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Proof that Intel most likely using TIM again with Haswell IHS. - Page 3

post #21 of 30
Well, this is depressing. I don't really want to do anything to my CPU involving a hammer, so I'll probably be skipping this generation of chips.
post #22 of 30
Thread Starter 


Unrelated but here is a Cinebench of the 4770
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post #23 of 30
This is something of a nitpick, but solder is TIM (thermal interface material) too. Not using TIM would imply there was nothing between the die and IHS, which would be very bad, obviously.

Saying they aren't using solder, or that they are likely using a non-metalic paste/putty/gap filler would be more correct.
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post #24 of 30
Quote:
Originally Posted by 47 Knucklehead View Post

Maybe they are using Cooler Laboratory TIM this time? rolleyes.gif

(One can hope.)

People have frozen 4770k & the chip lived, can't do that with liquid metal TIM so no hope there...
Quote:
Originally Posted by Tjj226 Angel View Post

SCREW YOU INTEL!!!!!!!!!!!!!!!!

This is just total nonsense. This is the one thing the AMD fan boys have right and that is that intel simply does not care about their customer base. They are all about making money.

Pretty sure it was something with the fluxless solder not working with the new 3d transistors when Ivy released, not just about intel being cheap & saving money.
Quote:
Originally Posted by svenge View Post

Any official word on RAM voltages? Or is Intel sticking with the same old 1.5v ± 5% official spec that hasn't been updated in forever...

Probably the same as with Sandy & Ivy, 1.5V for those scared of voltages, 1.65 - 1.75 fine for regular use, more yet for the brave.
    
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post #25 of 30
Quote:
Originally Posted by Tjj226 Angel View Post

SCREW YOU INTEL!!!!!!!!!!!!!!!!

This is just total nonsense. This is the one thing the AMD fan boys have right and that is that intel simply does not care about their customer base. They are all about making money.

This statement is nonsense if you believe the cost of solder vs some other thermal compound had anything to do with the decision. They don't make design decisions because of a difference of a few cents / CPU in manufacturing costs.
post #26 of 30
meh theres always this biggrin.gif

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post #27 of 30
Havent we known this for ages?
post #28 of 30
Quote:
Originally Posted by Blameless View Post

This is something of a nitpick, but solder is TIM (thermal interface material) too. Not using TIM would imply there was nothing between the die and IHS, which would be very bad, obviously.

Saying they aren't using solder, or that they are likely using a non-metalic paste/putty/gap filler would be more correct.

This.

It literally took reading a handful of posts in this thread to determine what OP meant by "TIM'. Solder is a type of thermal interface material - TIM.
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post #29 of 30
We can always go back to mounting heatsinks directly to the die and use shims to make sure too much pressure isn't applied to any one corner of it, like they do with GPUs.
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post #30 of 30
Quote:
Originally Posted by Jayjr1105 View Post

It does look like the IPC is going to be really good. The GFlops from IBT are over 100 @ 3.6 GHz. My 3770K only gets to about 107 GFlops @ 4.7!

What is up w/ 3770k getting low Gigaflops? My 3570k w/ RAM at 2000 MHz is posting 119 Gflops @ 4.4 GHz
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