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Thermal conductivities, why are we using thermal paste? Why can't we make it better? - Page 4

post #31 of 37
Quote:
Originally Posted by SkeeterSkeeter View Post

Quote:
Originally Posted by Quasimojo View Post

If I understand the question correctly, I would say that the CPU and heat sink (the parts with the best heat conductivity properties) do make contact, so that contact provides the best heat transferrance. However, that contact is also not uniform across the surface, so thermal compounds are required to fill any gaps (as others have noted, and I'm not saying you don't understand this).

That being said, the "weak link" is the thermal paste. I think your question should be, why don't we use a better base for thermal pastes, like copper, to bring it closer to the potential of the heat sink. Do I understand you correctly?

If I've completely missed your point as well, my apologies. biggrin.gif

Ok so if TIM is the weakest link, does that mean everything else down the chain from TIM (read above TIM toward heat sink) can be removed and replaced with less conductive parts because the TIM only lets so much through to work with, thus lower conductance materials can still handle what the TIM gives out?

No, because, while the TIM is the "weakest link", there is still a lot of direct contact with the heat sink. The TIM only improves the thermal transfer where there are gaps. That's why it should be applied as thinly as possible, so as to fill the gaps while interfering with direct contact as little as possible. I always kind of cringe when i see someone smearing it on to cover the entire surface. One rice grain sized dot in the middle and let the pressure between the CPU and the heat sink press what what little is required into those near microscopic gaps.
post #32 of 37
TIM is often not the weakest link.

If the TIM between my heatspreader and heat sink base had zero thermal resistance and infinite thermal conductivity, I would probably see load temps about 5C lower.

If I had double the surface area and heat pipe volume, but the same TIM I have now, I'd probably see closer to 10C lower.
Quote:
Originally Posted by SkeeterSkeeter View Post

Is this reasoning correct?

No.

Thermal paste works with mediocre thermal conductivity because it's generally got an extremely thin bondline. Thermal conductivity is only one small part of total system thermal resistance.
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post #33 of 37
Thread Starter 
Ok, so why not take a DICE pot, cut out the bottom and solder/weld/w/e its called the cpu facing up into the pot to the pot. Then the dry ice + whatever else can hit the cpu directly. no need for any TIM?
    
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post #34 of 37
Quote:
Originally Posted by SkeeterSkeeter View Post

Ok, so why not take a DICE pot, cut out the bottom and solder/weld/w/e its called the cpu facing up into the pot to the pot. Then the dry ice + whatever else can hit the cpu directly. no need for any TIM?

Because most people wouldn't consider the difference between ~-60C and ~-70C, at best, worth destroying a pot and CPU over.
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post #35 of 37
Thread Starter 
Quote:
Originally Posted by Blameless View Post

Because most people wouldn't consider the difference between ~-60C and ~-70C, at best, worth destroying a pot and CPU over.

oh. I forgot about that.

Well then one more idea.

Make custom CPU lids with heat sinks out of copper. Make them specific sizes. One can be purely air, one made to run WC over (special blocks), and ones that turn it into a DICE pot.
But thats alot and time and effort.


Ok well I guess the thread is over. It was fun all!
    
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post #36 of 37
if your really worried about a bottleneck in your heat transfer the common thing to do is get the best possible Thermal Paste (i believe its made by indigo if i remember correctly), also if your not faint of heart some people will change the thermal paste between the die and the TIM if your on IB. Another step if you want to go for the extreme though is removing the TIM completely. Then making sure to use a non conductive paste you attach your heatsink or waterblock directly to the die thus making the distance the heat has to travel before it gets to the "ideal" copper is much less. Take a look around in the Ivy bridge delidding club for some more info, hope this helped at least a little bit.
post #37 of 37
But you risk crushing the die without the IHS
The best TIM by far today is not indigo extreme but CoolLaboratory Liquid Pro
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