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[hw.info] Intel Core i7 4770K Haswell appears in Dutch webshops - Page 6

post #51 of 58
Quote:
Originally Posted by sherlock View Post

Heat would naturally go from the (1)die to the (2)Integrated heatsink(IHS,the top cover of the CPU chip), and then get transferred to (3)Cooler.

However Ivy have TIM between die & IHS instead of Sandy's fluxless solder, resulting in more heat getting trapped between 1 & 2 and not getting to 3, resulting in Ivy running hotter than Sandy.

That cleared it up, thanks. So is there a reason for the change from Sandy's fluxless solder? And how will Haswell be?
post #52 of 58
They're listing the prices US dollars more than the i5 and i7's and it's barely better then either of them from what we've seen so far. Nothing but a conjob from Intel. Don't update and stick with your i5 and i7 even if you are wealthy and can afford the newest stuff, it's still throwing your money in the trash can for now.
post #53 of 58
Quote:
Originally Posted by funnyman View Post

They're listing the prices US dollars more than the i5 and i7's and it's barely better then either of them from what we've seen so far. Nothing but a conjob from Intel. Don't update and stick with your i5 and i7 even if you are wealthy and can afford the newest stuff, it's still throwing your money in the trash can for now.


Better yet buy AMD processors and give them more R and D money to get competitive at least in the high end consumer level (enthusiast is i7 - 3930k and 3960x and AMD has NOTHING in that market) so that we can get better performance out of each generation.
 
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post #54 of 58
Quote:
Originally Posted by thematrix606 View Post

Yes, so where does that heat go? It cannot remain inside as it would get hotter and hotter then eventually burn, it must eventually dissipate somewhere outside of the CPU, into the case. Or am I being blond?
You are blond and you found the reason simultaneously. It's hot because the 3D structure will not allow the heat to escape easily. That, and the lack of solder between die and its heat spreader are to blame.
post #55 of 58
BTW I have a simple question.

Its VRM is on die right? Logic said there must be reason why Intel desperately wanted to get VRM to the die. Does it mean all these voltage changes would be locked as well?
post #56 of 58
Quote:
Originally Posted by Raghar View Post

BTW I have a simple question.

Its VRM is on die right? Logic said there must be reason why Intel desperately wanted to get VRM to the die. Does it mean all these voltage changes would be locked as well?

Imo the reason behind VRM being on chip is not to lock down voltage changes, it is to reduce power consumption & get Haswell & future Intel CPUs into System on Chip(SOC)s for mobile products like tablets.

Here is a more detailed explanation for FIVR on guru3d.com:
Quote:
Intel Corp.’s next-generation code-named Haswell microprocessors will feature a secret weapon: integrated voltage regulator module (VRM). The latter will allow to improve granularity of power supply to central processing units and thus further cut power consumption without compromising performance. At present, voltage regulator modules and various power ICs are located on mainboards. In the recent years, to better regulate voltages of different blocks within central processing units, multi-phase CPU power supply circuitries were implemented.

Such circuitries are rather costly and take up a lot of space on mainboards. But most importantly, granularity and performance of such VRMs is not as high as Intel wants. In a bid to make its chips even more power efficient than they are today, Intel has developed a special programmable chip with 20 power cells, reports PC Watch web-site. Each power cells is a mini VR with analogue circuits rated for up to 25A electric current and supporting up to 16 phases. Potentially, one 20-cell chip enables 320 power phases per CPU, which allows extreme granularity of power supply. Intel will install the integrated voltage regulator (IVR) chip, which will be made using 22nm process technology onto the same substrate with Haswell microprocessors as xbitlabs reports.

Integrated VRM will allow to independently and very precisely control power consumption of each core, graphics core, system agent as well as well as interconnection buses within Haswell chip. Such fine-grain regulation can decrease power consumption without compromising performance. For example, with Haswell it is possible to halt all CPU cores during video playback without halting ring-bus interconnections, which means that only graphics core will consume power and given the fact that the interconnection will continue to operate at full speed, video playback will be smooth.

Eventually, Intel plans to build in IVR into microprocessor itself, which will further improve granularity of power supply. This will not only be useful for code-named Broadwell chips for notebooks, but also for various system-on-chip solutions for smartphones and tablets. In the latter case this will significantly boost Intel’s competitive positions against various solutions based on ARM technology, which dominates the mobile electronics these days.

Edited by sherlock - 3/26/13 at 6:31pm
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post #57 of 58
Subbed.

Great that you shared the info with us Sherlock. This is the most I've read about the new chips so far, since I was informed of them a couple of weeks ago. And I'd love to do more reading about them. If you have more links to information on the Haswell CPU's, I would love to read more.

Thanks again guys,

DeanW75234
post #58 of 58
Quote:
Originally Posted by DeanW75234 View Post

Subbed.

Great that you shared the info with us Sherlock. This is the most I've read about the new chips so far, since I was informed of them a couple of weeks ago. And I'd love to do more reading about them. If you have more links to information on the Haswell CPU's, I would love to read more.

Thanks again guys,

DeanW75234

Here is a detailed Haswell architecture analysis by Anandtech, imo a must read from anyone interested in reading more about Haswell.
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