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Some Common Thermal Transfer Specs

post #1 of 18
Thread Starter 
In a PM I got from Spookie, he let me know about a site that had some very useful thermal specs.

Copper: 392.9 W/m*°C
Diamond 550 W/m*°C
Gold: 297.7 W/m*°C
Silver: 417.1 W/m*°C

And just for fun
Soil: 0.23 W/m*°C

So, somone make a dirt waterblock!

There is so many more pieces of useful information in that table, please, take a peek at it
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post #2 of 18
Would anyone happen to know where I can get a diamond Tuniq Tower?
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post #3 of 18
Quote:
Originally Posted by shadowmelder View Post
Would anyone happen to know where I can get a diamond Tuniq Tower?
I know it's a joke, but it's impossible. There's never been a diamond that big.
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post #4 of 18
Thanks Burn...Bookmarked...They have about everything but the kitchen sink listed...Nice....I guess if you broke the kitchen sink down to components you could figure it out that way...
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post #5 of 18
Thread Starter 
Haha- I figured people would use it when deciding on heatsink material.
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post #6 of 18
On the diamond issue, what about using industrial diamonds(cheap and we can now produce them artificially, sorry forgot where I read the latter) on the bottom of a heatsink....just a thought.
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post #7 of 18
Thread Starter 
It would probably work marginally better, but it still works best if it's all-diamond. I can imagine it would work a little better, though. Like this?

Normal heatsink
Diamond base
IHS

? I think I have it right.
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post #8 of 18
Here's an even better site

And it even includes dry ice!

Quote:
Originally Posted by Burn View Post
It would probably work marginally better, but it still works best if it's all-diamond. I can imagine it would work a little better, though. Like this?

Normal heatsink
Diamond base
IHS

? I think I have it right.
That wouldn't be any better I would guess. The process of heat removal will only be as rapid as its slowest stage. By adding a diamond base between the IHS and the HS you add another stage. The stage is faster than the rest - but that doesn't matter because the heat will transfer just as slowly C->HS as it would IHS->HS. It's all about bottlenecks just like with PC's - except here (since this is a linear process) improving a part of the process that isn't bottlenecked yields no results as opposed to PC processing where it yields little results
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post #9 of 18
Yup, Burn, that's the way I had it thought out. Maybe could have strips of it going up from the base to act sorta like our current heatpipes also.
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post #10 of 18
Quote:
Originally Posted by rabidgnome229 View Post
Here's an even better site

And it even includes dry ice!



That wouldn't be any better I would guess. The process of heat removal will only be as rapid as its slowest stage. By adding a diamond base between the IHS and the HS you add another stage. The stage is faster than the rest - but that doesn't matter because the heat will transfer just as slowly C->HS as it would IHS->HS. It's all about bottlenecks just like with PC's - except here (since this is a linear process) improving a part of the process that isn't bottlenecked yields no results as opposed to PC processing where it yields little results

What about diamond dust mixed with AS-5 or some other TIM...Might give a little better thermal transfer...
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