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Delid question - Page 2

post #11 of 22
Quote:
Originally Posted by dr/owned View Post

The die is only .5mm thick so the IHS with no glue means no gap. It's precision stuff so it should fit together perfectly. The glue is comparatively thick at .2mm, pushinsg the IHS up to .7mm which is more than is needed to make contact with the die.

I think the precise gap with no glue is around .46mm, which is why one of the users here has an avatar pic with the IHS spinning around, indicating that the die pushes up a tiny bit into the IHS....which is good since you want lots of contact pressure. Heck I have my waterblock directly putting a lot of force into the die and it's ok.

Tadaaa ...LOL biggrin.gif

no gap if you remove the adhesive, and thats what you want to have, like dr/owned says wink.gif
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post #12 of 22
Quote:
Originally Posted by t45457523 View Post

why would the gap cause the temperatures to go up?

The gap would mean the core doesn't make good contact with the IHS, which would affect the cooling.
post #13 of 22
Thread Starter 
Quote:
Originally Posted by Forceman View Post

The gap would mean the core doesn't make good contact with the IHS, which would affect the cooling.

This entire time i have been talking about a gab between the IHS and the PCB. a gab created because the IHS is sitting on the cores.

The concern is that this gab between the IHS and the PCB, when compressed by the socket bracket, would scratch the PCB.
post #14 of 22
I doubt it would scratch the PCB. If you're concerned, you can use a piece of paper as a glue-substitute for protection. The paper in front of me is .07mm thick. Better than glue (.2mm), but not as good as no glue.
post #15 of 22
Thread Starter 
Quote:
Originally Posted by dr/owned View Post

I doubt it would scratch the PCB. If you're concerned, you can use a piece of paper as a glue-substitute for protection. The paper in front of me is .07mm thick. Better than glue (.2mm), but not as good as no glue.


1: what way should i secure the paper if at all?
2: How on earth are you measuring these things.
post #16 of 22
Don't bother with the paper. I taken my delided chip out at least 20 times with zero issues.


I have a Digital Caliper to measure small gaps.
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post #17 of 22
Quote:
Originally Posted by dr/owned View Post

Between die and IHS, yes use CLU. Between IHS and heatsink or waterblock, I wouldn't. Per http://benchmarkreviews.com/index.php?option=com_content&task=view&id=150&Itemid=62&limit=1&limitstart=11

CLP (similar to CLU), standard pastes performed better. I use the GC Electronics paste because it outclassed a ton of more expensive pastes and only costs:



for a huge tube that'll do a thousand heatsinks.

Someone can jump in, but I believe you need to modify the mount of the H100 to get it to make contact with the die directly. Some blocks/heatsinks are setup to be limited by standoffs in how far they go down.
I got 25 g of thermal paste for $8
post #18 of 22
Thread Starter 
Quote:
Originally Posted by honam1021 View Post

I got 25 g of thermal paste for $8
I bought 200 grams of coolermaster icefusion for the low end PC's i repair for clients. Cost me $20
post #19 of 22
Quote:
Originally Posted by t45457523 View Post

2: How on earth are you measuring these things.
Surely you realize the type of people to do this sort of thing must have some nifty tools laying around right?

xD
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post #20 of 22
Thread Starter 
Quote:
Originally Posted by Masta Squidge View Post

Surely you realize the type of people to do this sort of thing must have some nifty tools laying around right?

xD

I have a ruler. A tape measure. And a yard stick. This is how i measure things.
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