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[ChinaDIY] Intel Core i7 4770k "review" - Page 29

post #281 of 298
Quote:
Originally Posted by Alatar View Post

Intel should just sell the K series chips without the heatsink. Just like they do with the SB-E CPUs.

They can't common customers would yell loudly. They expect CPU ready to install including Intel certified heatsink. Imagine the problem when users would install fluffy heatsinks and burn their CPUs.
post #282 of 298
Quote:
Originally Posted by malmental View Post

Intel should put a FEW more dollars into the OEM heatsink.
yes I know most get aftermarket cooling but the OEM heatsink just seems so effin' cheap.

just saying, it bothers me.. tongue.gif

I'd love to spend five minutes alone with the person that thought up the mounting...it is really annoying when you get an aftermarket cooler and it uses the same dumb two plastic wedges with a plastic shaft that is forced between them. I typically drill through the plastic if I can and just put a screw in there, but on the stock heat sink you can't do that.
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post #283 of 298
Quote:
Originally Posted by Vagrant Storm View Post

Quote:
Originally Posted by malmental View Post

Intel should put a FEW more dollars into the OEM heatsink.
yes I know most get aftermarket cooling but the OEM heatsink just seems so effin' cheap.

just saying, it bothers me.. tongue.gif

I'd love to spend five minutes alone with the person that thought up the mounting...it is really annoying when you get an aftermarket cooler and it uses the same dumb two plastic wedges with a plastic shaft that is forced between them. I typically drill through the plastic if I can and just put a screw in there, but on the stock heat sink you can't do that.
+1 to that bro... thumb.gif
post #284 of 298
Quote:
Originally Posted by Vagrant Storm View Post

I'd love to spend five minutes alone with the person that thought up the mounting...it is really annoying when you get an aftermarket cooler and it uses the same dumb two plastic wedges with a plastic shaft that is forced between them. I typically drill through the plastic if I can and just put a screw in there, but on the stock heat sink you can't do that.
post #285 of 298
lulz...
post #286 of 298
Quote:
Originally Posted by zinfinion View Post

It's killing it in the reviews, and my case is menh for water, so air it is.
Conroe --> Sandy two years ago was drool.gif

Try going from M2 to K7. (That's a Cyrix 6x86 PR150, clocked at 133Mhz to a 2Ghz Athlon XP.)

Even though the GPU in my Athlon was a VIA Integrated chip, it was still faster than what I had before. tongue.gif
Quote:
Originally Posted by Forceman View Post

Based on a couple of pre-release leaked benchmarks using who knows what BIOSes.  At least wait for a larger sample size before declaring Haswell a failure.

Exactly, I'm taking this with a grain of salt.
Quote:
Originally Posted by sdlvx View Post

it's brought us back to where we were with SB.

With the additional ~5-10% IPC increase we got from IB + whatever gains we end up seeing from it. (I severely doubt that these are indicative of what final performance will look like.)

4.5Ghz vs 5Ghz is a 11% increase, too.
Quote:
Originally Posted by 2010rig View Post

eek.gif

That changes my outlook a bit, 4.5 on the stock cooler is impressive. The test settings were in Chinese, so I just skipped over that page.

Can't wait to see what it does with an NH-D14 or something similar.

So, for the 5.1 result, that was with the stock cooler also?


Makes sense, it is meant to be an OCing monster.
Quote:
Originally Posted by Stay Puft View Post

Yeah 5.1 on the stock cooler? Then 5.5 should be easy with my water setup. I dont know what to believe now

5.5 might not be easy if it hits a voltage wall before a thermal wall even on air.
Quote:
Originally Posted by Forceman View Post

Just like Bulldozer was and Haswell is? Let's not brag about unreleased chips, mmmmkay?

There's a difference though, much like with HD4000 vs HD4600 its a guaranteed increase...Plus in this case, any FX owner can disable CMT and see the 10-40% gains depending on the program, most of that comes from the schedulers too if I've read my Anand right.
    
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post #287 of 298
Quote:
Originally Posted by Brutuz View Post

Makes sense, it is meant to be an OCing monster.

That's based on what? 3D transistors were made to reduce leaks at low voltage, when someone uses higher voltage than designed, it uses nearly as much power as Sandy bridge.
Curves, I seen, converge at about 5 GHz. I doubt 22 nm CPU would be happy to use the same Watts as 32 nm CPU. 3D transistors are great for low voltage low speed, things go quite badly when you try high speed, and higher voltage.
post #288 of 298
He's anyone here thought about the die size and the effects of it?

Die size: Sandy Bridge > Haswell > Ivy Bridge

Ivy Bridge went down 26% from SB but now it is going up 13% again. Meaning that the dissipated heat at the top of the die is transferred via a larger area – compared to IB. Still the same PTIM instead of STIM, but every little bit of improvement helps us to get the heat to our cooler. This may also explain, in part, why you get a better OC on air with Haswell simply because the die transfers the heat slightly better. Makes sense, right?
post #289 of 298
Quote:

 

ORiginally posted by Pike

 

He's anyone here thought about the die size and the effects of it?

Die size: Sandy Bridge > Haswell > Ivy Bridge

Ivy Bridge went down 26% from SB but now it is going up 13% again. Meaning that the dissipated heat at the top of the die is transferred via a larger area – compared to IB. Still the same PTIM instead of STIM, but every little bit of improvement helps us to get the heat to our cooler. This may also explain, in part, why you get a better OC on air with Haswell simply because the die transfers the heat slightly better. Makes sense, right?

Isn't all that extra area just the increased size of the iGPU though?  I think it might help some, but the thermal density of the actual cores should be the same, right?

post #290 of 298
Quote:
Originally Posted by Pike View Post

He's anyone here thought about the die size and the effects of it?

Die size: Sandy Bridge > Haswell > Ivy Bridge

Ivy Bridge went down 26% from SB but now it is going up 13% again. Meaning that the dissipated heat at the top of the die is transferred via a larger area – compared to IB. Still the same PTIM instead of STIM, but every little bit of improvement helps us to get the heat to our cooler. This may also explain, in part, why you get a better OC on air with Haswell simply because the die transfers the heat slightly better. Makes sense, right?

I highly doubt they increased the die size for the sake of improving heat transfer...
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