job requiring a thin blade, and extendable cutting knife, a steady hand and a little bit of patience. I just rocked the knife backward and forward on each corner of the IHS, applying pressure until the blade went in a small way. After the 3rd corner, the IHS started to lift a little so I used a toothpick to raise it the rest of the way and avoid damage to the board.
Once the IHS was off I noticed a rather poor application of a very light colored thermal paste, definitely not ceramic though. It had visible gaps in the paste where one part was lower than the other.
Anyway, I removed the paste using 82% rubbing alcohol from the DIE and the IHS.
I then applied Artic Silver 5 using the spreading technique to the die (extremely thinly spread) and the IHS it's self, (again , very thinly and only where needed). I made sure the spread was even. AS5 is capacitive yes but there are no components on top of the board for an i7 3770k, no risk at all.
After that I thought I might have a problem sticking the IHS back on so I tried some heat resistant double sided tape on each edge of the IHS. I discovered the clearance was too much after applying the IHS and would require more than 3 layers of tape so I removed it. I found the compound was enough on it's own to hold the IHS pretty securely and once you have the cooling assembly back on, it won't move anyway. Then I cleaned off the base of the CPU and the top of the IHS using rubbing alcohol.
I then applied a very thin layer, again using the spread technique, of AS5 to the IHS and the bottom of the heat sink, using a slight twisting to re-seat the heat on to the CPU. Upon turning the machine back on, the temps were pretty much the same at idle as they always had been. I ran a stress test and it had lowered the max temps down to 70c or so from 90+. After a few days the idle temps had dropped down to 25 - 29c and they were all reading exactly the same. (Thus this post was created). Thanks to the helpful advice here, I realize it's just because the heat is now evenly spread.



The max temp I get through stress testing is 72 c now and my PC is air cooled. The CPU is at 4.4Ghz with speed step on.
Anyway, thanks for a great forum! and thanks to all the people that stepped in to give advice!.
post #17 of 23
Would you still risk it though? Also AS5 is a mediocre paste at best.

Found the link for why you shouldn't spread tim and let the pressure spread it (1:55, http://www.youtube.com/watch?v=EyXLu1Ms-q4)
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post #18 of 23
Thread Starter 
Applying a dot of grease directly on to the DIE would create a concentrated pressure point directly under that dot when pressing the IHS back down. AS5 is the only paste, other than generic, which my local pc parts store has. Anyway, it seems to be running fine now so I am happy. I just thought I would give my input on it, in case somebody finds it helpful. Of course, different paste would perform differently and everybody will have their own preference.
post #19 of 23
Quote:
Originally Posted by FtW 420 View Post

Watercooling still does better than air (custom type water, AIO coolers are typically comparable to high end air), but yeah ivy runs pretty warm, water should allow some higher overclock though (enough to be worth the extra cost is another question, hard call there)..
Spent almost $1k on mm water cooling and am getting same temps on Ivy as on there air oc's even with a delid.
95C at 5Ghz not Fun.

But on the AMD Phenom II x4 955 Be on custom water i was running 4.2GHz @ 1.47V and hitting a nice 46C. Was AWESOME.
post #20 of 23
That is unfortunate can you not get any of the thermal pastes in that review online?

The amount of pressure should spread the tim out evenly, as an approximate guess (based on waterblocks) the cpu takes 250N of pressure anyway and quite a few people apply more.

Socks, what do you use to measure CPU temps, with my wc right the motherboard reports it at 40-50C but hwmonitor reports it just below 70c, guessing it might be due to the sheer density of the cores causing a real concentrated heat source.
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