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Building thermally effecient loops

post #1 of 8
Thread Starter 
So I'm doing my first liquid cooled build, and have adequately prepared myself by researching it thoroughly and have put the time and effort gathering resources I need for the build itself.

A few questions pop into mind though; Is it worth having more than one continuous loop for my build.

My set up is going to look like;

Res > Pump > CPU> Chipset > Res > RAD1

Res > Pump > GPU > RAM > RAD1

The only reason I've split it into two loops is because my theory is that the water will be mildly warmer exiting blocks, so splitting the set up into two loops will mean lower ambient water temperatures exiting the blocks and lower temperatures on the blocks.

Does it actually matter though? With a high enough flow, even though the water would be warmer exiting the blocks, is there a discernible difference in block temps between having two loops as opposed to having one large loop?

What's your experience with it? Did it make enough of an impact that it was worth it?
post #2 of 8
Warning: Spoiler! (Click to show)
Quote:
Originally Posted by cooksta View Post

So I'm doing my first liquid cooled build, and have adequately prepared myself by researching it thoroughly and have put the time and effort gathering resources I need for the build itself.

A few questions pop into mind though; Is it worth having more than one continuous loop for my build.

My set up is going to look like;

Res > Pump > CPU> Chipset > Res > RAD1

Res > Pump > GPU > RAM > RAD1

The only reason I've split it into two loops is because my theory is that the water will be mildly warmer exiting blocks, so splitting the set up into two loops will mean lower ambient water temperatures exiting the blocks and lower temperatures on the blocks.

Does it actually matter though? With a high enough flow, even though the water would be warmer exiting the blocks, is there a discernible difference in block temps between having two loops as opposed to having one large loop?

What's your experience with it? Did it make enough of an impact that it was worth it?

This honestly doesn't matter, it would though if you were going to have like 3-4 high heat GPUs, a 125+W TDP processor, and an extremely stressed VRM setup cooled, so you really shouldn't need to split them as long as you have good flow. And the water doesn't warm up at each component, it warms as it goes through the loop, which means it'll heat up after several rotations through the loops, and by that time it'll already have passed through the rads and cooled back down rolleyes.gif I had the same questions the first time I water cooled too, don't worry biggrin.gif you'll probably get a minuscule performance difference by splitting the loops tongue.gif
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ModMyToys Splitter PCB (Single 3-Pin --> 3 3-Pins) (X2) EK-FC R9-290X Nickle/Acrylic (X2) EK-FC R9-290X Reinforcement Brackets (X2) EK-FC R9-290X Backplates 
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post #3 of 8
I have 3 water temp sensors in my loop at the moment and at full load I see 0.1C difference between each one.

As long as you have a reasonable flow rate the order of the components makes no measurable difference with regard to heat transfer.

As an example, all of the water in a loop will heat up to maybe 10C above ambient air temp. The tiny differences after each block is nothing compared to that.
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post #4 of 8
As others have stated, the difference will be so minuscule it will be unnoticeable. My cards are at most 1c away from each other, and you can blame it as one is less powerful. Plus, as soon as the water temperature stabilizes, temps will be stable all around the loop.

The only thing i would remove is RAM cooling. RAM runs cool already, and it does not need cooling at all. You might consider RAM cooling if you have no air circulation on your case at all, or try to go with really high RAM voltages (1.9v+)
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post #5 of 8
Thread Starter 
Thanks for the replies guys.

Quote:
This honestly doesn't matter, it would though if you were going to have like 3-4 high heat GPUs, a 125+W TDP processor, and an extremely stressed VRM setup cooled, so you really shouldn't need to split them as long as you have good flow. And the water doesn't warm up at each component, it warms as it goes through the loop, which means it'll heat up after several rotations through the loops, and by that time it'll already have passed through the rads and cooled back down rolleyes.gif I had the same questions the first time I water cooled too, don't worry biggrin.gif you'll probably get a minuscule performance difference by splitting the loops tongue.gif

That was kind of my conclusion on it too. I didn't think there would be any kind of difference because the flowis controlled.

In some of my other builds, even in very controlled circumstances, I would get big hot spots in my cases from air cooling. It was kind of like an oven in particular spots, mainly the 5.25 bays because the air flow is kind of chaotic.

I've already accounted for a high flow rate, so hopefully we'll see a good delta-T on the water temps.

