Originally Posted by ENTERPRISE1701
The Thermal Specification for C2D is 60C. You are going to then want to keep that preferably Under 55c at full load.
You may wish too look into a better Cooling solution and thermal compound or Drop your overclock.
That is an incorrect view of Thermal Specification being the Digital Thermal Core Reading. Look at the logic ENTERPRISE. If the Tjunction is set at 85C Maximal and the t-junction is centered in the middle of the IHS, how can you say that the core, which is centered in the middle of each core has to be 25C cooler at max than the t-junction at max?.
That is completely illogical.
Note the difference between 'thermal design power' and 'thermal specification':
Thermal Design Power (65w): (Also referred to as Thermal Guideline) The maximum amount of heat which a thermal solution must be able to dissipate from the processor so that the processor will operate under normal operating conditions.
Thermal Specification (60.1c): The thermal specification shown is the maximum case temperature at the maximum Thermal Design Power (TDP) value for that processor. It is measured at the geometric center on the topside of the processor integrated heat spreader.
Thus this is not the Core temp but clearly the Case temp.
Originally Posted by XtremeSystems
Also there is a misperception of Core 2 temps. TAT/CoreTemp uses the internal sensor on the hottest spot. But thats not the same as the 60-61C max casetemp(surface temp).