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post #31 of 41
I think its cool that he tries to come up with his own way to cool his cpu you have to start some where no one is born a genius and not every one has money. I think its an interesting idea good luck!
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post #32 of 41
plz jsut go phaze cooling : /
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post #33 of 41
lol - he's looking to scavenge a high CFM part for free and you recommend a $500+ solution
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post #34 of 41
I don't think that was the point the thread name is "Cooling Experiments" if your just trolling please go to another thread like the xbox vs ps2.
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post #35 of 41
Quote:
Originally Posted by metalmodman View Post
no thank you I don't like water cooling I have my own reasons just wondering with a titan heatsink do you think it has enough surface to take advantage of 150+ cfm?
Honestly, I don't think that ANY air heatsink available has the heat transferring capabilities to use more than a 110CFM fan. I realise that I'm using an odd comparison but I think you're smart enough to see the relavance.

Even my 2x120 rad/tdx on a 3.7GHz E6600/maze4 on a 766Mhz 1900XTX doesn't show anymore than a 1-2C difference AT LOAD with two 100+CFM fans at full blast or half way on my fan controller.

Beyond that, I really think the limiting factor becomes not the amoutn of surface areas versus airflow but the limit of how fast heat will be pulled off the CPU. If you think about it. You really only have a TINY contact patch between the die and the IHS (or die to HSF on the off chance of you having popped the lid on your chip). Once you reach a point with the heat removal above it becomes how fast heat can transfer through that contact patch to the HS to be carried away by air.

There are really only a few ways to improve this heat transfer speed. A greater delta T between the HS and the chip. In other words lower ambients (or increasing chip temp which is counterproductive and also directly translates as to why infficient heat transfer leads to higher equilibrium temps) are needed. Another way is to decreasing the HS's tendancy to resist the movement of heat through it or, in other words, using silver instead of copper because heat travels through it faster. One last one is to increase the surface area of contact... which is pretty much impossible and a non-issue. (I.E. a core size is a core size)
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post #36 of 41
let me also add this quote from NoL's TEC Guide: Guide 1 Basic Principles of TEC's


"""A peltier produces quite a load of heat. It can be calculated as the wattage output of the peltier plus the wattage output of the item being cooled. So a 320 watt peltier chilling a 100 watt cpu will produce 420 watts of heat to the hot side that needs to be removed.

I will say that in almost no form is air cooling sufficient for a peltier system. Under 50 watts if your cooling ram with a Tec, but otherwise it is not sufficient. Water-cooling is required. Again, read Maxxx Racer’s guide to learn more.

I will also advise that starting a Tec/Peltier system with no prior water-cooling experience can be a devastating experience; do not attempt a peltier system unless you are comfortable with water!"""

So there you have it..
post #37 of 41
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post #38 of 41
Put that mega blower on a rheostat/rhoebus and then see what kind of ratio you can get (CFM/dB)
post #39 of 41
Quote:
Originally Posted by metalmodman View Post
key number is 50watts.

Just like the guide said maybe 50watts or lower but that’s it. I dono how much cooling power your going to get with 50watts from a palter but I bet its not a lot. That cooler shows you about the size you need for 50w so I can't imagin 100-300w.

computers are typically a vicious loop. You add or change one thing and end up change 2 or 3 others for it to work properly..
post #40 of 41
thanks for the info DigitrevX! There is always a way I think I might I have some thing with enough surface!
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