I have heard that these are one of the best if not the best IHS to HS base interface. I have also heard that these are actual metal liquid that makes really great heat transfer between the die and the IHS for those who delid their chips successfully however the really freakish part is where some discovered that this liquid metal stuff actually dissolves the IHS and I think corners of the die too to achieve such performance (making the HS base and die appear as one entity to heat) but still maintains great temps. So who has this kind of an experience with either?
post #1 of 14
5/27/13 at 1:27pm