Originally Posted by metalmodman
no thank you I don't like water cooling I have my own reasons just wondering with a titan heatsink do you think it has enough surface to take advantage of 150+ cfm?
Honestly, I don't think that ANY air heatsink available has the heat transferring capabilities to use more than a 110CFM fan. I realise that I'm using an odd comparison but I think you're smart enough to see the relavance.
Even my 2x120 rad/tdx on a 3.7GHz E6600/maze4 on a 766Mhz 1900XTX doesn't show anymore than a 1-2C difference AT LOAD with two 100+CFM fans at full blast or half way on my fan controller.
Beyond that, I really think the limiting factor becomes not the amoutn of surface areas versus airflow but the limit of how fast heat will be pulled off the CPU. If you think about it. You really only have a TINY contact patch between the die and the IHS (or die to HSF on the off chance of you having popped the lid on your chip). Once you reach a point with the heat removal above it becomes how fast heat can transfer through that contact patch to the HS to be carried away by air.
There are really only a few ways to improve this heat transfer speed. A greater delta T between the HS and the chip. In other words lower ambients (or increasing chip temp which is counterproductive and also directly translates as to why infficient heat transfer leads to higher equilibrium temps) are needed. Another way is to decreasing the HS's tendancy to resist the movement of heat through it or, in other words, using silver instead of copper because heat travels through it faster. One last one is to increase the surface area of contact... which is pretty much impossible and a non-issue. (I.E. a core size is a core size)