post #11 of 11
Originally Posted by DuckieHo View Post

Heatspreaders can help to more evenly heat the ICs to reduce thermal wear and cracking solder balls.... but it's a low risk.
When have they ever done that to any significant degree with DDR2 or DDR3 modules? I'm guessing that pressing down on glued-on heatsinks during installation has caused more solder cracks than have been prevented by by any improved heat conduction.