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[xbitlabs] Intel’s New Extreme Processors Will Barely Improve Performance Significantly - Page 17

post #161 of 186
So they are shrinking the manufacturing proccess on that huge die and not adding any more coars!!?!? That is frustrating to say the least. I mean look at this thing


You would think they could atleast add 2 more coars in that die, or they don't need to be that huge anymore.

Lol and couldnt resist

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post #162 of 186
^^ There will be more cores with Ivytown (Ivy Bridge server) than Jaketown (Sandy Bridge server) in the higher end server chops. It's a business decision on Intel's part to only give consumers 6 cores.
post #163 of 186
Quote:
Originally Posted by Acefire View Post

So they are shrinking the manufacturing proccess on that huge die and not adding any more coars!!?!? That is frustrating to say the least. I mean look at this thing


You would think they could atleast add 2 more coars in that die, or they don't need to be that huge anymore.

Lol and couldnt resist


And I know why.
LGA2011 has 2,011 contacts(or pins) on it, LGA1366 has 1,366 and LGA1155 has 1,155. So that's why it is bigger.
Nevertheless, I'm pretty disappointed with Intel, keeping their Extreme processors with 6 cores maximum, though I would be hoping for 8 when Haswell-E comes out, sooner or later.
post #164 of 186
Its that big because all the pins are needed. Quad channel memory, more PCI-E lanes etc.
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post #165 of 186
My point is that its the same size with same number of cores even though they are using a smaller process. I was trying to be ironic. Next you will tell me a 24 pin connector has to be that big because it has 24 pins to connector.
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post #166 of 186
I think when he made the "Why u so big" reference... it was a rhetorical question and not really prompting for an answer..
post #167 of 186
Quote:
Originally Posted by victini91 View Post

And I know why.
LGA2011 has 2,011 contacts(or pins) on it, LGA1366 has 1,366 and LGA1155 has 1,155. So that's why it is bigger.

tumblr_mejnpu26Rm1rqfhi2o1_500.gif



In all seriousness, the real discussion is why does it need so many pins... not in why it's so big.
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post #168 of 186
Quote:
Originally Posted by Acefire View Post

So they are shrinking the manufacturing proccess on that huge die and not adding any more coars!!?!?

The die is under the IHS and is much smaller than the substrate or IHS.
Quote:
Originally Posted by Acefire View Post

You would think they could atleast add 2 more coars in that die, or they don't need to be that huge anymore.

SB-E (and probably IB-E) hex cores are native 8 core parts, with two disabled.
Quote:
Originally Posted by Acefire View Post

My point is that its the same size with same number of cores even though they are using a smaller process. I was trying to be ironic. Next you will tell me a 24 pin connector has to be that big because it has 24 pins to connector.

The die is not going to be the same size, it's getting smaller (this is the main motivation of die shrinks, to make more parts per wafer, and sell them at the same price, to make more money). The packaging needs to remain the same size to fit in the same socket, have the same I/O, and support the same cooling.
Quote:
Originally Posted by MediaRocker View Post

In all seriousness, the real discussion is why does it need so many pins... not in why it's so big.

The argument wasn't about how many pins it needs. It was about how much extra room there is on the package for a larger die. You could easily fit 24 Ivy cores and 64MiB of L3 under the LGA-2011 IHS. Of course there is no reason to build such a thing.

The question about why it needs so many pins has been answered by driftingforlife. LGA-2011 has a huge amount of I/O, so needs a lot of pins. Four memory channels, 40 PCI-E lanes, a DMI bus, two QPI interconnects...not to mention all the ground and power pins to reliably support CPUs with TDPs ranging to 150w.
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post #169 of 186
Quote:
Originally Posted by Blameless View Post

The argument wasn't about how many pins it needs. It was about how much extra room there is on the package for a larger die. You could easily fit 24 Ivy cores and 64MiB of L3 under the LGA-2011 IHS. Of course there is no reason to build such a thing.

The question about why it needs so many pins has been answered by driftingforlife. LGA-2011 has a huge amount of I/O, so needs a lot of pins. Four memory channels, 40 PCI-E lanes, a DMI bus, two QPI interconnects...not to mention all the ground and power pins to reliably support CPUs with TDPs ranging to 150w.

I think you mistook my post as me posing a question.

I was not. Homeskillet up there was thinking we were wondering why it was so big, and thought the correct answer was because of the large amount of pins. You know that it has a large amount of I/O. I know that. Just about everyone with the slightest bit of common sense knows that.

My line of thought was that the die is so small because if they were to utilize more space on the package, with the large amount of information being handled, it would require even more pins to support the data throughput. Hence why I threw out my misunderstood comment on the number of pins. Sorry for not being any clearer.
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post #170 of 186
Quote:
Originally Posted by Acefire View Post

So they are shrinking the manufacturing proccess on that huge die and not adding any more coars!!?!? That is frustrating to say the least. I mean look at this thing


You would think they could atleast add 2 more coars in that die, or they don't need to be that huge anymore.

Lol and couldnt resist


Aye aye aye, me no gusta
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