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Liquid Metal versus Non Metal Compounds..UPDATE!

post #1 of 26
Thread Starter 
Hi everyone,

I decided to make a shootout involving liquid metals like coollab liquid pro,ultra and phobya lm.I am gonna show you how non metal compounds perform on naked die. I'll post screenshots for now but i'll add thermal charts to the topic.



Test System

Maximus v gene
delidded 3570k at 4.5 ghz 1.2 V
2x4 gb corsair xms3 at 2133 mhz 10-12-11-30 1.55V
High power direct12 1 kw power supply
Stock cooler smile.gif (for easy application )

Methodology,

I have tested thermal compounds on cpu die. phobya lm applied between ihs and cooler surface each time.i applied exact same amount of tim both on die and inner ihs.i cleaned compounds with isopropyl alcohol and coollab metal cleaner. both ihs and cpu die was tim free =) i forgot to test idle temps but who cares i mean smile.gif come on guys it's all about load. biggrin.gif

Photos

CLU on die, phobya on IHS



Generic paste on ihs and tim print



Gelid GC Extreme on die



Gelid GC Extreme tim print



XSPC K2 on die



Results

Linx AVX 5 cycles and amount of 6026 mb memory,


Liqud Metals


Phobya LM ( Unknown W/mK ) 24 Celcius Case Temp, Max Temp 88 C



Coollaboratory Liquid PRO ( 32.6 W/mK ) 24.5 Celcius Case Temp, Max Temp 88 C



Coollaboratory Liquid ULTRA ( 38.2 W/mK ) 24 Celcius Case Temp, Max Temp 87 C




Non Metal Compounds


Generic Paste (1 W/mK ) 23 Celcius Case Temp, Max Temp 105+ C FAILED



XSPC K2 ( 4 W/mK ) 21 Celcius Case Temp, Max Temp 101 C



Gelid GC Extreme ( 8.5 W/mK ) 20.5 Celcius Case Temp, Max Temp 95 C




Conclusion

I'm very pleased with the results because it's nice to see all liquid metals shine on naked cpu die. CLP and Phobya are almost the same ( even the syringe and orange cap ) and they performed very well.CLU is the winner thanks to extreme thermal conductivity and i'll switch to CLU from now on ( i was the Phobya guy biggrin.gif )

The non metal compounds can not be match to liquid metals on naked cpu die. The reason is, cpu die area is the first step in heat flux chain. Heat must be dissipated immediately from the die therefore thermal compound must have high thermal conductivity and low thermal resistance.Gelid extreme is my favorite non metal compound but it's still no match to liquid metal however it outperformed generic paste and xspc k2. Gelid Extreme is reasonable if you don't have or afford liquid metal.

I hope ' Metal vs Non Metal compound ' discussion will end, cause still lots of users think they can reduce temps up to 25 C by using non metal compounds. If the chip has real contact problems or bad tim, you might gain 25 C but using a metal liquid will gain 25+ for sure. That's it guys. i hope you like the shootout. ( sorry for my English )

Thank you for time. See ya
Edited by I_shot - 3/30/13 at 4:36am
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post #2 of 26
Thanks.
+rep

What would be useful for a number of people is if you could try some other high end non liquid metal tims to see how they perform on the die. We keep saying liquid metal tims work best on the die, but showing it would be nice if possible.
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post #3 of 26
Yeah, phobya guy, do as j.a.o.m. said...rep+
post #4 of 26
Thread Starter 
Quote:
Originally Posted by justanoldman View Post

Thanks.
+rep

What would be useful for a number of people is if you could try some other high end non liquid metal tims to see how they perform on the die. We keep saying liquid metal tims work best on the die, but showing it would be nice if possible.

You are exactly right. I'll add my all time favorite tim gelid gc extreme on die and post results here.not only gelid i'll add xspc k2 and generic(1w/mk) paste too but i don't think they'll pass 4.5 ghz test smile.gif i wish i had more tim but they're all sold smile.gif
Edited by I_shot - 3/29/13 at 8:26am
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post #5 of 26
Thread Starter 
Quote:
Originally Posted by ivanlabrie View Post

Yeah, phobya guy, do as j.a.o.m. said...rep+

i'm glad you didn't forget phobya guy biggrin.gif i'll post results tonight
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post #6 of 26
Very nice!
Where is your case temperature monitored at?

Really wish reviewers would monitor temp of air going into cooler. mad.gif
At least you are monitoring temperature in case. wink.gif

The air temperature going into cooler is the only temperature that matters... and it needs to be monitored and recorded during the whole test. Every time intake temp goes up or down 1c the CPU temp with go up or down the same 1c.
post #7 of 26
Thread Starter 
Quote:
Originally Posted by doyll View Post

Very nice!
Where is your case temperature monitored at?

Really wish reviewers would monitor temp of air going into cooler. mad.gif
At least you are monitoring temperature in case. wink.gif

The air temperature going into cooler is the only temperature that matters... and it needs to be monitored and recorded during the whole test. Every time intake temp goes up or down 1c the CPU temp with go up or down the same 1c.

biggrin.gif Temp probe was 10 cm above the cooler thumb.gif
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post #8 of 26
Quote:
Originally Posted by I_shot View Post

biggrin.gif Temp probe was 10 cm above the cooler thumb.gif
thumbsupsmiley.pnggrouphug.gifband.gifapplaud.gif
post #9 of 26
Thread Starter 
haha biggrin.gifupsidedwnsmiley.gif
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post #10 of 26
You have PM.
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