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Best way to apply TIM on 3770K

post #1 of 25
Thread Starter 
Hello everyone!

As title suggest, I am wondering about whats the best way to apply TIM on the 3770K?
I have used some dots in the middle and let it spread out by the block with pressure.
I know some use a cross pattern, stripe and so on. So what is the absolute best for the 3770K? As this is different for all cpu architectures usually.

Right now I am using Cêramique 2 as my TIM.

Share what you know or what you personally do smile.gif

Thanks
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post #2 of 25
The best way to spread tim is to place a pea sized bead in the center. Make sure when you apply the cooler that you applied it evenly (i.e. don't screw one side all the way down at a time).
post #3 of 25
Quote:
Originally Posted by TheLawIX View Post

The best way to spread tim is to place a pea sized bead in the center. Make sure when you apply the cooler that you applied it evenly (i.e. don't screw one side all the way down at a time).
Only way.

Well, a line or an X has it's merits, but the pea sized drop is the best way to do it. Anything other than these three methods is guaranteed air bubbles.
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post #4 of 25
everyone uses their methd, there is no "the best one"

i put some on the cpu (cleaned surface), using something similiar to a credit card i put it all the past over the cpu, being carefull of how much paste there is, so when you put the coolerm the paste don´t go to the mobo
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post #5 of 25
Pea method is mine and most others' preferred choice, you'd be safest with that!

Again, tighten down evenly: 3 screwdriver turns on a screw, then move to the opposite corner...or something along those lines.
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post #6 of 25
Quote:
Originally Posted by sixor View Post

everyone uses their methd, there is no "the best one"

i put some on the cpu (cleaned surface), using something similiar to a credit card i put it all the past over the cpu, being carefull of how much paste there is, so when you put the coolerm the paste don´t go to the mobo

Think what you want but there's a reason why TIM manufacturers say to only use the bead method.
post #7 of 25
i tin it.
basically i add a rice grain dot of TIM in the middle.
Then i spread it with a credit card.
Then with a lint free cloth i rub the TIM off (no alcohol)
This leaves TIM in the tiny crevices on the IHS.
Then again place a rice grain blob in the middle and let the cooler spread it.
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post #8 of 25
Whichever method allows you to get the paste on there and not get air bubbles in the paste is the "best" way. For most applications, this means using the dot method. The amount will vary depending on the CPU, but in the case of Ivy and Sandy, you want something a little bigger than a grain of rice. Apply it, take it off and verify that it's applied nicely and clean it off and use the same amount again. Sure, it's a "waste" of paste but at least then you know what the correct amount should be. This method is best for any cooler with a flat base.
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post #9 of 25
Quote:
Originally Posted by sixor View Post

everyone uses their methd, there is no "the best one"

i put some on the cpu (cleaned surface), using something similiar to a credit card i put it all the past over the cpu, being carefull of how much paste there is, so when you put the coolerm the paste don´t go to the mobo
Yes, there is "the best way". Using a credit card leaves gobs of air bubbles. Not to mention you don't even need TIM to cover the entire heat shield.
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