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[Anand] The Xbox One: Hardware Analysis & Comparison to PlayStation 4 - Page 25

post #241 of 249
Quote:
Originally Posted by Blameless View Post

To be fair, a lot of the original NESes have problems with the cartridge loading mechanism and contacts.

That said, many things do seem to be designed to fail nowadays, usually shortly after warranty periods expire.

There is no problem with the original NES... the blowing on the catridge and inserting into the system is part of the fun! thumb.gif
post #242 of 249
Quote:
Originally Posted by maarten12100 View Post

you mean YLOD or RLOD once it dies completely.
The fat models did actually have a ridiculous failure rate.
Yes they did! I paid $150 for the first repair shortly after my one year ran out. My new refurb ps3 did the same and I told Sony where to go when they wanted another $150. I contacted the Better Business Bureau and Sony called me asking if I would please send my old unit in for a free replacement yessir.gif Microsoft was great about free repairs.
Edited by BlindShot - 5/30/13 at 1:29am
    
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post #243 of 249
Quote:
Originally Posted by maarten12100 View Post

older consoles output little heat, use solid loading devices, and use almost no power while still having the same size.
Those consoles can't be compared to the current powerhogs xbox360 and ps3 that is after the PS2 which was 45W they were like lets put in all this crap in a tiny box. (the principle of some HP laptops especially on cooling front)

I have a vacuum tube CB radio that hasn't been opened in about 50 years that still works fine. It uses more power than an XBox 360, while taking up only marginally more space, and being completely passively cooled (pretty sure I could cook breakfast on it once it's been on a while).

Even if we look at modern electronics, I have formerly high-end laptops that are 10 years old that work perfectly fine, and will probably work fine 10 years from now, (minus the batteries and possibly HDDs).

The last generation of consoles, especially the original few revisions of the XBox 360 are of substandard quality/longevity.
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post #244 of 249
Quote:
Originally Posted by PostalTwinkie View Post

I love how people rate console life span in a handful of years now....

"My Xbox is going strong after 3 years...."

My NES, which my father purchased in October 1985 (The month and year of release) still works.....

I need to get a new CD Drive for my PS1, it's a launch model (Complete with the awesome audio CD quality) and the plastic tray makes it skip on FMV.
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post #245 of 249
Quote:
Originally Posted by Blameless View Post

I have a vacuum tube CB radio that hasn't been opened in about 50 years that still works fine. It uses more power than an XBox 360, while taking up only marginally more space, and being completely passively cooled (pretty sure I could cook breakfast on it once it's been on a while).

Even if we look at modern electronics, I have formerly high-end laptops that are 10 years old that work perfectly fine, and will probably work fine 10 years from now, (minus the batteries and possibly HDDs).

The last generation of consoles, especially the original few revisions of the XBox 360 are of substandard quality/longevity.
the heat isn't in traces or chips there.
You cannot compare those 2 differ.
post #246 of 249
Quote:
Originally Posted by maarten12100 View Post

the heat isn't in traces or chips there.
You cannot compare those 2 differ.

There aren't any PCB traces or chips in a CB radio from the early 1960s, but that's completely beside the point, and the comparison is still valid.

The XBox 360 had a high failure rate because it had localized heat issues. It had localized heat issues because it had iffy QA, along with an ill conceived heatsink and ventilation setup for the energy it needed to dissipate.

It wasn't the ICs or traces that were failing in most of these dying XBox 360s, it was solder joints. Brittle lead-free solder was used and excessive localized heating was warping the mainboard PCB causing joints to break.
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post #247 of 249
Quote:
Originally Posted by Blameless View Post

There aren't any PCB traces or chips in a CB radio from the early 1960s, but that's completely beside the point, and the comparison is still valid.

The XBox 360 had a high failure rate because it had localized heat issues. It had localized heat issues because it had iffy QA, along with an ill conceived heatsink and ventilation setup for the energy it needed to dissipate.

It wasn't the ICs or traces that were failing in most of these dying XBox 360s, it was solder joints. Brittle lead-free solder was used and excessive localized heating was warping the mainboard PCB causing joints to break.
I also meant solder joints tbh.
So you agree about the inferior build/design quality of todays consoles yet you disagree that it is more likely to happen in consoles that use more energy/produce more heat.
Yes it can be fixed with a better heatsink but if they made it with no overhead again or crappy heat paste it will go down just like it did before (they are less likely though as they only have to cool a single chip this time instead of 2 which will allow for a easier cooler design even though there is less surface area)
post #248 of 249
Quote:
Originally Posted by maarten12100 View Post

So you agree about the inferior build/design quality of todays consoles yet you disagree that it is more likely to happen in consoles that use more energy/produce more heat.

I'm saying that quality products take these things into account and are built with sufficient care and margins.

The original Xbox 360 was a piece of garbage, not because it produced a lot of heat, but because it wasn't designed to remove that heat efficiently, or cope with what it could not remove, plus what design considerations there were often had poor execution (heatsinks with no TIM underneath them, the wrong kind of solder, etc).
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post #249 of 249
Quote:
Originally Posted by Blameless View Post

It wasn't the ICs or traces that were failing in most of these dying XBox 360s, it was solder joints. Brittle lead-free solder was used and excessive localized heating was warping the mainboard PCB causing joints to break.

ROHS destroyed solder quality, yet most companies reformulated and refused to use brittle low quality solder. Microsoft was aware that the combination of a poor IHS and their solder was causing issues, and refused to fix it until they released a completely new hardware design. As you say, it had nothing to do with how much power the system was using, and more to do with poor design and QA testing.
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