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Coollaboratory Liquid Ultra vs Liquid Pro vs Phobya Liquid Metal - Page 36

post #351 of 360
Quote:
Originally Posted by Cakewalk_S View Post

So my birthday is right around the corner and I've been tossing up the idea of getting an asus zenbook. The new gen one has a Skylake i7 and nvidia gt940 processor in it. Judging by the temps I believe I'd definitely try some CLU on the chips. Anyone run CLU or CLP in a laptop?

Hi all, first time in here, nice to meet you all. That's a great forum to get the information about all overclocking.

My laptop is Fujitsu T904 with i5-4200U CPU. Yes, I did use CLU on my laptop few days ago. That's great, 10*C degree drops. Maximum temp I got is about 64*C degree under full load test with about 30*C degree ambient temperature.

The special thing is on the copper heatsink, there is an area made thinner in order to avoid any bad contact at the larger die(CPU+GPU core) area due to possible different height between the two dies on CPU package. Thus, I want to use much CLU to fill up that area so the smaller die can also have better heat dissipation to the heat sink.

Actually, it is the first time to use CLU. The CLU is something like melted tin but the viscosity of it is much higher. The surface tension of it is also high so it is not easy to change the shape/state of it compared with the liquid. Thus, I filled up that big 'hole' area but it will not drop out when I turned over the heatsink to install on the CPU.

Since it is still in liquid state even though the characteristic I mentioned above, I used double-side tape, the grey colour one in pics, to minimize the leakage situation. This tape is from 3M which is used on Metal mainly. I chose it because it is thinnest as I know and the most important thing is that it can be extended by force to make it thinner and longer. Thus, after the heatsink installed and the CPU is running with heat dissipation in some time, the tape should be tended to restore back its original state theoretically, that is thicker, so the chance of the CLU leakage can be minimized. Details please see the pics.

















Actually, my purpose to do so is due to decrease the temperature in CPU+GPU. Lower temperature not only feel better while using, but also feel more quiet from the CPU fan, the loud sound from the CPU fan over 70*C degree is not really good.

Also, lowering temperature can get better performance due to the TDP Throttle controlled by CPU itself. The CPU is i5-4200U with its TDP 15W control so if the CPU+GPU is getting the power over 15W, it will enable the TDP Throttle control to let its TDP not over 15W. I found that if the CPU core temperature is lower, the CPU will hold longer(over 15W, about 20W in my testing) to enter the TDP Throttle control. Therefore, the overall performance will be better. Thus, this time I do is not directly to overclock the system(since it cannot be overclocked due to maximum ratio is locked), it is under voltage the CPU & GPU core voltage in order to make it lowest temperature to get the best overall performance result by making the later CPU TDP control enable.

I tweaked the CPU by ThrottleStop 8.10 to get the best balanced performance on both CPU and GPU. Now, the CPU is running at voltage about ~0.816v to ~0.686v, it is 0.075v lower than the original voltage. The VID will be changed in dynamic by CPU according to the situation of the CPU at that moment. The silicon running under 0.7v is an challenge so it has to pass the load test before to get the stable machine. If you want to know more about tweaking the ultrabook CPU by ThrottleStop, please ask and I will reply to you.





Details see the pics. Thanks for reading and sorry for my bad English. smile.gif
Edited by cktducky - 6/3/16 at 2:34pm
post #352 of 360
Good job, very clean, and nice explanation, if you taped with aluminium tape the gap between the heatsink and the fan you might gain an extra degree or two.
post #353 of 360
good idea that leads to a clean job
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My System
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post #354 of 360
Quote:
Originally Posted by superstition222 View Post

Because it dries up when exposed to copper. If you have a lapped CPU and a copper heatsink it can cause them to fuse. I ended up with broken pins on my 8320E trying to get it out.

Even without fusion because you have a nickle heatspreader on the CPU you will still end up with a dried mess on a copper sink.
Are you talking about CLP fusing?
post #355 of 360
Quote:
Originally Posted by keeepcool View Post

Good job, very clean, and nice explanation, if you taped with aluminium tape the gap between the heatsink and the fan you might gain an extra degree or two.

Thanks. I will take try next time when I opened the case. smile.gifthumb.gif
post #356 of 360
Sharing more benchmark photo. redface.gifbiggrin.gif








post #357 of 360
Great job @cktducky! Great pics and results.

I've got an ancient Dell Inspiron E 1545. After getting it upgraded with windows 10 finally and cleaning things up... I realized with HWmonitor that the CPU is idiling at 70C..lol! I ended up taking the heatsink off which is a SUPER easy task. Ended up using CLU on the Core 2 Duo T6600... worst processor ever but the die is SOOO TINY! Barely used any CLU so figured it was ok. The bios settings are so dumb the fan won't turn on till it hits 70 so its mostly passive until you stress test it... pretty cool!
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post #358 of 360
I know through personal experience CLU can bond to straight copper. Does it bond to nickel plated copper as well?
    
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post #359 of 360
Indigo XS is ~40 w/m-k without gallium
Indium Corp / heat-spring pads are 86 w/m-k
post #360 of 360
Quote:
Originally Posted by Enterprise24 View Post

My temp on i5-6500 @ 4.8Ghz 1.37V decrease by 15C when delid and replace TIM with Liquid Ultra.
Sound like not much. Several people claim 20C+.

Temparatures can't just be subtracted as higher temparatures dissipate more heat. This is because the difference between the hot object and the coolant (Air in most cases) is greater.

People who claim the 20C drop might have started from 80C while you started from 50.
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