I do plan on OC'ing some of the components once I've got a good stable thermal system in place, but we'll cross that barrier when I get to it.
Quote:
The only thing i would remove is RAM cooling. RAM runs cool already, and it does not need cooling at all. You might consider RAM cooling if you have no air circulation on your case at all, or try to go with really high RAM voltages (1.9v+)
]

That was my reasoning too. I didn't really see any point in cooling RAM, I've got enough air circulation to cool the secondary componentry (transistors etc). Doing it more for future expansion and OC'ing in the future.

Honestly I wouldn't have bothered with the chipset cooler either, the only reason I'm doing it is because almost every single ASUS MOBO I've ever had runs incredibly hot on the MOSFET and NB. At first I thought I might just be unlucky with defective MOBO's, but it seems to be a common problem on ASUS boards.

First I put in small copper chipsinks to replace the stock ones. Tiny decreases in temps. Big copper chipsinks with fans. Even smaller marginal increases.

I swear it's some kind of plot by ASUS and Waterblock manafacturers to get people to buy their blocks. The only actual fitted waterblocks for chipsets I've found so far have been for ASUS boards. Concidence? I think not.
post #6 of 8
Quote:
Originally Posted by cooksta View Post

Honestly I wouldn't have bothered with the chipset cooler either, the only reason I'm doing it is because almost every single ASUS MOBO I've ever had runs incredibly hot on the MOSFET and NB. At first I thought I might just be unlucky with defective MOBO's, but it seems to be a common problem on ASUS boards.

First I put in small copper chipsinks to replace the stock ones. Tiny decreases in temps. Big copper chipsinks with fans. Even smaller marginal increases.

I swear it's some kind of plot by ASUS and Waterblock manafacturers to get people to buy their blocks. The only actual fitted waterblocks for chipsets I've found so far have been for ASUS boards. Concidence? I think not.

What motherboard you plan on using? My own RIII3 IOH runs pretty hot when OC's on the stock cooling (80-85c), but just cleaning the crappy TIM, applying some MX-4 and a bit more pressure lowered temps to 65-70c. Still, even with a WB i get temps of 55-60c on the ICH and IOH. My Mosfets do run quite cold though, only at 45-50c.

I would've stuck tiwh aircooling and adding a couple fans, but the block was pretty cheap, and it looks good, plus it saves me noise. I didn't really mind either way.
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X79 The Hydra
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post #7 of 8
Thread Starter 
Quote:
Originally Posted by Starbomba View Post

What motherboard you plan on using? My own RIII3 IOH runs pretty hot when OC's on the stock cooling (80-85c), but just cleaning the crappy TIM, applying some MX-4 and a bit more pressure lowered temps to 65-70c. Still, even with a WB i get temps of 55-60c on the ICH and IOH. My Mosfets do run quite cold though, only at 45-50c.

I would've stuck tiwh aircooling and adding a couple fans, but the block was pretty cheap, and it looks good, plus it saves me noise. I didn't really mind either way.

Going with a Rampage IV Extreme with a 3930K Sandy bridge.

Last ASUS board I had was a RII, the NB with stock cooler was running almost 85c at idle. During load it would jump to 90-95c.

RMA'ed the board, got a brand new one, same exact temps. Talked to ASUS support, they said to me that it's a typical operating temperature, no sweat.

I did exactly what you did, cleaned off the gunky TIM, cleaned and sanded the sinks to a mirror polish and only got a decrease of about 75c at idle. Replaced the sinks and finally got it down to 63c at idle.

I get the feeling it was more the X58 chipset more than ASUS's problem.
post #8 of 8
X58 wasn't a cold platform at all. Hell, the X58 IOH alone generates over 24w of heat, and the ICH does 4.5w. Considering the hottest chipsets Intel has released after that are only 6.7w (all the *77 and *75 series) and the very X79, you can't say x58 is a cold platform. You might blame the ton of PCI-E lanes though, no other chip gave as many as the X58 does. X79 has everything integrated into the CPU, so it's no longer another chip's fault.

Still, 80c+ temps are not normal. 60-70c may be normal though (it's about as hot as my old G41 chipset) but still, it's out of my comfort zone.

The RIVE may not run as hot once you change the TIM though. I really don't think ASUS added a fan on the PCH heatsink for nothing. The Mosfets may be another matter though, but due to the amount of them they may not run as hot. Plus it has more "free" cooling room, like the metal part on the left of the socket which isn't in contact with anything.

My RIIIE only had issues with the IOH, the mosfets were fairly cool @ 55c when on full load, and watercooling them only lowered the temps by 5c.
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X79 The Hydra
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