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When applying thermal compound how to avoid air bubbles?

post #1 of 5
Thread Starter 
Hey
i am about to reseat my h100 because i am really using low voltage and i am getting 75C max while running on 1.360V.
i heard the problem cause from air bubbles the more=the more heat so my question is how to avoid it?is there any video around youtube how to avoid air bubbles or so?
thanks
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post #2 of 5
The air bubbles occur from spreading the compund or seating and reseating with the compound on the cpu. Just put a small dab of compound either in the middle or a small line and do NOT spread the compund. Let the pressure from the cooler mounting spread it for you. This is a good video: http://www.youtube.com/watch?v=fRRWbQUqW1Y thumb.gif
post #3 of 5
Don't spread TIM before applying the cooler. Unless you're professional in spreading it thin, air bubbles are unavoidable. Also, when mounting the cooler, try to evenly tighten those 4 mounting screws (I mean don't screw one all the way and then move on to others) while holding the cooler tightly attached to cpu. It's much easier with two people so ask for help.
post #4 of 5
I cringe when I see youtube videos of people using the "spread/smear" method. It may work 70% of the time...but theres always that 30% chance it wont. A small "grain of rice" sized blob, right in the middle of the CPU is all one needs. Gently set the heatsink down on it and let physics do the rest! People who use the spread/smear method are taking a simple procedure and complicating it.
 
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post #5 of 5
Intel's factory would press the heatsink while swirling it around to spread the paste.
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