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3770k / Delidded / High Temps

post #1 of 7
Thread Starter 
Hey peeps,

Thought i'd come out of the lurkers cupoard and ask a question regarding my 3770k.

My Setup -

MSI Z77A-GD65 bios 10.8
3770k Costa Rica @ 4.5ghz 1.28v bios / 1.274v after vdroop
Corsair H60 push/pull
Cooler Master E2 IC Essential
2gb stick of kingston hyperx @ 1600mhz


The Problem -

Yesterday before delidding I was getting around 75c at 4.5ghz in Intel Burn Test with fans on max

Today after delidding succesfully I am getting temps of around 85c on core 2 and mid to high 70s on core 0, 1 and 4

I have applied a thin layer of cooler master E2 IC Essential tim to the Die and a pea sized drop of tim under the h60's waterblock.

All bios settings are the same on both occasions and i have checked the h60 to make sure it is seated correctly and it is and pump is running at 100 percent.


I am pretty shocked at this and dont really know what to do now ? I know that the h60 isnt brilliant but it seems to be performing worse with a delidded 3770k

Also IBT now fails runs on standard setting where as yesterday it passed

Here are is a screenshot of my bios setting if anybody has any suggestion..

Look forward to hearing your thoughts....





post #2 of 7
replace your cooler.. also for better results there are better TIMs..

but i believe it's your cooler needs to be reseated and tim to be reapplied.. and take HUGE card when doing so not to bend any pins on the mobo.. any guys do so when delidding.
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post #3 of 7
Honestly it is proly your tim you should have used clu or clp. on my first of five delids i used regular thermal paste and i maybe had a 5c drop or the same. i than ordered clu and wouldnt recommend anything else that dropped me almost 30c just from the paste on the die
post #4 of 7
clu = coollaboratory liquid ultra thermal paste thumb.gif
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post #5 of 7
You don't need CLU, delidding and even sticking with the stock intel paste should see a 10*C+ temp drop, as the time itself is not the problem (or it's part of it, the combination of the gap and the tim is the problem).

IBT also isn't really a stable temperature test program, it runs 7 different tests that all heat up the cpu differently, so unless you ran IBT for like 10+ passes yesterday and today for this comparison, you would really be better off with just prime95 small fft for temp testing, but it's too late to do a before and after now...

Also:
Quote:
I have applied a thin layer of cooler master E2 IC Essential tim to the Die and a pea sized drop of tim under the h60's waterblock.

Using a pea sized drop is an insane amount of tim, no wonder your temps went up. Using a pea sized amount of time will likely cause an increase in temps of about 10*C over a proper application.

Less is more, check my sig for my heatsink review where i talk about tim application with lots of pictures. You really can't use too little paste, but using a pea sized drop is an absurdly high amount of paste, wayyyy too much. You need to use like half a rice grain, as in, you paste footprint should only cover about half of the IHS. Applying a 'thin layer' on your die also sounds like way too much paste too, unless you are using CLU/CLP which has to be spread, you should use a tiny, tiny, tiny dab on the die just like you do in the IHS. For the die you literally should just push just the tiniest amount out of the tube, just barely, and then wipe it on the middle of the die, downwards, so it's sort of up/down.

Pretty sure you just used wayyyy too much thermal paste. You should still see a 10-20*C temp drop with half decent paste like the kind CM's E2.

The problem here definitely is not because of your thermal paste, the above posts are terrible. Going from E2 to CLU would likely just give you about 5-10* additional temp drop. All that would do is make your temps back to what they were yesterday, so obviously something else is wrong. Too often people's answers in tech forums is just 'spend more money and buy this thing because i use and it works for me'.

And the h60 is a great little cooler at under $40. Quite capable of a handling a decent overclock.
Edited by Belial - 3/14/13 at 2:10pm
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post #6 of 7
Thread Starter 
Quote:
Originally Posted by Belial View Post

You don't need CLU, delidding and even sticking with the stock intel paste should see a 10*C+ temp drop, as the time itself is not the problem (or it's part of it, the combination of the gap and the tim is the problem).

IBT also isn't really a stable temperature test program, it runs 7 different tests that all heat up the cpu differently, so unless you ran IBT for like 10+ passes yesterday and today for this comparison, you would really be better off with just prime95 small fft for temp testing, but it's too late to do a before and after now...

Also:
Using a pea sized drop is an insane amount of tim, no wonder your temps went up. Using a pea sized amount of time will likely cause an increase in temps of about 10*C over a proper application.

Less is more, check my sig for my heatsink review where i talk about tim application with lots of pictures. You really can't use too little paste, but using a pea sized drop is an absurdly high amount of paste, wayyyy too much. You need to use like half a rice grain, as in, you paste footprint should only cover about half of the IHS. Applying a 'thin layer' on your die also sounds like way too much paste too, unless you are using CLU/CLP which has to be spread, you should use a tiny, tiny, tiny dab on the die just like you do in the IHS. For the die you literally should just push just the tiniest amount out of the tube, just barely, and then wipe it on the middle of the die, downwards, so it's sort of up/down.

Pretty sure you just used wayyyy too much thermal paste. You should still see a 10-20*C temp drop with half decent paste like the kind CM's E2.

The problem here definitely is not because of your thermal paste, the above posts are terrible. Going from E2 to CLU would likely just give you about 5-10* additional temp drop. All that would do is make your temps back to what they were yesterday, so obviously something else is wrong. Too often people's answers in tech forums is just 'spend more money and buy this thing because i use and it works for me'.

And the h60 is a great little cooler at under $40. Quite capable of a handling a decent overclock.

Your a star mate, I had way to much thermal paste. I just reapplied using your tips and am getting much better results... just a shame this 3770k needs1.28v to be stable at 4.5ghz




Edited by ftln - 3/15/13 at 5:03am
post #7 of 7
trust me go buy liquid ultra those temps are not nearly as good as they can be no point in deliding if you temps are still going to be that high turst me it makes a diff I have done five chips. Maybe its not because the liquid ultra is better but maybe because it is easier to apply correctly such as its spread across the whole die by you and on the underside of the IHS as well he is what I get at 4.5 I used liquid pro on my die and IHS I have a little bit better voltage than you but not too much better. Also keep it mind I have a better cooler so I expect you to be about 70c max core temps at 4.5


Edited by enigma7820 - 3/15/13 at 12:21pm
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